JPH0412895B2 - - Google Patents
Info
- Publication number
- JPH0412895B2 JPH0412895B2 JP61112113A JP11211386A JPH0412895B2 JP H0412895 B2 JPH0412895 B2 JP H0412895B2 JP 61112113 A JP61112113 A JP 61112113A JP 11211386 A JP11211386 A JP 11211386A JP H0412895 B2 JPH0412895 B2 JP H0412895B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated
- organic
- fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 49
- 239000000835 fiber Substances 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 239000004744 fabric Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- -1 polyphenylene Polymers 0.000 claims description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920006361 Polyflon Polymers 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229920006367 Neoflon Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920012287 polyphenylene sulfone Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Description
〔技術分野〕
この発明は、プリント配線板等に用いられる有
機基板に関する。
〔背景技術〕
プリント配線板等に用いられる有機基板には、
低誘電率および耐熱性が要求される。そこで、従
来は、ガラス布基材にフツ素樹脂を含浸させて樹
脂含浸基材をつくり、この樹脂含浸基材を硬化さ
せるか、もしくは、複数枚積層した後、硬化させ
て、低誘電率で、耐熱性の優れた有機基板を得る
ようにしていた。
ところが、ガラス布基材を用いると、耐熱性に
優れるものの、誘電率が高くなるという問題があ
り、ガラス布基材を薄くしなければ、誘電率を低
下することができなかつた。
このため、樹脂分が多くなり、これが原因とな
つて、得られる有機基板の板厚精度が悪くなつた
り、強度が小さくなつたりしていた。
したがつて、従来の有機基板では、誘電率が低
く、耐熱性に優れ、かつ、板厚精度が良く、しか
も、強度が大きいものはなかつた。
〔発明の目的〕
以上の事情に鑑みて、この発明は、誘電率が低
く、耐熱性に優れ、かつ、板厚精度が良く、しか
も、強度が大きい有機基板を提供することを目的
とする。
〔発明の開示〕
前記目的を達成するため、この発明は、フツ素
樹脂繊維、ポリフエニレンオキサイド樹脂繊維お
よびポリフエニレンスルフオン樹脂繊維のなかか
ら選ばれた少なくとも１種の有機繊維によつて形
成された布基材に、前記有機繊維より融点が低
く、かつ、前記有機繊維を構成する樹脂と本質的
に同じ化学構造を有する樹脂が含浸された樹脂含
浸基材を少なくとも１枚備え、前記樹脂含浸基材
が、前記布基材の融点より低く、前記含浸樹脂の
融点より高い温度条件下で加熱加圧成形されてな
る有機基板をその要旨としている。
以下に、この発明を詳しく説明する。
この発明に用いられる樹脂含浸基材は、上述の
ごとく、フツ素樹脂繊維、ポリフエニレンオキサ
イド樹脂繊維およびポリフエニレンスルフオン樹
脂繊維のなかから選ばれた少なくとも１種の有機
繊維によつて形成された布基材に、前記有機繊維
より融点が低く、かつ、前記有機繊維を構成する
樹脂と本質的に同じ化学構造を有する樹脂が含浸
されたものである。
この発明では、近時のプリント配線基板に要求
される電気特性および耐熱特性からみて、誘電率
3.0以下、耐熱性300℃以上が設定された。このよ
うな要求水準を満たす上で、布基材の誘電率とし
ては3.0以下であることが必要であり、これに含
浸する樹脂の誘電率も3.0以下であることが必要
である。有機繊維はこのような低誘電率のものが
得られやすいので、布基材はこのような低誘電率
の有機繊維で構成するようにすればよい。この布
基材は、誘電率が低いことから、厚みの充分にあ
るものを用いることができる。しかし、有機繊維
であつても、耐熱性を充分に有するものでなけれ
ばならない。前述のことから、耐熱性の目安とし
ては300℃以上あることが必要である。
前記３種の有機繊維は、いずれも、誘電率が
3.0以下、耐熱性が300℃以上であり、この発明の
目的からみた前記必要性に充分に合致するもので
ある。
一方、布基材に含浸させる樹脂として、前記有
機繊維を構成する樹脂と本質的に同じ化学構造を
有する樹脂を用いるようにすれば、布基材とのな
じみがよく、含浸性がよいことは言うまでもない
ことであり、しかも、誘電率および耐熱性の点で
も問題がない。このようなことから、この発明で
は、含浸樹脂としては、有機繊維を構成する樹脂
と本質的に同じ化学構造を有する樹脂を用いるよ
うにしているのである。
このような樹脂含浸基材は、たとえば、四フツ
化エチレン樹脂繊維よりなる布基材に四フツ化エ
チレン樹脂デイスパージヨンを塗布するなどして
含浸させたあと、含浸樹脂を加熱溶融させること
により得ることができる。 この発明にかかる有
機基板は、つぎのようにしてつくられる。
すなわち、フツ素樹脂繊維、ポリフエニレンオ
キサイド樹脂繊維およびポリフエニレンスルフオ
ン樹脂繊維のなかから選ばれた少なくとも１種の
有機繊維によつて形成された布基材を用い、さら
に、前記有機繊維より融点が低く、かつ、前記有
機繊維を構成する樹脂と本質的に同じ化学構造を
有する樹脂を前記有機繊維布基材に含浸させて樹
脂含浸基材をつくり、このような樹脂含浸基材を
有機繊維布基材の融点より低く、含浸樹脂の融点
より高い温度条件下で加熱加圧成形するか、もし
くは、樹脂含浸基材を複数枚積層し、前記条件下
で加熱加圧成形するようにする。
この後、得られた有機基板の片面または両面に
金属箔を配するようにすれば、金属箔が張られた
有機基板、すなわち、いわゆる金属箔張り積層板
を得ることができる。このような金属箔張り積層
板は、前記樹脂含浸基材の片面または両面に金属
箔を配した後、前記条件下で加熱加圧成形するよ
うにして得てもよい。さらに、上記金属箔張り積
層板にパターンを施し、その両側に前記樹脂含浸
基材と金属箔とを配するようにすれば、内層回路
入り金属箔張り積層板を得ることもできる。
以上のようにして得られた有機基板は、従来用
いられていたガラス布基材の代わりに、誘電率が
3.0以下で、耐熱性が300℃以上ある有機繊維によ
つて形成された布基材が用いられているので、耐
