JPH0412683Y2 - - Google Patents
Info
- Publication number
- JPH0412683Y2 JPH0412683Y2 JP13471387U JP13471387U JPH0412683Y2 JP H0412683 Y2 JPH0412683 Y2 JP H0412683Y2 JP 13471387 U JP13471387 U JP 13471387U JP 13471387 U JP13471387 U JP 13471387U JP H0412683 Y2 JPH0412683 Y2 JP H0412683Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit board
- printed circuit
- heatsink
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002470 thermal conductor Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13471387U JPH0412683Y2 (US20080293856A1-20081127-C00150.png) | 1987-09-02 | 1987-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13471387U JPH0412683Y2 (US20080293856A1-20081127-C00150.png) | 1987-09-02 | 1987-09-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6439648U JPS6439648U (US20080293856A1-20081127-C00150.png) | 1989-03-09 |
| JPH0412683Y2 true JPH0412683Y2 (US20080293856A1-20081127-C00150.png) | 1992-03-26 |
Family
ID=31393715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13471387U Expired JPH0412683Y2 (US20080293856A1-20081127-C00150.png) | 1987-09-02 | 1987-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412683Y2 (US20080293856A1-20081127-C00150.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069756A (ja) * | 2011-09-21 | 2013-04-18 | Toshiba Mitsubishi-Electric Industrial System Corp | 半導体素子の冷却装置 |
| JP6404806B2 (ja) * | 2015-11-25 | 2018-10-17 | 東芝三菱電機産業システム株式会社 | 半導体装置 |
-
1987
- 1987-09-02 JP JP13471387U patent/JPH0412683Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6439648U (US20080293856A1-20081127-C00150.png) | 1989-03-09 |
