JPH04130641A - Measuring device for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the deformation of a contact and a lead and improve measurement yield by vertically moving the elastic plane-shaped contact and bringing the tip of the contact into contact with the lead rising part of a semiconductor device. CONSTITUTION:A semiconductor device 1 to be measured is carried to an inspecting position on a rail 2. When it is confirmed that the device 1 is carried to the inspecting position, a vertically driving part 5 is operated and a holding block 4 is brought down. Thus, the tip of the contact 3 held by the holding block 4 is brought into contact with the lead rising part 8 of the semiconductor device 1 to be measured and the lead 7 of the semiconductor device 1 to be measured is electrically connected with the contact 3. At such time, the tip of the contact 3 is always rubbed by the lead rising part 8, which allows self- cleaning that cleans the contamination at the tip. Under such condition, the semiconductor device 1 to be measured is inspected through an inspecting board 6 by a tester.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a measuring device for a Z[' type semiconductor device, in particular, in the testing process of semiconductor devices such as ICs and transistors.

[Conventional technology]

In recent years, ZIP has become a popular package type for semiconductor devices.
(Zigzag-In-Line-Package) is widely used. This means that the thickness of the ZIP is DI
This is because it is smaller than the thickness of P (Dual-In-Line Package) and has excellent mounting performance. The measuring equipment that measures this ZIP type semiconductor device includes:
Commercially available sockets are used because of the unique shape of the leads.

Such a conventional ZIP type semiconductor device measuring device will be described with reference to FIGS. 5 and 6.

FIG. 5 is a conceptual diagram showing the configuration of a conventional semiconductor device measuring device, and FIG. 6 is a side sectional view showing the configuration of the same semiconductor device measuring device.

In FIGS. 5 and 6, 1 is a ZIP type semiconductor device under test, 7° is a lead of the semiconductor device under test 1, and 8 is a lead of the semiconductor device under test 1.
' is a lead mounting part for mounting the semiconductor device under test l, 15 is a supply rail for transporting the semiconductor device under test l to the inspection machine, and 16 is a movement for holding and moving the semiconductor device under test 1. Rail, 17 is moving rail 1
18 is a socket for inserting the lead 7° of the semiconductor device under test 1, and 19 is a contact that comes into contact with the lead mounting portion 8° of the semiconductor device under test l. provided. Reference numeral 6 denotes an inspection board having a hardware function in the inspection process, and the inspection board 6 and the contact 19 in the socket 18 are electrically connected. Further, reference numeral 20 denotes a storage rail for transporting the semiconductor device to be measured l after the inspection has been completed.

A conventional ZIV type semiconductor device measuring device configured as described above will be described below.

First, when the inspection machine is started, the semiconductor device 1 to be measured is transported on the supply rail 15 .

Next, when it is confirmed that the semiconductor device under test 1 has been transported to the inspection position on the moving rail 16, the moving section 17 is activated and the semiconductor device under test l on the moving rail 16 is transported to the position of the socket 18. (in the direction of the arrow), the lead mounting portion 8° of the semiconductor device under test l is inserted into the socket 18 as shown in FIG. be done. That is, the leads 7 of the semiconductor device to be measured 1 and the contacts 19 are electrically connected.

Next, when it is confirmed that the lead mounting portion 8' of the semiconductor device under test 1 has been inserted into the socket 18, a test is started by a tester (not shown) via the test board.

After the inspection is completed, the moving section 17 is operated again, and the semiconductor device to be measured l and the moving rail 16 are returned to their original positions. Then, the semiconductor device to be measured l and the moving rail 1
After confirming that the test device 6 has returned to its original position, the semiconductor device under test l that has been inspected is transported by the storage rail 20.
The uninspected semiconductor device on the supply rail 15 is on the moving rail 1.
6, and the above-mentioned operations are repeated, thereby sequentially repeating the measurement.

[Problem to be solved by the invention]

However, in the conventional semiconductor device measuring device configured in this way, the lead mounting portion 8° of the semiconductor device under test 1 is
is inserted into the socket 18 and brought into contact with the contact 19 provided in the socket 18 to electrically connect the lead 7° of the semiconductor device under test l and the contact 19. 7 is easily deformed and causes poor appearance.

