JPH04125954A - Electronic part mounting substrate - Google Patents

Abstract

PURPOSE:To make a power supply circuit or ground circuit as a low inductance circuit by forming a metallic plated layer without fail on the opposite parts of a radiating plate to recessions. CONSTITUTION:The title electrode part mounting substrate is provided with exposed recessions 4 striding over a basic member 10 and a radiating plate 2 while a bonding agent 3 is exposed in the same surface of the exposed recessions 4. Accordingly, the metallic plated layer coated on the rear surface of the basic member 10 is completely formed on the surface of the exposed recessions 4. Furthermore, since the metallic plated layer is continuously formed on the rear surface side of the radiating plate 2, the exposed recessions 4 and the basic member 10, no moisture can permeate into the basic member 10 from the rear surface side. Accordingly, the title electronic part mounting substrate having the high functions and excellent heat dissipation properties can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate for mounting electronic components that has excellent moisture resistance and allows high-density wiring.

[Prior art]

Conventionally, in substrates for mounting electronic components, in order to dissipate heat generated from electronic components such as semiconductor elements, a recess for mounting electronic components is provided in the base material, and a heat sink is provided on the opposite side with an adhesive (e.g. , Japanese Unexamined Patent Publication No. 59-32191).

That is, as shown in FIG. 10, in a conventional electronic component mounting board 90, a heat sink 7 is bonded within a recess 92 provided in a base material 9 via an adhesive 8. Also.

On the back side of the base material, a metal plating layer 75 is formed between the heat sink 7 and the base material 9, and a metal plating layer 76 is formed between the top surface of the heat sink 7 and the electronic component mounting recess 93. Therefore, the infiltration of moisture from the back side of the base material 9 into the electronic component mounting recess 93 is blocked. In addition, in the same figure, the reference numeral 94
is a conductor circuit [Problem to be solved] However, the electronic component mounting board 90 is.

As shown in FIG. 11, at a facing portion 95 where the side wall of the recess 92 and the side wall of the heat sink 7 face each other.

The metal plating layer 75 may not be formed in the opening 750. In other words, a well plated hole 751 is produced.

When such a hole 751 is formed, moisture infiltrates into the electronic component mounting recess from this portion.

Electronic components such as semiconductors may be damaged.

On the other hand, the reason why the well-plated hole 751 occurs is considered to be that the clearance of the facing portion 95 between the recess 92 and the heat sink 7 is large (approximately 0.1 to 0.2+am).

Therefore, it is necessary to reduce the clearance of this opposing portion 95, but due to variations in processing, the clearance occurs.

On the other hand, as a countermeasure to the above problem, as shown in FIG. 12, a wide recess 92 is provided in the ceiling surface 921. There is a method of widening the space between the side wall of the recess 92 and the side wall of the heat sink 7. and.

A metal plating layer 75 is continuously provided on these surfaces. In this method, since the clearance of the opposing portion 95 is sufficiently large, the metal plating layer 75 also exists in this opposing portion.
is formed.

However, if the recess 92 is made large, the degree of freedom in forming a conductive circuit pattern on the back side of the base material 9 is inhibited. On the other hand, if the size of the recess 92 is limited, the heat dissipation plate 7 will have a small shape and the heat dissipation performance will be inhibited.

Furthermore, in the above method, when bonding the heat dissipating plate 7 to the ceiling surface 921 of the recess 92, the adhesive 8 may protrude (overflow) from between the two. When the protruding portion of the adhesive is large, the metal plating layer 75 is not formed. Therefore, it is necessary to adjust the amount of adhesive 8 to prevent it from extruding.

By the way, in recent years, with the increasing functionality of i-child components, it has become necessary to increase the processing speed of calculations, and in particular, the clock frequency of digital signals (ON-OFF) used for inputting and outputting signals to electronic components has also increased by several numbers. The frequency range is expanding from 10 MHz to several hundred MHz.

However, in order to efficiently input and output pulse waves of digital signals in a high frequency range, it is necessary to reduce the capacitance (permittivity) and inductance (magnetic induction coefficient) as electrical characteristics of one circuit. Among these, capacitance is determined by the material properties of the base material, while inductance is often caused by wiring design.