熱性に優れ、布基材を厚くしても、誘電率が高く
なることがない。そのため、板厚精度の良いもの
を構成することができる。しかも、前記有機繊維
布基材に、その有機繊維より融点が低く、かつ、
有機繊維と本質的に同じ化学構造を有する樹脂を
含浸させて樹脂含浸基材をつくり、この樹脂含浸
基材を前記有機繊維布基材の融点より低く、含浸
樹脂の融点より高い温度条件下で加熱加圧成形す
るため、有機繊維布基材が溶融硬化されずに残る
ようになる。このように布基材が補強材として残
り、その布基材を厚くすることができるので、強
度の大きいものを構成することができるようにな
るのである。
なお、四フツ化エチレン樹脂繊維、ポリフエニ
レンオキサイド（PPO）繊維、ポリフエニレン
スルフオン（PPS）繊維などは、難燃性にも優れ
ているため、これらを用いれば、難燃性の高い有
機基板とすることもできる。
つぎに、実施例および比較例について説明す
る。
実施例および比較例の有機基板をつぎのように
してつくつた。
（実施例）
厚み0.2mmの四フツ化エチレン樹脂繊維よりな
る布基材（ダイキン工業株式会社製ポリフロンペ
ーパ）に樹脂量が45％となるように四フツ化エチ
レン樹脂（ダンキン工業株式会社製ポリフロン）
デイスパージヨンを含浸させ、つぎに、含浸樹脂
を350℃で加熱溶融させて樹脂含浸基材をつくつ
た。この樹脂含浸基材を４枚重ね合わせて積層体
をつくり、この積層体を、360℃、40Kg／cm2の条
件下で加熱加圧成形して有機基板（積層板）を得
た。
（比較例）
厚み0.06mmのガラス布（日東紡績株式会社製
WE−05E）に樹脂量が45％となるように四フツ
化エチレン樹脂（ダンキン工業株式会社製ポリフ
ロン）デイスパージヨンを含浸させ、つぎに、含
浸樹脂を350℃で加熱溶融させて樹脂含浸基材を
つくつた。この樹脂含浸基材13枚をそれらの間に
厚み0.025mmの四フツ化エチレン−フルオロビニ
ルエーテル共重合樹脂（ダンキン工業株式会社製
ネオフロン）フイルムを挟むようにして重ね合わ
せて積層体をつくり、この積層体を、360℃、40
Kg／cm2の条件下で加熱加圧成形して有機基板（積
層板）を得た。
実施例および比較例の有機基板につき、誘電
率、板厚精度、耐熱性および曲げ強度を調べた。
その結果を第１表に示す。
[Technical Field] The present invention relates to an organic substrate used for printed wiring boards and the like. [Background technology] Organic substrates used for printed wiring boards, etc.
Low dielectric constant and heat resistance are required. Conventionally, a resin-impregnated base material was created by impregnating a glass cloth base material with a fluororesin, and then this resin-impregnated base material was cured, or multiple sheets were laminated and then cured to achieve a low dielectric constant. , an attempt was made to obtain an organic substrate with excellent heat resistance. However, when a glass cloth base material is used, although it has excellent heat resistance, there is a problem in that the dielectric constant becomes high, and the dielectric constant cannot be lowered unless the glass cloth base material is made thinner. For this reason, the resin content increases, which causes the resulting organic substrate to have poor plate thickness accuracy and low strength. Therefore, no conventional organic substrate has a low dielectric constant, excellent heat resistance, good thickness accuracy, and high strength. [Object of the Invention] In view of the above circumstances, an object of the present invention is to provide an organic substrate having a low dielectric constant, excellent heat resistance, good thickness accuracy, and high strength. [Disclosure of the Invention] In order to achieve the above-mentioned object, the present invention provides a method using at least one organic fiber selected from fluororesin fibers, polyphenylene oxide resin fibers, and polyphenylene sulfonate resin fibers. The formed cloth base material is provided with at least one resin-impregnated base material impregnated with a resin having a lower melting point than the organic fibers and having essentially the same chemical structure as the resin constituting the organic fibers, The gist thereof is an organic substrate in which a resin-impregnated base material is formed under heat and pressure at a temperature lower than the melting point of the cloth base material and higher than the