JPH04130465U - flexible wiring board - Google Patents

Abstract

(57) [Abstract] [Purpose] To facilitate short-circuiting of lands connected to semiconductor input/output circuits and removal of short-circuited lands in printed circuit boards equipped with short-circuiting lands to prevent semiconductor devices from electrostatic damage. To provide flexible wiring boards. [Structure] A protrusion in which a short-circuiting land C is formed is extended on a flexible substrate. This protrusion is folded back into a U-shape, and the shorting land C and the land of the input/output circuit are soldered to short-circuit the input/output circuit. To release a short circuit, simply melt the solder on the short-circuit land.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to printed wiring boards used, for example, in sound reproduction devices. In other words, a base to protect electronic components attached to the board from damage such as static electricity. Regarding plate structure.

0002

[Conventional technology]

Conventionally, electronic components such as MOS type semiconductors are easily destroyed by static electricity shock. Therefore, it is well known that such devices should be handled with great care. In addition, semiconductor laser devices, which have recently become popular in various fields, are also protected against static electricity. is known to be necessary. Such semiconductors generally have input and output terminals connected to each other. It is handled in a connected state, installed in a circuit, and then disconnected.

0003 FIG. 7 is a perspective view showing an optical pickup unit applied to a conventional disc player. It is a diagram. In the figure, 1 is the optical pickup body, 2 is the laser/photodiode 3 is a flexible wiring board for actuator connection. It is. FIG. 8 shows that the flexible wiring board 2 is connected to the connector of the disc player. 4 is a plan view showing only the end of the part connected to the connector, and 4 is a connector connection pattern. This is an exposed part. The pattern exposed portion 4 is connected to a connector (not shown). conductor is exposed. In addition, FIG. 9 shows the electrical circuit of the optical pickup section shown in FIG. This figure shows that the optical pickup main body 1 is composed of multiple electronic components. be understood. In FIG. 9, among the symbols attached to each part, PD1 to PD6 are Photodiode for signal detection, PD7 is photodiode for laser emission monitor, LD1 is a laser diode, C1 is a capacitor for laser protection, and VR1 is a laser emitter. This is a semi-fixed resistor for adjusting light intensity.

0004 Also, the arrangement of the terminals, PD-B, PD-A, ... in Fig. 9 is the same as that of the connector in Fig. 8. It corresponds to the terminal arrangement of the exposed pattern part 4 for connecting the laser diode LD1. Each element representing the is left open. And these terminals OD-B, PD-A,... Laser diode LD unless connected to the connector and connected to the player circuit. First-class components are vulnerable to static electricity.

[0005] Therefore, the laser diode LD1 mounted on this flexible substrate 2 is To protect against electrostatic shock, terminals LD-K and LD-A on board 2 are There are solderable shorting lands A and B that short these two terminals together. (numbers 5 and 6 in FIG. 8). These lands A and B are shown in Figure 9. This means that the anode and cathode sides of laser diode LD1 are shorted. is shown as G1.

[0006] The work of applying solder to short-circuit between terminals LD-K and LD-A is done on the pickup body 1. When assembling, short-circuit soldering is done when the pickup body 1 is connected to the disc player circuit. Removed after being included. Therefore, the two terminals LD-K and LD-A are short-circuited. In the single pickup body 1, the laser diode LD1 has an anode and a cathode. Although it is inoperable due to the shorted circuit, it can be protected from accidental static electricity. Wear.

[0007] Next, FIG. 10 shows a conventional example in which a solder pool land 13 is additionally formed on the terminal LD-K. It is. This solder pool land 13 serves as a solder bridge between terminals LD-K and LD-A. This land is used to receive molten solder when removing the molten solder. The purpose is to facilitate the bridge removal work by moving the are doing. In addition, FIGS. 11 and 12 show modified examples of the peripheral pattern of the accumulation land 13. In Figure 11, the patterns of terminals LD-K and LD-A are modified to create solder balls. This allows the land 13 to be formed large. Figure 12 shows the solder pool. The land 13 for use is separated from other patterns.

[0008]

[Problem that the idea aims to solve] However, the above-mentioned conventional anti-static measures using pattern bridges are There are some problems that need to be improved due to difficulties in workability when forming and removing bridges. A point is left. First, solder bridging work is highly dependent on the skill of the worker. Depending on the proficiency of the work, the amount of solder used for solder bridges may be more or less. Ru. Second, if a large amount of solder was used on the bridge, remove the molten solder with the iron tip. When moving to land 7 for soldering, some solder that cannot be moved is left behind, making it impossible to release the short circuit. Sometimes there isn't. Also, molten solder may fall downward and cause damage to other electrical circuits. It is possible that Third, due to design considerations, a fine pattern is formed on the substrate. In this case, there is no space on the board to provide a solder pool. Furthermore, flexible Sible boards generally have low mechanical strength, so there is a delay in removing solder bridges. If so, there are various problems such as peeling of the conductor pattern due to the heat of the iron tip. It is growing.