In particular, the power supply circuit and the ground circuit need to be low inductance circuits, and it is desirable that the circuit patterns be as thick as possible.

Furthermore, with the increase in functionality, a large amount of heat is also generated from the electronic components placed in the electronic component mounting recesses. Therefore,
The heat sink is required to be as large as possible, and as a result, the degree of freedom in forming one circuit is reduced on the back side of the base material to which the heat sink is bonded.

In view of these problems, the present invention ensures that the metal plating layer is formed at the portion where the heat sink and the recess face each other, and the power supply circuit or the ground circuit can be made into a low-inductance circuit. The aim is to provide a board for mounting electronic components that is highly functional and has excellent heat dissipation.

[Means for Solving the Problems] The present invention provides a base material having a conductor circuit, a recess for mounting an electronic component provided in the base material, and a recess provided on the opposite side having a diameter larger than the recess for mounting the electronic component. and.

An electronic component mounting board comprising a heat sink fixed in the recess with an adhesive and having its back side exposed to the electronic component mounting recess, the heat sink and a side wall of the recess on the back side of the base material. An exposed recess that spans both the base material and the heat sink and exposes the adhesive on the same surface is provided in the facing portion where the side walls of the The back side of the material is coated with a continuous metal plating layer, and the side wall of the electronic component mounting recess is provided with a conductive layer that conducts to the outside of the base material, and the conductive layer is provided with a power supply terminal or A board for mounting electronic components is characterized by being provided with a grounding terminal.

The most noteworthy feature of the present invention is that the exposed recess is provided in the facing portion, and that a continuous metal plating layer is coated between the heat sink, the exposed opening, and the back side of the base material, and that the electronic component The above conductive layer is provided on the side wall of the mounting recess, and the power supply terminal or the ground terminal is provided on the conductive layer.

The exposed recess is formed across both the base material and the heat sink. In addition, there are usually two recesses for joining the heat sink,
A rectangular or circular recess is formed in the center of the base material, and the heat sink is provided in a similar shape to the recess. Therefore, the above opposing part.

It is usually formed into an annular shape such as a square or a circular shape (see Figure 4).
.

Also, the adhesive is between the side wall of the recess and the side wall of the heat sink.

That is, the opposing portions are filled. The adhesive is exposed in the exposed recess provided in the facing portion. The exposed surface of the adhesive is.

It is located almost on the same plane as the ceiling surface of the exposed recess.

Examples of the material for the base material include glass-epoxy resin, glass-bismaleimide-triazine resin, and glass-polyimide resin. In addition, examples of heat sinks include copper-7 iron alloys, copper alloys, and the like. .

Furthermore, as an adhesive, there is an adhesive sheet called prepreg, which has good flowability. In addition, as adhesive materials,
Examples include epoxy resin, bismaleimide triazine resin (BT resin), and polyimide resin. Copper is also used as the material for the metal plating layer.

There are nickel, gold, etc.

Also, what is the clearance at the opposing parts?

It is preferable to set it as 0.05-0.3 agony. 0°05a
If it is less than m, the dimensional accuracy of the heat sink and the recess becomes difficult.
On the other hand, if it exceeds 0.3 wn, the width of the adhesive layer will become too large, and there is a risk that the metal plating layer will not be sufficiently formed.

Further, the depth of the exposed recess is 0.05 to 0.0. 211ff
It is preferable to set it to l, because if it is less than 0.05 mm, the thickness accuracy of the base material and the machining accuracy of the recess will be difficult, while if it exceeds 0.2 m, the load will be too large when machining the metal.

Furthermore, the width of the exposed recess is 0. 5-2. It is preferable to set it to 0no.If the diameter is less than 0.5mm, the diameter of the blade to be processed is too small and it will break easily.On the other hand, if it exceeds 2.0++m, the processing recess will become a dead space (Dead 5paCe) and the effective wiring area will be limited. This is because it becomes

Further, as a method for manufacturing the electronic component mounting board, there is a primary method. That is, first, a recess for joining a heat sink is provided on the back side of a base material in which a power supply circuit or a ground circuit is previously provided, and the heat sink is bonded to the recess through an adhesive, and the adhesive is filled up to the vicinity of the opening of the opposing portion of the recess side wall and the heat sink side wall on the back side of the base material.

