JPH04127982A - Laser marking machine - Google Patents
Laser marking machineInfo
- Publication number
- JPH04127982A JPH04127982A JP2248233A JP24823390A JPH04127982A JP H04127982 A JPH04127982 A JP H04127982A JP 2248233 A JP2248233 A JP 2248233A JP 24823390 A JP24823390 A JP 24823390A JP H04127982 A JPH04127982 A JP H04127982A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- marking
- marking machine
- laser marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010330 laser marking Methods 0.000 title claims abstract description 24
- 238000003384 imaging method Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 abstract description 10
- 238000007789 sealing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Lasers (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装1第の電子部品の外郭体表面にレー
ザビームを走査し、商標・品名・ロット番号等を捺印す
るレーザ捺印機。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention is a laser marking machine that scans a laser beam onto the surface of an outer shell of a first electronic component of a semiconductor device to stamp a trademark, product name, lot number, etc.
従来、レーザ捺印機式は、半導体装置(以下単にICと
言う)の捺印面上にレーザビームを走査させ、−筆書き
の要領で商標 品名・ロット番号等を捺印する一筆書き
方式と、フォントマスク上に配置されたパターン郡の中
から所望のパターンを選択透過させたレーザビームを所
定の高度だけ偏向して結像レンズに入射させ、捺印を行
なうマスク方式の2つの方式に大別できる。Conventionally, laser marking machines scan a laser beam on the marking surface of a semiconductor device (hereinafter simply referred to as IC) to stamp trademarks, product names, lot numbers, etc. in the same way as a brush stroke, and a font mask. It can be roughly divided into two methods: a mask method, in which a laser beam that selectively transmits a desired pattern from a group of patterns arranged above is deflected by a predetermined height, and is incident on an imaging lens to perform marking.
第1の一筆書き方式のレーザ捺印機は、帯状のリードフ
レームの各こ抜に樹脂封止されたICをこまずつ送り、
所定の位置に順次ICを位置決めし、そしてその位置で
ICにレーザビームを走査させ捺印するレーザ捺印機と
、光のリードフレームから個々のICに切断分離し、こ
れらのICを1個ずつ捺印する場所に送り、位置決め後
捺印するレーザ捺印機とがある。いずれの捺印機も、そ
のインデックスタイム、すなわち、搬送1位置決めおよ
び捺印時間は1,2秒/固定度を要した。The first single-stroke laser marking machine feeds resin-sealed ICs piece by piece into each hole in a strip-shaped lead frame.
A laser marking machine that sequentially positions the ICs at predetermined positions and then scans the ICs with a laser beam at those positions to mark them; and a laser marking machine that cuts and separates the ICs from the optical lead frame and stamps these ICs one by one. There is a laser marking machine that sends it to a location, positions it, and then stamps it. In each printing machine, the index time, that is, the transport 1 positioning and printing time required 1.2 seconds/degree of fixation.
また第2のマスク方式のレーザ捺印機では、す−ドフレ
ームを一定速度で連続送りを行い、フォノ1ヘマスク上
のパターンを透過したレーザビームをリードフレームの
移動位置に応じて所定の角度だけ偏向し、結像しンズに
入射させ、リードフレームが移動状剪でレーザビームを
照射し、捺印を行っていた。なお、このレーザ捺印機の
インデックスタイムは、前者より早く、約0.4秒77
′固程度であった。In addition, in the second mask-type laser marking machine, the lead frame is continuously fed at a constant speed, and the laser beam that has passed through the pattern on the mask toward phono 1 is deflected by a predetermined angle depending on the position of the lead frame. The laser beam was then applied to an imaging lens, and the lead frame was moved in a moving manner to irradiate the laser beam and make a mark. The index time of this laser marking machine is faster than the former, about 0.4 seconds 77
'It was of a firm level.
上述した従来のレーザ捺印機で、−筆書き方式のレーザ
捺印機では、ICがリードフレーム状に組み立てられた
状態でリードフレームを1ピツチずつ搬送するか、もし
くはICが個々に切断分離・リード成形された状態で1
個ずつ搬送をするかであるため、搬送位置決め時間が各
ICごとに必要となり、インデックスの短縮が困難であ
る。In the above-mentioned conventional laser marking machine, - in the brush writing type laser marking machine, the IC is assembled into a lead frame and the lead frame is conveyed one pitch at a time, or the IC is individually cut, separated, and lead-formed. 1 in the state
Since the ICs are transported one by one, transport positioning time is required for each IC, making it difficult to shorten the index.