[0009] The present invention was developed in view of the above circumstances, and is designed to ensure that the circuit is short-circuited to eliminate static electricity in semiconductors. Provides protection against air and facilitates short-circuit removal to remove solder bridges. The purpose of the present invention is to provide a structure of a flexible wiring board that can be used.

0010

[Means to solve the problem]

In order to achieve the above object, the flexible wiring board of the present invention A protrusion with a short-circuit land formed thereon is extended on the board, and the protrusion is folded back into a U-shape. While positioning the short circuit land in the pattern of the input/output circuit, The input/output circuit is short-circuited by soldering the pattern.

[0011]

[Effect]

The protrusion extending from the flexible board is flexible due to the unique flexibility of the flexible board. It can be bent into a U-shape in the folding direction from the boundary of the protrusion. Folding the protrusion The short-circuit land formed on the protruding part due to bending will cause damage to the input/output circuit pattern of the semiconductor device. is positioned and soldered to the pin. In this way, semiconductor devices The input/output circuits are short-circuited to prevent electrostatic damage to the semiconductor.

0012 The above flexible substrate is incorporated into equipment and semiconductor devices are connected to a closed circuit. After that, the short circuit in the input/output circuit is opened. At this time, melt the solder at the short circuit part. Then, the protrusion self-returns to its initial shape due to the flexibility of the board, and the short-circuit land becomes input/output. Leave the circuit.

[0013]

【Example】

Embodiments of the present invention will be described below with reference to the drawings. Figures 1 to 6 show the actual results of this invention. 1 and 2 show the first embodiment, FIGS. 3 and 4 show the second embodiment, respectively. 5 and 6 show a third embodiment. In addition, in Figures 1 to 6, Components that are the same as those of the conventional example described are given the same reference numerals, and detailed explanation thereof will be omitted. shall be

[0014] Figure 1 shows the laser/photodiode connection plate connected to the optical pickup body 1. A part of the flexible wiring board 2 is shown, and the lower edge of the flexible board 2 is A substantially rectangular flexible wiring board protrusion 7 is formed that partially extends downward from the base. It is. A short circuit pattern 9 is formed on this protrusion 7, and the left side of the pattern 9 is On the side edges, copper foil is exposed and a solderable short-circuit land C (code 10) is formed. has been done. Note that the portion indicated by a broken line 8 at the boundary of the protruding portion 7 is a portion where the protruding portion 7 is bent. This is the position where you can move. On the other hand, two conductors connected to the laser diode LD1, LD -K and LD-A are provided with oval shorting lands A and laminated with 5 and 6, respectively. nd B is formed.

[0015] In Figure 2, the protrusion 7 is folded back into a U-shape at the position of the broken line 8, and the protrusion 7 has a short-circuit land. C is positioned so that it matches the shorting land A and land B on the board 2. It shows. When the protrusion 7 is bent, land A and land B come into contact with land C. By touching and soldering land A and land B in this state, Conductor LD-K of land A and conductor LD-A of land B are short-circuited. And this The cathode and anode of laser diode LD1 connected to the conductor are short-circuited. After that, the laser diode LD1 is protected from electrostatic shock.

[0016] Next, the flexible board 2 is inserted into the connector, and the pickup body 1 is inserted into the connector. After it is assembled into the layer, the short circuit between land A and land B that was soldered first will be opened. released. This work involves applying a soldering iron to land A and land B and melting the solder. and pull up the protrusion 7. In this way, if the solder melts, the shorting land C will be closed. conductors A and B, thus breaking the short circuit between conductors LD-K and LD-A. As a result, the short circuit between the anode and cathode of the laser diode LD1 is opened, and the laser diode LD1 is activated. placed in a workable state. Note that when bending the protrusion 7 at the position of the broken line 8, If no compression is applied to the bent portion 8, the protruding portion 7 will remain flexible when the short circuit is released. Due to the unique flexibility of the substrate, the bent part stretches and returns to its initial state, so no protrusions occur. The work of raising part 7 can be omitted.