Next, counterboring is performed across both the base material and the heat dissipation plate in the facing portion to form an exposed recessed portion exposing the adhesive. Next, a counterboring process is performed on the front side of the base material through the base material and the adhesive to the upper part of the heat sink to form a recess for mounting an electronic component. Thereafter, a continuous metal plating layer is formed between the heat sink, the exposed recess, and the back side of the base material, and a metal plating layer for a conductive layer is formed inside the electronic component mounting recess.

Further, in the above-mentioned bonding, it is preferable to allow the adhesive to slightly protrude into the opening of the facing portion.

This confirms that the adhesive has been completely filled up to the opening of the facing portion. This protruding adhesive is removed together with the heat dissipation plate and the base material in the opposing portion when forming the exposed recess.

In addition, the shape of the exposed recess is square (Fig. 3C),
Semicircular (Fig. 5), triangular (Fig. 6).

Use a shape such as an ellipse (Fig. 7) that makes it easy to plate the exposed part of the adhesive.

Furthermore, either a power supply terminal or a grounding terminal is provided on the conductive layer provided in the electronic component mounting recess. For example, if a ttA terminal is provided on the conductive layer, a grounding terminal is provided in the same manner as in the conventional case.

Further, these conductive layers, power supply terminals, and ground terminals are integrally provided, for example, by applying metal plating to the electronic component mounting recess and the periphery of its opening.

In addition, as a means to conduct the conductive layer to the outside of the base material,
Inside the base material, it leads to the outside through a through hole, etc.

One method is to provide a wide metal layer (for example, an internal power supply circuit). There is also a method of directly establishing electrical continuity with a heat sink provided at the bottom of the electronic component mounting recess.

Further, a signal terminal is provided at the opening periphery of the electronic component mounting recess. The signal terminal is the tip of a signal pattern provided on the base material. On the other hand, the power supply terminal or the ground terminal has a shape in which a part of the conductive layer provided on the side wall of the recess for mounting an electronic component extends a little toward the periphery of the opening. The signal terminal, power supply terminal, or ground terminal is located at the periphery of the opening.
They are arranged in a state where they are mutually connected (see Fig. 2).

In addition, the present invention provides a laminated electronic component mounting board in which a first base material and a second base material are laminated, and a power terminal is formed on one base material and a ground terminal is formed on the other base material. (See FIGS. 8 and 9). This material is obtained by laminating one more layer of a second base material on the same first base material as above.

The second base material has an opening above the electronic component mounting recess, and the same conductive layer as described above is provided in the opening. Further, the conductive layer is provided with a power supply terminal or a ground terminal. Furthermore, the second base material can be provided in two or more layers.

In such a laminated board, the power supply circuit and the ground circuit can be formed arbitrarily and large, and the functionality of the layer can be improved.

In other words, the most important thing in this laminated board is the first
A base material and a second base material are laminated, and an electronic component mounting recess provided in the first base material and the opening periphery thereof are provided.

Similarly to the above, a first conductive layer and a signal terminal and a power supply terminal (or a grounding terminal) that are connected to each other are provided, and a second conductive layer and a mutually connected signal terminal and a power terminal (or ground terminal) are provided in the opening of the second base material and the periphery of the opening. It is to provide a signal terminal and a grounding terminal (or power supply terminal).

The power supply terminal is provided on either the first base material side or the second base material side, and the grounding terminal is provided on the side where the power supply terminal is not provided. Further, the formation of the first conductive layer, the second conductive layer, the power supply terminal, the ground terminal, etc. are the same as described above.

[For production]

In the electronic component mounting board of the present invention, the exposed recess is provided across the three base materials and the heat sink, and the adhesive is exposed on the same surface in the exposed recess.

Therefore, when a metal plating layer is coated on the back side of the base material.

The metal plating layer is completely formed on the surface of the exposed recess.