一方、マスク方式のレーザ捺印機の場合、レーザビーム
の照射範囲と捺印文字数により送り速度の制約はあるも
のの、移動状態で捺印が可能なため、位置決め停止に要
する時間を削除でき、インテ・ノクスの短縮には有利と
なる。しかし、フォノ1〜マスクの製作に多大な費用か
かかかり、また、フォントマスク状カバターン群から特
定のパターンのみ選択的にし一ザビームを通過させるた
め、複雑な機構、制御部を精成する必要があり、設備コ
ストが高くなるばかりか機械の信頼性が劣るという欠点
がある。On the other hand, in the case of a mask-type laser marking machine, although the feed speed is limited by the laser beam irradiation range and the number of characters to be stamped, it is possible to stamp while moving, which eliminates the time required for positioning and stopping. It is advantageous for shortening. However, it costs a lot of money to manufacture the phono mask, and in order to selectively select only a specific pattern from the group of font mask-like cover patterns and allow the beam to pass through, it is necessary to elaborate a complicated mechanism and control section. However, there are drawbacks such as high equipment costs and poor mechanical reliability.
本発明の目的は、かかる問題を解消すべく、よりインデ
ックスの短縮化は図れるとともに安価な信頼性の高いレ
ーザ捺印機を提供することである。SUMMARY OF THE INVENTION In order to solve this problem, it is an object of the present invention to provide an inexpensive and highly reliable laser marking machine that can further shorten the index.
本発明のレーザ捺印機は、レーザビームを互いに直交す
る二方向に所定の角度で反射させるとともに捺印パター
ンに偏向走査させる互いに軸が直交する二軸の回転ミラ
ーをもつガルバノメータ型のフォトスキインテと、反射
及び偏向走査される前記レーザビーム入光領域を含む大
きさの結像レンズとを備えることを特徴としている。The laser marking machine of the present invention includes a galvanometer-type photoski integer having two rotating mirrors whose axes are perpendicular to each other, which reflects a laser beam at a predetermined angle in two directions perpendicular to each other, and deflects and scans the marking pattern. It is characterized by comprising an imaging lens having a size that includes the laser beam incident area that is reflected and deflected and scanned.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例を示すレーザ捺印機の主要部
における斜視図である。このレーザ捺印機は、同図に示
すように、レーザビームを発振するレーザ発振器]と、
レーザビームを収束するリレーレンズ2と、収束された
レーザビームを互いに直交する二方向に所定の角度に反
射し、かつ捺印パターンに偏向走査するミラー4a及び
4bをもつ2軸のガルバノメータ型オブチカルスキャン
ナ4と、反射及び偏向走査されるレーザビームを入光し
、被捺印物に結像する結像レンズ5とを有している。FIG. 1 is a perspective view of the main parts of a laser marking machine showing an embodiment of the present invention. As shown in the figure, this laser marking machine includes a laser oscillator that emits a laser beam,
A two-axis galvanometer-type optical scan having a relay lens 2 that converges a laser beam, and mirrors 4a and 4b that reflect the converged laser beam at a predetermined angle in two directions orthogonal to each other and deflect and scan the imprint pattern. 4, and an imaging lens 5 which receives a reflected and deflected laser beam and forms an image on the object to be printed.
このように、レーザビーム光経路中に2軸駆動のミラー
付きガルバノメータ型オブチカルスキャンナ4と、レー
ザビームの偏向走査領域を含む、大きさの結像レンズ5
とを設けることによって、このガルバノメータ型オブチ
カルスキャンナ4に取り付けられたミラー4a、4bを
、図示していない制御部によりそれぞれの被捺印物6の
捺印位置に比例した角度だけ各ミラーを回転させること
により反射させ、結像レンズ5に入射させる。このこと
により、2次元面内の移動可能な領域内でレーザビーム
の位置決めと移動を行い得る。そして、位置決めされた
レーザビームを各ミラー4a及び4bで微小に偏向走査
させ、−筆書きの要領で所望の文字等の形に捺印する。In this way, a galvanometer-type optical scanner 4 with a biaxially driven mirror is included in the laser beam optical path, and an imaging lens 5 of a size that includes a deflection scanning area of the laser beam.