melting point of the impregnated resin. This invention will be explained in detail below. As mentioned above, the resin-impregnated base material used in the present invention is formed from at least one organic fiber selected from fluororesin fibers, polyphenylene oxide resin fibers, and polyphenylene sulfonate resin fibers. The resulting cloth base material is impregnated with a resin having a melting point lower than that of the organic fiber and having essentially the same chemical structure as the resin constituting the organic fiber. In this invention, the dielectric constant is
3.0 or less, and heat resistance of 300℃ or more was set. In order to meet these required standards, the dielectric constant of the cloth base material must be 3.0 or less, and the dielectric constant of the resin impregnated therewith must also be 3.0 or less. Since organic fibers with such a low dielectric constant are easily obtained, the fabric base material may be made of organic fibers with such a low dielectric constant. Since this cloth base material has a low dielectric constant, a material having a sufficient thickness can be used. However, even organic fibers must have sufficient heat resistance. From the above, as a guideline for heat resistance, it is necessary to have a temperature of 300°C or higher. All of the three types of organic fibers have a dielectric constant of
3.0 or less, and the heat resistance is 300° C. or more, which fully meets the above-mentioned requirements from the viewpoint of the purpose of the present invention. On the other hand, if a resin having essentially the same chemical structure as the resin constituting the organic fiber is used as the resin to be impregnated into the cloth base material, it will be compatible with the cloth base material and have good impregnating properties. Needless to say, there is no problem in terms of dielectric constant and heat resistance. For this reason, in the present invention, a resin having essentially the same chemical structure as the resin constituting the organic fiber is used as the impregnating resin. Such a resin-impregnated base material can be produced, for example, by coating a cloth base material made of tetrafluoroethylene resin fibers with a tetrafluoroethylene resin dispersion to impregnate it, and then heating and melting the impregnated resin. Obtainable. The organic substrate according to the present invention is produced as follows. That is, a cloth base material formed of at least one kind of organic fiber selected from fluororesin fiber, polyphenylene oxide resin fiber, and polyphenylene sulfone resin fiber is used, and the organic fiber A resin-impregnated base material is created by impregnating the organic fiber cloth base material with a resin having a lower melting point and having essentially the same chemical structure as the resin constituting the organic fiber, and such resin-impregnated base material is Either by heat-pressing molding at a temperature lower than the melting point of the organic fiber cloth base material and higher than the melting point of the impregnated resin, or by laminating a plurality