In other words, the exposed recess has a ceiling surface formed on the same plane with the heat sink, the adhesive, and the base material arranged in this order. Therefore,
A metal plating layer will be continuously formed between these. If, as in the prior art, no adhesive is present in the opposing portions, or if the adhesive is protruding, a completely continuous metal plating layer cannot be formed.

Further, in the present invention, an adhesive is filled between the opposing portions, and then the opening of the opposing portion is counterbored to form an exposed recess. Therefore, the adhesive is used in an amount sufficient to fill the facing portion, and may be allowed to overflow depending on the case. Therefore, to prevent the adhesive from spilling out like in the past,
Moreover, there is no need to adjust the amount just right for filling.

Furthermore, in the present invention, there is no need to increase the distance between the opposing portions as in the prior art described above. Therefore, the heat sink can be made as large as possible for pattern formation, and heat dissipation can be improved.

In addition, in the second invention, since a continuous metal plating layer is formed on the back side of the base material of the heat dissipation plate and the exposed recess, moisture will not infiltrate into the child component mounting portion from the back side of the base material.

On the other hand, on the front side of the base material, the power supply terminal or the ground terminal is connected to the connection terminal of the electronic component by a bonding wire. The power supply terminal or ground terminal is connected to a power supply or ground outside the base material through the conductive layer and an internal circuit. Further, the signal terminals are also connected to the connection terminals of the electronic components using bonding wires.

The signal terminal is electrically connected to the signal pattern of the conductor circuit.

The conductive layer is provided on the side wall of the electronic component mounting recess and has a large conductive area, so the internal power supply circuit or internal grounding circuit leading to the outside can be enlarged, and the power supply circuit or grounding circuit can be converted into a low-inductance circuit. It can be done.

Furthermore, when the signal terminal and the power supply terminal or ground terminal are arranged in parallel, the connection terminals of the electronic components and each of the above terminals can be spaced approximately the same, and the connection of the bonding wire is easy.

〔effect〕

Therefore, according to one aspect of the present invention, the metal plating layer on the opposing portions is reliably formed, and the power supply circuit or the grounding circuit can be made into a low-inductance circuit.

It is possible to provide a board for mounting electronic components that is highly functional and has excellent heat dissipation.

〔Example〕

First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.

The electronic component mounting board 1 of this example is as shown in FIG.
A base material 10 having a conductor circuit 94 as a signal pattern on the front side and an internal power supply circuit 15 inside, a recess 13 for mounting an electronic component provided in the base material 10, and a recess 13 provided on the opposite side thereof. Recess 11 larger than electronic component mounting recess 13
(See Figures 3A and 3C) and adhesive 3 in the cough recess 11.
The heat dissipation plate 2 is fixed to the heat dissipation plate 2 through a heat dissipation plate 2 and has its back surface exposed to the electronic component mounting recess 13.

Then, on the back side of the base material 10, an exposed recess 4 is provided at an opposing portion where the side wall 12 of the recess 11 and the side wall 21 of the heat sink 2 are opposed. The exposed recess 4 is formed in the opposing portion, spanning both the heat dissipation plate 2 and the base material 10. The ceiling surface of the exposed recess 4 is such that the heat sink, the exposed adhesive, and the base material are on the same plane. Also,
A continuous metal plating layer 75 is coated on the heat sink, the exposed recess, and the back side of the base material.

Further, on the front side of the base material 10, a metal-plated conductive layer 76 is formed on the inner surface of the electronic component mounting recess 13, and a conductive circuit 94 is formed on the upper surface of the base material. Furthermore, the base material 10
In the through hole 98 of.

A conductor bin 99 is inserted. A metal plating layer 981 is formed inside the through hole 98 .

As shown in FIG. 2, the internal power supply circuit 15 is connected to the outer wall surface of the metal-plated conductive layer 76. The internal power supply circuit 15 is provided with a width as large as 100 times or more the line width of the power source 94.The internal power supply circuit 15 is connected to the power supply through hole 98.

Moreover, on the opening periphery of the electronic component mounting recess 13.