In addition, in order to prevent such deformation of lead 7,
There is a problem in that the measurement yield decreases when the speed of insertion of the lead into the socket 18 is lowered, or when the contact pressure between the contact 19 and the lead mounting portion 8 is lowered. Also, when inserting the lead 7 into the socket 18, the lead mounting part 8
Since the lead mounting portion 8° is rubbed by the contact 19 in the socket 18, there is a problem in that the lead mounting portion 8° is scratched and the plating peels off, resulting in poor mounting. Furthermore, since the contacts 19 within the socket 18 are easily contaminated and deformed, there is a problem in that the service life is short and the total cost is therefore high.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a low-cost semiconductor device measurement device that improves the measurement yield by preventing deformation of contacts and leads.

(Means for Solving the Problem) A semiconductor device measuring device according to claim (1) includes a resilient plate-shaped contact, a holding block that holds the contact, and a structure in which the contact is held in the vertical direction. The contactor is provided with a vertical drive means for moving the contactor downward, and the tip of the contactor is brought into contact with a lead rising portion of a semiconductor device.

The measuring device for a semiconductor device according to claim (2) includes a resilient plate-like contact whose tip portion has an uneven shape to match the shape of the lead of the semiconductor device, and a holder for holding the contact. a block, a lead receiving part having an unevenness opposite to the uneven tip of the contact, a first vertical drive means for moving the contact in the vertical direction, and a second vertical drive for moving the lead receiving part in the vertical direction. means, the contactor is moved downward by the first vertical driving means and the lead receiving part is moved upward by the second vertical driving means, so that the tip of the contactor comes into contact with the lead mounting part of the semiconductor device. It was designed to let you do so.

[Effect]

According to the configuration described in claim (1), the elastic plate-shaped contact held by the holding block is moved downward by the vertical drive means, and the elastic contact is moved to the lead rising portion of the semiconductor device. The lead of the semiconductor device to be measured and the contactor are electrically connected by contacting the contactor with the lead of the semiconductor device to be measured. As a result, there is no need for a conventional socket that matches the shape of the lead, and even if a relatively large force is applied to the lead by the contact, the contact and the lead do not deform, and the lead mounting area is free from scratches and peeling of plating. It will no longer occur.

According to the configuration described in claim (2), a resilient plate-shaped contact whose tip portion has an uneven shape in accordance with the shape of a lead of a semiconductor device is held in a holding block, and the first vertical drive The contact element is moved downward by the means, and the lead receiving part, which has an unevenness opposite to the tip of the contact element, is moved upward by the second vertical driving means. Make contact with a certain contact to make an electrical connection. As a result, there is no need for a conventional socket that matches the shape of the lead, and even if a relatively large force is applied to the lead by the contact, the contact and the lead do not deform, and the lead mounting area is free from scratches and peeling of plating. It never occurs.

Further, in the process of resin-sealing a semiconductor device, the semiconductor device can be measured without being affected even if resin flakes occur on the leads, and the measurement yield can be improved.

〔Example〕

An embodiment of the present invention will be described based on FIGS. 1 to 4.

FIG. 1 is a conceptual diagram showing a measuring device for a semiconductor device according to a first embodiment of the present invention, FIG. 2 (al is a side view of the measuring device for the semiconductor device, and FIG. FIG.

In FIGS. 1 and 2, l is a ZIP type semiconductor device to be measured, 2 is a rail of an inspection machine, 3 is an elastic plate-shaped contact, and 4 is a holding block that holds the contact 3. , is insulated.

Reference numeral 5 denotes a vertical drive unit that moves the contactor 3 up and down (in the direction of arrow A), which is a vertical drive means. Reference numeral 6 denotes a test board electrically connected to the contacts.

7 is a lead, 8 is a lead mounting part for mounting the semiconductor device under test l, and 9 is a lead rising part of the lead 7.

A measuring device for a semiconductor device configured as described above will be explained.

When the inspection machine starts operating, the semiconductor device 1 to be measured is transported to the inspection position on the rail 2.