By providing this, the mirrors 4a and 4b attached to this galvanometer-type optical scanner 4 are rotated by an angle proportional to the marking position of each marking object 6 by a control section (not shown). This causes the light to be reflected and incident on the imaging lens 5. This makes it possible to position and move the laser beam within a movable region within a two-dimensional plane. Then, the positioned laser beam is minutely deflected and scanned by each of the mirrors 4a and 4b, and a mark is made in the shape of a desired character or the like in the same manner as when writing with a brush.
また、レーザビームの移動可能な範囲内に、被捺印物6
を複数個一括して位置決めしておけば、1回の位置決め
動作により複数個の捺印が同時にでき、1個あたりの捺
印に要する時間が短縮できる。例えば、レーザビーム照
射領域内に被捺印物を9個並べたとき、0.9秒/個程
度のインデックスが実現できた。Also, within the movable range of the laser beam, the object 6 to be stamped is placed.
If a plurality of stamps are positioned at once, a plurality of stamps can be simultaneously stamped by one positioning operation, and the time required for stamping each stamp can be shortened. For example, when nine objects to be stamped were lined up within the laser beam irradiation area, an index of about 0.9 seconds/piece could be achieved.
第2図は、本発明の他の実施例を示すレーザ捺印機の主
要部における斜視図である。このレーザ捺印機は、前述
のレーザ捺印機の主要部に、ICを搬送し位置決めする
機構部を設けたものである。即ち、被捺印物6である個
片に分離されたICが、二列に交互に分岐供給する手段
を有するパーツフィーダ7と、二列に送られる被捺印物
6を位置決め及び位置決め解除する機構をもつ捺印ステ
ージ8とを設けたことである。このレーザ捺印機の動作
は、捺印ステージ8のいずれかの被捺印e16を捺印し
ている間に、他方の被捺印部6の位置決めを行ない、前
の被捺印物がレーザ捺印か終了したら、レーザビームを
偏向し、すでに位置決めが完了している被捺印物6にレ
ーザビームを移動する。そして、ビームを走査して捺印
を行なう。このような走査をステージ8に位置決めされ
る被捺印物6を交互に捺印を繰り返すことにより、被捺
印物6の搬送位置決めに要する時間によるロスを削減で
きる。FIG. 2 is a perspective view of the main parts of a laser marking machine showing another embodiment of the present invention. This laser stamping machine is a main part of the laser stamping machine described above, and is provided with a mechanism section for transporting and positioning the IC. That is, the parts feeder 7 has a means for branching and supplying the ICs, which are the objects 6 to be imprinted, separated into individual pieces into two rows alternately, and a mechanism for positioning and releasing the positioning of the objects 6 to be imprinted, which are sent in the two rows. This is because a stamping stage 8 is provided. The operation of this laser marking machine is such that while one of the marking targets e16 on the marking stage 8 is being stamped, the other marking target part 6 is positioned, and when the laser marking of the previous marking target is completed, the laser marking is performed. The laser beam is deflected and moved to the object 6 to be marked, which has already been positioned. Then, the beam is scanned to imprint the mark. By repeating such scanning alternately to mark the object to be marked 6 positioned on the stage 8, it is possible to reduce the loss due to the time required for transporting and positioning the object to be marked 6.
以上説明したように本発明は、レーザビームを互いに直
交する二方向に所定の偏向角度に反射し、かつレーザビ
ームを偏向走査させる二軸の回転ミラーをもつガルバノ
メータ型オブチカルスキインナと、偏向及び走査される
レーザビームが入光し得る領域を含む大きさの結像レン
ズとを設けることにより、機械的搬送位置決め機構を用
いずに、複数個の被捺印物をレーザビーム照射領域内に
配置出来るのでインデックスの短縮化が図れ、安価で信
頼度の高いレーザ捺印機が得られるという効果がある。As explained above, the present invention provides a galvanometer-type optical skinner having a biaxial rotating mirror that reflects a laser beam at a predetermined deflection angle in two directions orthogonal to each other and deflects and scans the laser beam, and By providing an imaging lens with a size that includes an area into which the laser beam can enter, multiple objects to be marked can be placed within the laser beam irradiation area without using a mechanical conveyance positioning mechanism. This has the effect that the index can be shortened and an inexpensive and highly reliable laser marking machine can be obtained.