The IT source terminal 151 is formed on the conductive layer 76 by simultaneous plating. In addition, the power supply terminal 151
In parallel, the signal terminal 9 of the signal pattern conductor circuit 94
41. The grounding terminals 181 of the grounding circuit 18 are provided in parallel with each other in a mutually connected state.

Next, regarding the manufacturing method of the electronic component mounting board 1, the third
This will be explained using Figures A to 3E.

First, as shown in FIG. 3A, a recess 11 for arranging a heat sink is provided on the back side of the base material 10 by counterboring. The recess 11 has a side wall 12 and a ceiling surface 111. Further, the base material 10 has an internal power supply circuit 15 therein. That is, the base material 10 is.

The internal power supply circuit 15 is formed on a thin insulating base material by plating, and another insulating base material is adhered thereon.

Further, the base material 10 is provided with a copper foil 19 on its surface.

Next, as shown in FIG. 3B, the heat dissipation plate 2 is bonded into the recess 11 with the adhesive 3 interposed therebetween. At this time, the adhesive 3 is filled between the ceiling surface 111 of the recess 11 and the heat sink 2 and between the side wall 12 of the recess 11 and the side wall 21 of the heat sink 2, that is, in the opposing portion 120. . Further, the adhesive 3 overflows outward from the opening 121 of the facing portion 120 to form a protruding portion 31 . Therefore, heat sink 2
The space between and the recess 11 is completely filled with adhesive.

Next, as shown in FIG. 3C, a counterbore process is performed across both the base material 10 and the heat sink 2 in the opposing portion 120 to form the exposed recess 4.

The ceiling surface of the exposed recess 4 is formed by a stepped portion 14 formed on the base material 1.
and the exposed surface 32 of the adhesive 3 exposed between the stepped portions 21 and 5 formed on the heat sink 2, and these are on the same plane.

On the other hand, on the front side of the base material, the electronic component mounting recess 13
is formed by counterbore processing to expose the back surface of the heat sink plate 2. Further, in the electronic component mounting recess 13, the side wall 131, the cut surface 152 of the internal power supply circuit 15, and the exposed surface 33 of the adhesive are on the same plane. Further, the electronic component mounting recess 13 is a hole smaller than the recess 11.

Next, as shown in FIG. 3D, on the back side of the base material 10, the heat sink 2. Exposed recess 4. A continuous metal plating layer 75 is formed on the surface of the base material 10. Also, on the front side of the base material 10, a conductive layer 76 is formed in the electronic component mounting recess 13 by metal plating. These metal plating layers 75. Conductive layer 76
The formation of is performed at the same time.

Furthermore, when forming the conductive layer 76, its outer surface is connected to the cut surface 152 of the internal power supply circuit 15. Thereafter, a conductor circuit 94 is formed by etching as shown in the third E[i4]. Further, a power supply terminal 151 (FIGS. 1 and 2) is formed around the opening of the electronic component mounting recess 13.

Through the above steps, the child component mounting board 1 is manufactured.

This device is similar to that shown in FIGS. 1 and 2 above.

Further, as shown in FIGS. 3E and 4, a continuous metal plating layer 75 is formed on the base material 10 on the back side of the electronic component mounting board l.

Next, each action and effect will be explained.

As described above, the electronic component mounting board 1 of this example has the exposed recess 4 extending over the base material 1 and the heat sink 2 in the opposing portion 120, and the base material 1. Exposed recess 4. A continuous metal plating layer 75 is provided on the heat sink 2. And in the exposed recess 4.

As shown in FIG. 3C, the stepped portion 14 of the base material, the exposed surface 32 of the adhesive, and the stepped portion 21 of the heat sink are on the same plane. Therefore, the metal plating layer 75 is reliably and continuously formed on these surfaces.

Further, in this example, as shown in FIG. 3B, when bonding the heat sink 2, a protruding portion 31 of the adhesive 3 is formed. Therefore, the adhesive 3 is completely filled between the heat sink 2 and the recess 11. This protruding portion 31 is
As shown in FIG. 3C, it is removed when forming the exposed recess 4 by counterboring.

Therefore, the exposed surface 32 of the adhesive 3 is always formed on the surface of the exposed recess 4, and the metal plating layer 75 is reliably formed. Further, there is no need to adjust the amount of adhesive in order to prevent the adhesive from extruding, to fill the adhesive, etc., as in the conventional case.

Further, unlike the prior art, there is no need to increase the distance between opposing parts, so the heat sink can be disposed as large as possible within the recess, improving heat dissipation. Also,
Since a continuous metal plating layer 75 is formed on the heat sink, the exposed recess, and the back side of the base material, moisture will not infiltrate from the back side of the base material into the electronic component mounting portion of the internal power supply circuit 15 as well.

In addition, in the five examples of electronic component mounting boards.

Since the conductive layer 76 to which the power supply terminal 151 is connected is provided on the side wall and bottom surface of the electronic component mounting recess 13, the internal power supply circuit 15 can also have a large power supply circuit. Therefore, the power supply circuit can be made into a low-inductance circuit, and it can correspond to higher functionality of electronic components.

Further, a signal terminal 941 provided on the opening periphery of the electronic component mounting recess 13. ii source terminal 151. Grounding terminal 181
are arranged in parallel, so each terminal and electronic component 8
The bonding wire 89 can be easily connected to the connection terminal 87 of No. 8 (FIG. 1).

Note that the positions of the power terminal 151 and the ground terminal 181 can be reversed to use the power terminal 151 as the ground terminal and the ground terminal 181 as the power terminal.

In addition, a heat dissipation fin is attached to the heat dissipation plate.

It is also possible to improve heat dissipation.

Second Embodiment In this embodiment, as shown in FIGS. 5 to 7, the shape of the exposed recess 4 in the first embodiment is variously changed.

That is, the exposed recess 4 shown in FIG. 5 has a semicircular shape and consists of an arcuate surface 141 of the base material 1, an exposed surface 32 of the adhesive, and an arcuate surface 212 of the heat sink.

Further, the exposed recess 4 shown in FIG. 6 is triangular.

It consists of the slope 142 of the base material 1, the exposed surface 32 of the adhesive, and the slope 213 of the heat sink.

Furthermore, the exposed recess 4 shown in FIG. 7 has a substantially elliptical shape and includes the arc surface 143 of the base material 1, the exposed surface 32 of the adhesive, and the arc surface 21 of the heat sink.
4 and more.

In any of the above-mentioned exposed recesses, the above-mentioned surfaces are on a continuous plane. Therefore, as in the first embodiment, a continuous metal plating layer can be reliably formed on the surface, and the same effect can be obtained.

Third embodiment A specific example of the first embodiment will be described.

In this example, a copper-clad laminate made of bismaleimide-triazine resin (BT resin) was used as the base material 10.

The recess 11 for arranging the heat sink has a depth of 1. 2mm, vertical,
It was made into an angular recess with a width of 20 mm each. A copper plate is used as the heat dissipation plate 2, and its thickness is 1.2 mm, and the vertical and horizontal directions are each 19.8 mm.
It was a square board. Therefore, the clearance of the facing portion 120 between the recess 11 and the heat sink 2 is approximately 0.10!1.

As the adhesive 3.35, a BT resin prepreg adhesive was used. For adhesion, heat and pressure bonding was performed at 170°C. At this time, the height of the protruding portion 31 was approximately 0.1 height. The depth of the exposed recess 4 is O, 1 m, and the width is 1 m.
．． It was 0 Peng. The exposed recess 4 has a square annular shape along the facing portion 120.

Metal plating layer 75. The conductive layer 76 is formed by an electroless method or an electrolytic method, and the thickness of the metal plating is about 20 μm.
Met. Further, the metal plating layer 75 is formed on the heat sink 2. Exposed recess 4. It was reliably formed continuously on the back side of the base material. The conductive layer 76 of metal plating was also continuously formed in the same way.

For comparison, the metal plating layer 75 was formed with the adhesive protruding portion 31 as shown in FIG. 3B. As a result, in the adhesive protruding portion 31,
There were some areas with poor plating where the metal plating layer was not covered.

Fourth Embodiment As shown in FIGS. 8 and 9, this example is a laminated type board in which, in addition to the electronic component mounting board of the first example, another second base material 100 is laminated thereon. This shows that.

The second base material 100 includes the conductor circuit 94 of the first embodiment.
It is bonded onto the prepreg adhesive 35 via prepreg adhesive 35.

Further, the second base material 100 has the above-mentioned electronic component mounting recess 13
It has an opening 105 with a larger diameter above it, and a second conductive layer 760 is formed around the opening 105 by metal plating. Also.

The second base material 100 has an internal grounding circuit 18 on its back surface in advance.
5 is a provision. One end of the internal grounding circuit 185 is connected to the grounding through hole 98.

The other side is connected to the second conductive layer 760 and has a wide width similarly to the internal power supply circuit 15. Further, a grounding terminal 186 extends from the second conductive layer 760. Moreover, on the upper surface of the second base material 100.

A conductor circuit 940 is provided.

Then, each connection terminal of the electronic component 88 in the electronic component mounting recess 13 and the signal terminal 941 of the power supply terminal 151 and the conductor circuit 94 are connected. Bonding wires 89 and 890 are connected between the grounding terminal 186 and the signal terminal 943 of the conductor circuit 940, respectively.

According to this example, it is possible to obtain the same effects as in the second embodiment.

Moreover, in this example, the ii source terminal 151 and the signal terminal 941. The grounding terminal 186 and the signal terminal 943 are arranged in parallel. Therefore, higher density wiring can be achieved than in the first embodiment.

In addition, the source terminal 151 and the ground terminal 186 are arranged on the wide-area conduction layer 76 and the second conduction layer 760, respectively, and the internal power supply circuit 15. Since the internal grounding circuit 185 is provided widely, the inductance of these circuits can be made low. Additionally, power supply terminal 151 and ground terminal 186
It can also be used with its purpose (power supply, grounding) reversed.

[Brief explanation of the drawing]

1 to 4 show the electronic component mounting board of the first embodiment, FIG. 1 is a sectional view thereof, FIG. 2 is a perspective view of the main parts thereof, and FIGS. 3A to 3E are manufacturing steps thereof. Explanatory diagram, Figure 4 is the 3rd
The back view of Fig. E, Figs. 5 to 7 are views showing the shape of the exposed recess in the second embodiment, and Figs. 8 and 9 show the laminated electronic component mounting board of the fourth embodiment, Fig. 8 is a cross-sectional view thereof, Fig. 9 is a perspective view of the main part thereof, Figs. 10 to 12 show a conventional board for mounting electronic components, Part 10 is a cross-sectional view of one example, and Fig. 11 is a sectional view showing the problem, and FIG. 12 is a sectional view of another conventional electronic component mounting board. 1. 10. 100. 1 1, . 12. 13. 120. 15. 151. 181.1 185. 21. . 21. 31. . 31. Board base material for mounting electronic components, second base material recess. Recess side wall. Concave part for mounting electronic components, opposing part. Internal power circuit. , power supply terminal. 86, Grounding terminal. , internal grounding circuit heat sink. Heat sink side wall adhesive. The protruding part. 411. Exposed recess 75, Metal plating layer 76, Conductive layer 760, Second conductive layer 941 943, Signal terminal

Claims (1)

[Scope of Claims] A base material having a conductive circuit, a recess provided in the base material for mounting an electronic component, a recess provided on the opposite side of the base material and having a diameter larger than the recess for mounting the electronic component, and the recess provided on the opposite side. A substrate for mounting electronic components comprising a heat dissipation plate that is fixed in place via an adhesive and whose back side is exposed to the recess for mounting the electronic components, the side wall of the recess and the side wall of the heat dissipation plate on the back side of the base material. An exposed recess that spans both the base material and the heat sink and exposes the adhesive on the same surface is provided in the opposing portion where the heat sink and the exposed recess are located on the same surface, and the heat sink, the exposed recess, and the back side of the base material are provided. is coated with a continuous metal plating layer, and a conductive layer that conducts to the outside of the base material is provided on the side wall of the electronic component mounting recess, and the conductive layer has a power terminal or a grounding terminal. A board for mounting electronic components, characterized by being provided with terminals.