Next, when it is confirmed that the semiconductor device to be measured l has been transported to the inspection position, the vertical drive unit 5 is operated and the holding block 4 is
By moving the contactor 3 downward, the tip of the contactor 3 held by the holding block 4 is brought into contact with the lead rising portion 8 of the semiconductor device under test l (reference numeral 10 in FIG. 2(a));
The leads 7 of the semiconductor device under test 1 and the contacts 3 are electrically connected. At this time, the tip of the contactor 3 is constantly rubbed by the lead rising portion 8, thereby having a self-cleaning effect to remove dirt from the tip.

In this state, the semiconductor device to be measured 1 is tested by a tester (not shown) via the test board 6.

After the inspection is completed, the vertical drive unit 5 is operated to move the holding block 4 upward, that is, return it to its original state.
The contact 3 held by the holding block 4 is separated from the lead rising portion 8 of the semiconductor device 1 to be measured.

When it is confirmed that the holding block 4 has returned to its original position, the semiconductor device under test l that has been tested is transported, and the semiconductor device to be tested next is transported to the testing position, and the above-mentioned operations are repeated. , inspects semiconductor devices.

In this manner, the semiconductor device measuring device of the first embodiment moves the resilient plate-shaped contact 3 held in the holding block 4 downward by the vertical drive unit 5, and measures the semiconductor device under test l. By contacting the lead rising portion 8,
The leads 7 of the semiconductor device to be measured 1 and the contacts 3 are electrically connected. Therefore, the test board 6 and the leads 7 of the semiconductor device to be measured 1 are electrically connected by the contacts 3 without using a conventional socket.

As a result, deformation of the leads 7 and contacts 3 as in the conventional case does not occur, and the lead mounting portion 8 does not suffer from scratches or peeling of plating.

Therefore, poor appearance and poor mounting of the semiconductor device can be prevented. Further, since the contactor 3 has elasticity, the pressure applied to the lead 7 by the contactor 3 can be relatively large, so that the measurement yield can be improved.

Furthermore, the tip of the contact 3 is constantly rubbed against the lead rising portion 8, and has a self-cleaning action to remove dirt from the tip, which prevents the contact 3 from getting dirty, thereby extending the life of the contact 3. can be achieved. Furthermore, since the contactor 3 can have a longer lifespan, the total cost can be lowered.

In the first embodiment, the contactor 3 is moved in the vertical direction by the vertical drive unit 5, but the contactor 3 may be fixed and the semiconductor device under test 1 is moved in the vertical direction.

Further, in the first embodiment, the case where the semiconductor device measuring apparatus of the present invention is applied to a measuring apparatus added to an inspection machine is shown, but it can also be applied to a single measuring apparatus.

FIG. 3 is a conceptual diagram showing a semiconductor device inspection apparatus according to a second embodiment of the present invention, and FIG. 4 is a diagram showing a section X in FIG. 3.

In FIGS. 3 and 4, l is the semiconductor device under test,
2 is a rail, 6 is an inspection board, 7 is a lead, and 8 is a lead mounting part, which are the same as those in the first embodiment. 1)
12 is a resilient plate-shaped contact whose tip has an uneven shape to match the shape of the lead 7, 4° is a holding block that holds the contact 1), and 12 is an uneven surface of the contact 1). This is a lead receiving part that has a concavity and convexity opposite to the tip part, and is insulated. I3 is a vertical drive unit that moves the contactor 1) in the vertical direction (in the direction of arrow B), and serves as a first vertical drive means. Reference numeral 14 denotes a lead receiving vertical drive section that moves the lead receiving section 12 in the vertical direction (in the direction of arrow C), and serves as a second vertical driving means.

The operation of the semiconductor device measuring apparatus configured in this manner will be described below.

First, by starting the operation of the inspection machine, the rail! The semiconductor device to be measured l is transported to an inspection position above 0 (the transport unit is not shown).

Next, after confirming that the semiconductor device to be measured l has been transported to the inspection position, the vertical drive unit 13 is activated and the holding block 4 is
′ is moved downward, and the lead receiver vertical drive unit 14 is actuated to move the lead receiver 1
4 upward, the tip of the elastic contact 1) is brought into contact with the lead mounting portion 8, and the lead mounting portion 8 is sandwiched between the lead receiving portion 12 and the contact 1). do. In this way, the leads 7 of the semiconductor device under test 1 and the contacts 1) are electrically connected.