[0017] 3 and 4 show a second embodiment of the present invention. In this embodiment, the protrusion 7' is It differs from the previous embodiment in that it extends from the inclined portion 12 of the substrate 2. i.e. , the protruding part 7' protrudes in a direction perpendicular to the inclined part 12, but the short-circuiting pattern is The pin 9' and the shorting land 10' are formed horizontally in the same direction as the substrate 2. Then, as shown in FIG. 4, when the protrusion 7' is bent along the broken line 8', a short circuit occurs. The land C10 is placed in the direction exactly perpendicular to the direction of the conductors LD-K and LD-A. We will be facing each other. In this embodiment, the absolute length of the protrusion 7' protruding from the inclined part 12 is is shorter than in the previous embodiment, making it possible to reduce the effective area of the substrate.

[0018] Furthermore, FIGS. 5 and 6 show a third embodiment of the present invention. In this embodiment, the protrusion 7' extends from the inclined portion 12 as in the second embodiment, but the tip of the shorting pattern 9' A second bent portion 11 is formed at. Then, as shown in Figure 6, the short circuit When the land C10' is bent along the broken line 8', the entire protrusion 7' becomes a Z-fold shape. The shorting land C10' is bent to the shorting land A and the shorting land C10' from both the front and back sides. and B. In this example, the short circuit land C10' is soldered from both the front and back sides. This makes soldering work particularly easy.

[0019] Therefore, the flexible substrate of the present invention described above has improved workability in the following respects. is expected to improve. 1. Weld a small amount of solder between shorting land A, land B, and shorting land C. You can reliably short-circuit the input/output circuit pattern by simply 2. If the solder at the short circuit part is melted when the short circuit is released, the flexibility of the flexible board will cause damage. No excess solder remains on the pattern after the protrusion opens and the short circuit is released. Therefore, the semiconductor can operate reliably. 3. Unlike conventional methods, there is no need to provide solder pools on the pattern, so A certain pattern design becomes possible. 4. Short-circuit release work does not require much skill on the part of the operator, and can be done in a short amount of time. Therefore, there are no accidents such as peeling off of the copper foil on the board due to the heat of the soldering iron.

[0020]

[Effect of the idea]

As explained above, according to the flexible wiring board of the present invention, flexible A protrusion on which a short-circuit land is formed is extended on the board, and the protrusion is folded back into a U-shape to form a short-circuit land. I positioned the short circuit land on the input/output circuit pattern and soldered it. In order to protect semiconductor devices from electrostatic disturbances, the input/output circuits of semiconductors should be After the semiconductor device is assembled into a closed circuit, the short circuit is shorted and the short circuit is released. work has become easier.

[0021] In particular, the short-circuit work according to the present invention can reliably short-circuit the circuit using a small amount of solder. In addition, when working to open a short circuit, due to the flexibility of flexible printed circuit boards, short circuits can be easily removed. The protruding part detaches by itself when the solder melts. Workability has been significantly improved.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a flexible substrate according to a first embodiment of the present invention.

FIG. 2 is a diagram in which the protrusion shown in FIG. 1 is folded back into a U-shape and an input/output circuit and a shorting land are soldered.

FIG. 3 is a diagram illustrating a protrusion of a flexible substrate according to a second embodiment of the present invention.

FIG. 4 is a diagram in which the protrusion shown in FIG. 3 is folded back into a U-shape and an input/output circuit is soldered to a short-circuiting land.

FIG. 5 is a diagram illustrating a protrusion of a flexible substrate according to a third embodiment of the present invention.

FIG. 6 is a diagram in which the protrusion shown in FIG. 5 is folded back into a U-shape and soldered.

FIG. 7 is a perspective view showing a conventional optical pickup main body.

FIG. 8 is a diagram showing a short-circuit land of a conventional flexible substrate.

9 is an electrical circuit diagram of the optical pickup main body shown in FIG. 7. FIG.

10 is an example in which a solder pool portion is provided on the flexible substrate of FIG. 8. FIG.

FIG. 11 is another conventional example of a solder pool.

FIG. 12 is another conventional example of a solder pool.

[Explanation of symbols]

1 Optical pickup 2 Flexible wiring board for laser/photodiode connection 3 Flexible wiring board for actuator connection 4 Exposed pattern part 5 Land for shorting A 6 Land for shorting B 7 Projection part 10 Land for shorting C

Claims (1)

[Scope of utility model registration request] 1. A flexible printed circuit board device comprising means for temporarily shorting the input side and output side circuits of a semiconductor device mounted on a printed circuit board to prevent electrostatic damage to the semiconductor device, wherein the flexible printed circuit board A protrusion with a short-circuit land formed thereon is extended, the protrusion is folded back into a U-shape, the short-circuit land is positioned in the pattern of the input/output circuit, and the short-circuit land and pattern are soldered to connect the input/output circuit. A flexible wiring board that short-circuits a circuit.