of resin-impregnated base materials and heat-pressing molding under the above conditions. do. Thereafter, by disposing metal foil on one or both sides of the obtained organic substrate, it is possible to obtain an organic substrate covered with metal foil, that is, a so-called metal foil-covered laminate. Such a metal foil-clad laminate may be obtained by disposing a metal foil on one or both sides of the resin-impregnated base material and then heating and press-molding the resin-impregnated base material under the conditions described above. Furthermore, by applying a pattern to the metal foil-clad laminate and arranging the resin-impregnated base material and metal foil on both sides thereof, a metal foil-clad laminate with an inner layer circuit can also be obtained. The organic substrate obtained in the above manner can be used instead of the conventionally used glass cloth base material.
3.0 or less and has a heat resistance of 300℃ or more, the fabric base material is made of organic fibers, so it has excellent heat resistance, and even if the fabric base material is thick, the dielectric constant will not increase. do not have. Therefore, it is possible to construct a plate with good plate thickness accuracy. Moreover, the organic fiber cloth base material has a melting point lower than that of the organic fiber, and
A resin-impregnated base material is created by impregnating a resin having essentially the same chemical structure as the organic fiber, and the resin-impregnated base material is heated under a temperature condition lower than the melting point of the organic fiber cloth base material and higher than the melting point of the impregnated resin. Since the molding is carried out under heat and pressure, the organic fiber cloth base material remains without being melted and hardened. In this way, the cloth base material remains as a reinforcing material and the cloth base material can be made thicker, so that it becomes possible to construct a product with high strength. In addition, tetrafluoroethylene resin fibers, polyphenylene oxide (PPO) fibers, polyphenylene sulfonate (PPS) fibers, etc. have excellent flame retardancy, so if you use them, you can create highly flame-retardant materials. It can also be an organic substrate. Next, Examples and Comparative Examples will be described. Organic substrates of Examples and Comparative Examples were produced as follows. (Example) Tetrafluoroethylene resin (manufactured by Dunkin Industries, Ltd.) was added to a cloth base material (Polyflon paper, manufactured by Daikin Industries, Ltd.) made of tetrafluoroethylene resin fibers with a thickness of 0.2 mm so that the resin amount was 45%. Polyflon)
The dispersion was impregnated, and the impregnated resin was then heated and melted at 350°C to create a resin-impregnated base material. A laminate was made by stacking four of these resin-impregnated base materials, and this laminate was molded under heat and pressure at 360° C. and 40 kg/cm 2 to obtain an organic substrate (laminate). (Comparative example) Glass cloth with a thickness of 0.06 mm (manufactured by Nittobo Co., Ltd.)