At this time, by providing an appropriate gap between the lead receiving part 12 and the lead mounting part 8, the leads 7 will not be deformed.

Then, in this state, the semiconductor device to be measured l is tested via the test board 6 by a tester (not shown).

After the inspection is completed, the holding block 4' is moved by the vertical drive unit 13.
The lead receiving vertical drive unit 1
4, by moving the lead receiving part 12 downward, the contactor 1) and the lead receiving part 12 are separated from the lead mounting part 8.

After confirming that the contactor 1) and the lead receiving part 12 have returned to their original positions, the semiconductor device under test l that has been tested is transported, and the semiconductor device to be tested next is transported to the testing position. , the semiconductor devices are sequentially tested by repeating the above operations.

In this manner, the semiconductor device measuring device of the second embodiment operates the vertical drive section 13 to move the contact 1) held at the holding block 4° downward, and at the same time operates the lead receiver vertical drive section 14. By moving the lead receiving part 12 upward, the tip of the contact 1) is brought into contact with the lead mounting part 8, and the semiconductor device to be measured l glue-V7 and the contact 1) are electrically connected.

Therefore, without using a conventional socket,
The test board 6 and the leads 7 of the semiconductor device 1 to be measured can be electrically connected by the contacts 1).

As a result, deformation of the leads and contacts as in the conventional case can be prevented, and the lead mounting portion 8 is prevented from being scratched or peeled off. Therefore, it is possible to prevent appearance defects and mounting defects of the semiconductor device, and since the contact 1) has elastic force, it is possible to make the pressure applied to the contact 7 relatively large, and to make measurements. Yield can be improved. Furthermore, when resin-sealing a ZIP type semiconductor device, even if resin flakes occur on the leads 7, the semiconductor device to be measured can be measured without being affected by the resin flakes, and the measurement yield can be improved.

〔Effect of the invention〕

According to the semiconductor device measuring device of the present invention, the lead of the semiconductor device and the contact are electrically connected by bringing the tip of the elastic contact held by the holding block into contact with the lead. Therefore, even if a relatively large force is applied to the lead by the contact, the contact and the lead do not deform, and it is possible to prevent the lead mounting portion from being scratched and the plating to peel off. As a result, it is possible to obtain a measuring device for semiconductor devices that can improve the measurement yield of semiconductor devices, extend the life of contacts, and reduce costs.

[Brief explanation of drawings]

FIG. 1 is a conceptual diagram showing a measuring device for a semiconductor device according to a first embodiment of the present invention, FIG. 2(a) is a side view of the measuring device for the semiconductor device, and FIG. FIG. 3 is a conceptual diagram showing a semiconductor device inspection device according to a second embodiment of the present invention. FIG. 4 is a diagram showing the X section of FIG. 3. FIG. 5 is a diagram showing a conventional semiconductor device inspection device. FIG. 6 is a conceptual diagram showing the configuration of the measuring device of the device, and FIG. 6 is a side sectional view showing the configuration of the measuring device of the semiconductor device. 3.1)...Contactor, 4.4゛...Holding block,
5... Vertical drive part (vertical drive means), 7... Lead, 8... Lead mounting part, 9... Lead rising part, 12... Lead receiving part, 13... Up and down Drive unit (first vertical drive means), 14...Lead receiving vertical drive unit (
(Second vertical drive means) Fig. Fig.

Claims (2)

[Claims] (1) A resilient plate-shaped contact, a holding block that holds the contact, and a vertical drive means for moving the contact in the vertical direction, and the vertical drive means lowers the contact. A measuring device for a semiconductor device, wherein the tip of the contactor is brought into contact with a lead rising portion of the semiconductor device by moving the contactor in a direction. (2) A resilient plate-shaped contact whose tip has an uneven shape to match the shape of the lead of a semiconductor device, a holding block that holds this contact, and an uneven tip of the contact. a lead receiving part having an unevenness opposite to that of the lead receiving part; a first vertical driving means for vertically moving the contact; and a second vertical driving means for moving the lead receiving part in the vertical direction; The contact element is moved downward by the vertical drive means, and the lead receiving part is moved upward by the second vertical drive means, so that the tip of the contact element is brought into contact with the lead mounting part of the semiconductor device. A measuring device for semiconductor devices.