第1図は本発明の一実施例を示すレーザ捺印機における
主要部の斜視図、第2図は本発明の他の実施例を示すレ
ーザ捺印機における主要部の斜視図である。
1・・・レーザ発振器、2・・・リレーレンズ、3.ガ
ルバノメータ型オブチカルスキインナ、4a、4b・・
・ミラー、5・・・結像レンズ、6・・・被捺印物、7
・・・パーツフィーダ、8・・・ステージ。FIG. 1 is a perspective view of the main parts of a laser stamping machine showing one embodiment of the invention, and FIG. 2 is a perspective view of the main parts of a laser marking machine showing another embodiment of the invention. 1... Laser oscillator, 2... Relay lens, 3. Galvanometer type optical skin inner, 4a, 4b...
・Mirror, 5... Imaging lens, 6... Stamped object, 7
... Parts feeder, 8... stage.
Claims (1)
射させるとともに捺印パターンに偏向走査させる互いに
軸が直交する二軸の回転ミラーをもつガルバノメータ型
のフオトスキヤンナと、反射及び偏向走査される前記レ
ーザビーム入光領域を含む大きさの結像レンズとを備え
ることを特徴とするレーザ捺印機。a galvanometer-type photo scanner having two rotating mirrors whose axes are orthogonal to each other, which reflect the laser beam at a predetermined angle in two directions perpendicular to each other, and deflect and scan the marking pattern; A laser marking machine characterized by comprising an imaging lens having a size that includes a light region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2248233A JPH04127982A (en) | 1990-09-18 | 1990-09-18 | Laser marking machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2248233A JPH04127982A (en) | 1990-09-18 | 1990-09-18 | Laser marking machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04127982A true JPH04127982A (en) | 1992-04-28 |
Family
ID=17175147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2248233A Pending JPH04127982A (en) | 1990-09-18 | 1990-09-18 | Laser marking machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04127982A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7329830B2 (en) * | 2005-03-23 | 2008-02-12 | Datacard Corp. | High-rate laser marking machine |
US10141691B2 (en) | 2015-05-29 | 2018-11-27 | Sumitomo Wiring Systems, Ltd. | Connector |
CN111330858A (en) * | 2020-03-05 | 2020-06-26 | 上海首坤智能科技有限公司 | Laser marking machine with automatic sorting function and sorting method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63160775A (en) * | 1986-12-23 | 1988-07-04 | Matsushita Electric Ind Co Ltd | Method and machine for laser beam machining of thin metallic film |
JPH02175087A (en) * | 1988-12-26 | 1990-07-06 | Fuji Electric Co Ltd | Automatic work distance setting mechanism for laser marking press |
JPH0347685A (en) * | 1989-07-14 | 1991-02-28 | Mitsui Toatsu Chem Inc | Method and device for laser beam marking |
-
1990
- 1990-09-18 JP JP2248233A patent/JPH04127982A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63160775A (en) * | 1986-12-23 | 1988-07-04 | Matsushita Electric Ind Co Ltd | Method and machine for laser beam machining of thin metallic film |
JPH02175087A (en) * | 1988-12-26 | 1990-07-06 | Fuji Electric Co Ltd | Automatic work distance setting mechanism for laser marking press |
JPH0347685A (en) * | 1989-07-14 | 1991-02-28 | Mitsui Toatsu Chem Inc | Method and device for laser beam marking |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7329830B2 (en) * | 2005-03-23 | 2008-02-12 | Datacard Corp. | High-rate laser marking machine |
US10141691B2 (en) | 2015-05-29 | 2018-11-27 | Sumitomo Wiring Systems, Ltd. | Connector |
CN111330858A (en) * | 2020-03-05 | 2020-06-26 | 上海首坤智能科技有限公司 | Laser marking machine with automatic sorting function and sorting method |
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