WE-05E) was impregnated with tetrafluoroethylene resin (Polyflon, manufactured by Dunkin Industries, Ltd.) dispersion so that the resin amount was 45%, and then the impregnated resin was heated and melted at 350°C to form a resin-impregnated base. I made wood. A laminate was made by stacking 13 of these resin-impregnated base materials with a 0.025 mm thick tetrafluoroethylene-fluorovinyl ether copolymer resin (Neoflon manufactured by Dunkin Industries, Inc.) film sandwiched between them. , 360℃, 40
An organic substrate (laminate) was obtained by heating and press molding under conditions of Kg/cm 2 . The dielectric constant, plate thickness accuracy, heat resistance, and bending strength of the organic substrates of Examples and Comparative Examples were examined.
The results are shown in Table 1.
この発明にかかる有機基板は、以上にみたよう
に、樹脂含浸基材の布基材として耐熱性があり低
誘電率である有機繊維を用いるようにしており、
布基材の厚みを大きくすることができるため、誘
電率が低く、耐熱性に優れ、かつ、板厚精度が良
く、しかも、強度が大きい。
As described above, the organic substrate according to the present invention uses organic fibers that are heat resistant and have a low dielectric constant as the cloth base material of the resin-impregnated base material.
Since the thickness of the fabric base material can be increased, it has a low dielectric constant, excellent heat resistance, good plate thickness accuracy, and high strength.
Claims (1)
樹脂繊維およびポリフエニレンスルフオン樹脂繊
維のなかから選ばれた少なくとも１種の有機繊維
によつて形成された布基材に、前記有機繊維より
融点が低く、かつ、前記有機繊維を構成する樹脂
と本質的に同じ化学構造を有する樹脂が含浸され
た樹脂含浸基材を少なくとも１枚備え、前記樹脂
含浸基材が、前記布基材の融点より低く、前記含
浸樹脂の融点より高い温度条件下で加熱加圧成形
されてなる有機基板。 ２ 少なくとも片面に金属箔が配されている特許
請求の範囲第１項記載の有機基板。[Scope of Claims] 1. A cloth base material formed of at least one organic fiber selected from fluororesin fibers, polyphenylene oxide resin fibers, and polyphenylene sulfonate resin fibers, at least one resin-impregnated base material impregnated with a resin having a melting point lower than that of the organic fiber and having essentially the same chemical structure as the resin constituting the organic fiber; An organic substrate formed by heating and pressure molding at a temperature lower than the melting point of the material and higher than the melting point of the impregnated resin. 2. The organic substrate according to claim 1, wherein a metal foil is disposed on at least one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11211386A JPS62267335A (en) | 1986-05-15 | 1986-05-15 | Organic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11211386A JPS62267335A (en) | 1986-05-15 | 1986-05-15 | Organic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62267335A JPS62267335A (en) | 1987-11-20 |
| JPH0412895B2 true JPH0412895B2 (en) | 1992-03-06 |
Family
ID=14578486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11211386A Granted JPS62267335A (en) | 1986-05-15 | 1986-05-15 | Organic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62267335A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530969A (en) * | 1978-08-29 | 1980-03-05 | Fujitsu Ltd | Incombustible parts |
-
1986
- 1986-05-15 JP JP11211386A patent/JPS62267335A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530969A (en) * | 1978-08-29 | 1980-03-05 | Fujitsu Ltd | Incombustible parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62267335A (en) | 1987-11-20 |
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| JPH0412895B2 (en) | ||
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| CA1158970A (en) | Production of electrical laminates | |
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| JPH0262383B2 (en) | ||
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| JPH0716089B2 (en) | Electric laminate | |
| JPH024422B2 (en) | ||
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| JPH06134883A (en) | Production of laminated sheet | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |