JPH04125455U - heat sink - Google Patents

Abstract

(57) [Summary] [Purpose] The radiation fins of the heat sink are made of thin plates to facilitate the mounting of semiconductor devices. [Structure] A heat sink that has a space for mounting a semiconductor element by bonding it to a substrate by bending a thin plate that has been preprocessed or removed from the raw material in advance with the intended mounting position for the semiconductor element.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

A radiator is used as a heat sink to dissipate heat from equipment that generates heat. Ru.

0002

[Conventional technology]

Conventional heat sinks are molded from aluminum or extruded aluminum. Materials such as those made of wood are used.

0003

[Problem that the idea aims to solve]

Heat sinks with relatively large areas are mainly made of extruded aluminum. are used. This is made by continuously extruding the shape shown in Figure 1. Since it is molded, semiconductor elements etc. are attached to the heat sink as shown in Figure 1 and 2. If the It won't happen. This can be removed by machining, but this increases cost. Furthermore, if the ribs of the heat sink are thin, processing becomes difficult.

0004

[Means to solve the problem]

This invention consists of a heat dissipation rib made of a thin plate formed into a serpentine shape, making it easy to attach semiconductor elements. The space for this is removed in advance before the rib thin plate is meander-molded. young is processed. After that, when the serpentine heat dissipation ribs are combined with the substrate, it becomes a semiconductor. It is possible to obtain a heat sink without heat dissipation ribs at predetermined locations for mounting elements.

[0005]

[Effect]

The heat sink of this invention is a heat sink that uses conventional aluminum extrusion molding material. As with the case of Processing is possible because it can be processed in pre-processing without removing it, or because only a small amount of post-processing is required. Good efficiency.

[0006]

Example 1 FIG. 2 shows Example 1. In advance, attach the semiconductor element mounting part to 1 in Figure 5. The heat sink material removed as surrounded by the line 0 is folded as shown in 6 in Fig. 2 to form the board 5. Solder in step 7. 10 removed in Figure 5 becomes 8 in Figure 2, and this space A required semiconductor element 9 can be attached to.

[0007]

[Example 2] FIG. 3 shows the second embodiment of the present invention. The heat fin 12 is soldered at 13 in contact with the board 11. Upper side of heat dissipation fin 12 Solder the top plate 14 with the mounting hole 16 and the contact surface 15 of the heat dissipation fin. Ru.

[0008]

[Embodiment 3] FIG. 4 shows a heat dissipation pipe bent on the substrate 17, showing Embodiment 3. The pins 18 are in contact, and the junction point 19 is soldered to 17. 20 is a semiconductor element 21 installation space.

[0009]

[Example 4] Figure 7. FIG. 8 shows Example 4. Figure on heat sink material 22 before processing As shown in 6, pre-slits 23. 24, this is shown in Figure 7. After folding as shown in Figure 8, 25. If you cut out part 26 by the width of B in Figure 6, A heat radiation rib having a semiconductor mounting space similar to 6 in FIG. 2 can be obtained.

0010

Example 5 FIG. 9 shows Example 5. In Example 4, the heat sink before processing Cut 23 into the material 22 only in the length direction. 24, but in Example 5, this In addition, a connecting part E that can be easily separated from the material is left within the widthwise distance B, and a part D is formed. Make a notch. After folding this as in Example 4, cut the E part. In this case, a heat radiation rib similar to that in Example 4 can be obtained.

[0011]

[Effect of the idea]

The heat dissipation fins of this heatsink are thin plates, so they are different from the conventional aluminum extrusion type. It does not weigh as much as other materials, and it is suitable for mounting semiconductor elements, which is expensive. No post-processing is required or it can be handled with only a small amount of post-processing.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an example of a conventional heat sink.

FIG. 2 is a perspective view showing Embodiment 1 of the present invention.

FIG. 3 is a perspective view showing a second embodiment.

FIG. 4 is a perspective view showing a third embodiment.

[Fig. 5] A plan view of the developed heat dissipation fin of Example 1 in Fig. 2, taken along A-A at the − part.

[Fig. 6] Fig. 6 is a plan view of a part of the heat dissipation plate before folding in Example 4, taken along line D-D.

FIG. 7 shows a state in which the heat sink material of FIG. 6 is folded.

FIG. 8 shows a sectional view taken along line EE in FIG. 7;

[Fig. 9] Fig. 9 is a plan view of a part of the expanded heat dissipation fin of Example 5, cut along F-F.

[Explanation of symbols]

1 Heat sink substrate 2 Semiconductor element 3 Heat sink heat dissipation fin 4 Space for semiconductor attachment 5 Heat sink substrate 6 Heat sink heat dissipation fin 7 Joint area between substrate and fin 8 Space for semiconductor element attachment 9 Semiconductor element 10 Open in the heat dissipation fin material Removal portion 11 for attaching a semiconductor element Heat sink board 12 Heat dissipation fin 13 Joint part 14 between the board and heat dissipation fin Top plate 15 Joint part 16 between the top plate and heat dissipation fin Space 17 for mounting a semiconductor element Substrate 18 Heat dissipation fin 19 Substrate and the joint portion 20 of the heat dissipation fin, the space 21 for mounting the semiconductor element, and the semiconductor element 22. Heat sink rib 23 of Example 4. Cuts made in the heat sink material of Example 4 24. Cuts made in the heat sink material of Example 4 25. Cutting section 26.23.24 in FIG. Cutting section to cut out 23.24 in Figure 7

Claims (4)

[Scope of utility model registration request] Claim 1: In a heat sink made by brazing a heat sink made of a meander-molded thin plate onto a base, the thin plate of the heat sink is made of a material by cutting out the semiconductor element mounting portion in advance to create a space,
The thin plate is then meander-molded and bonded to a substrate to form a heatsink. 2. A heat radiator according to claim 1, wherein the serpentine-molded thin plate heat radiator is joined between a substrate and a top plate having predetermined holes for mounting semiconductor elements. [Claim 3] In a heatsink in which a heatsink plate made of a meander-molded thin plate is brazed onto a substrate, the thin plate of the heatsink material is pre-cut in the length direction of the semiconductor mounting portion and folded. , followed by notching 25 and 26 in FIG. 8, and a heat radiator having heat radiator ribs. 4. In claim 3, the notch for the semiconductor mounting portion is made in the width direction B, as shown in FIG. 9, by making a notch in the D portion leaving the connecting portion E, and cutting the E portion after folding the material. A radiator that obtains heat radiating ribs similar to Example 4.