JPH04125455U - heat sink - Google Patents
heat sinkInfo
- Publication number
- JPH04125455U JPH04125455U JP5929791U JP5929791U JPH04125455U JP H04125455 U JPH04125455 U JP H04125455U JP 5929791 U JP5929791 U JP 5929791U JP 5929791 U JP5929791 U JP 5929791U JP H04125455 U JPH04125455 U JP H04125455U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thin plate
- heat
- substrate
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 13
- 238000005219 brazing Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000012805 post-processing Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【目的】 ヒートシンクの放熱フインを薄板で構成して
半導体素子の取付けを容易にした。
【構成】 予め半導体素子取付け位置想定部分を素材の
状態で取り除いたもの若しくは前加工した薄板を折り曲
げ加工することにより、これと基板の接合で半導体素子
取付けスペースを保有するヒートシンク。
(57) [Summary] [Purpose] The radiation fins of the heat sink are made of thin plates to facilitate the mounting of semiconductor devices. [Structure] A heat sink that has a space for mounting a semiconductor element by bonding it to a substrate by bending a thin plate that has been preprocessed or removed from the raw material in advance with the intended mounting position for the semiconductor element.
Description
【0001】0001
放熱器はヒートシンクとして、熱を発生する機器の放熱用として用いられてい る。 A radiator is used as a heat sink to dissipate heat from equipment that generates heat. Ru.
【0002】0002
従来のヒートシンクはアルミニウムで成型したもの、アルミニウムの押出し型 材によるものなどが用いられている。 Conventional heat sinks are molded from aluminum or extruded aluminum. Materials such as those made of wood are used.
【0003】0003
比較的面積の大きいヒートシンクは、主としてアルミニウムの押出し型材によ るものが用いられている。これは第1図の如き形状のものを連続して押し出し成 型するのであるから第1図2の如く、ヒートシンクに半導体素子などを取り付け る場合、所要箇所のヒートシンクの放熱リブを4の部分の如く取り除かなければ ならない。 これは機械加工により取り除くことができるがコストが高くなる。 又、ヒートシンクのリブが薄いと加工は困難となる。 Heat sinks with relatively large areas are mainly made of extruded aluminum. are used. This is made by continuously extruding the shape shown in Figure 1. Since it is molded, semiconductor elements etc. are attached to the heat sink as shown in Figure 1 and 2. If the It won't happen. This can be removed by machining, but this increases cost. Furthermore, if the ribs of the heat sink are thin, processing becomes difficult.
【0004】0004
本考案は放熱リブを薄い板を蛇行成型したもので構成し、半導体素子取付けの ためのスペースは、リブ用薄板を蛇行成型する前に予め取り除いて置く。若しく は加工しておく。然る後に蛇行成型した放熱リブを基板と組み合わせると半導体 素子取付けの所定設定箇所に放熱リブのないヒートシンクを得ることができる。 This invention consists of a heat dissipation rib made of a thin plate formed into a serpentine shape, making it easy to attach semiconductor elements. The space for this is removed in advance before the rib thin plate is meander-molded. young is processed. After that, when the serpentine heat dissipation ribs are combined with the substrate, it becomes a semiconductor. It is possible to obtain a heat sink without heat dissipation ribs at predetermined locations for mounting elements.
【0005】[0005]
本考案のヒートシンクは従来のアルミニウム押し出し成型材を用いたヒートシ ンクのように、半導体素子取付けのためのスペースを放熱リブを後加工により取 り除かなくても前加工で処理できるから、若しくは僅かな後加工ですむから加工 効率が良い。 The heat sink of this invention is a heat sink that uses conventional aluminum extrusion molding material. As with the case of Processing is possible because it can be processed in pre-processing without removing it, or because only a small amount of post-processing is required. Good efficiency.
【0006】[0006]
【実施例1】 図2は実施例1を示す。予め半導体素子取付け部を図5の1 0の線で囲んだように除去した放熱板素材を図2の6の如く折り加工し基板5と 7でハンダ付けする。図5で除去した10は、図2において8となり、この空間 に所要半導体素子9を取り付けることができる。Example 1 FIG. 2 shows Example 1. In advance, attach the semiconductor element mounting part to 1 in Figure 5. The heat sink material removed as surrounded by the line 0 is folded as shown in 6 in Fig. 2 to form the board 5. Solder in step 7. 10 removed in Figure 5 becomes 8 in Figure 2, and this space A required semiconductor element 9 can be attached to.
【0007】[0007]
【実施例2】 図3は実施例2を示す、基板11の上に折り曲げ加工した放 熱フイン12を基板11と接する13でハンダ付けする。放熱フイン12の上側 は取付け穴16のある上面板14と放熱フインの接触面15でハンダ付けしてな る。[Example 2] FIG. 3 shows the second embodiment of the present invention. The heat fin 12 is soldered at 13 in contact with the board 11. Upper side of heat dissipation fin 12 Solder the top plate 14 with the mounting hole 16 and the contact surface 15 of the heat dissipation fin. Ru.
【0008】[0008]
【実施例3】 図4は実施例3を示す、基板17上に曲げ加工した放熱フイ ン18が接し、その接合点19を17とハンダ付けする。20は半導体素子21 の取付けスペース。[Embodiment 3] FIG. 4 shows a heat dissipation pipe bent on the substrate 17, showing Embodiment 3. The pins 18 are in contact, and the junction point 19 is soldered to 17. 20 is a semiconductor element 21 installation space.
【0009】[0009]
【実施例4】 図7.図8は実施例4を示す。加工前の放熱板素材22に図 6の如く予め間隔B長さCの切り込み23. 24を入れておく、これを第7図 の如く折り加工した後図8の25. 26部分を図6のBの幅だけ切り取れば、 図2の6と同様の半導体取付けスペースを有する放熱リブを得ることができる。[Example 4] Figure 7. FIG. 8 shows Example 4. Figure on heat sink material 22 before processing As shown in 6, pre-slits 23. 24, this is shown in Figure 7. After folding as shown in Figure 8, 25. If you cut out part 26 by the width of B in Figure 6, A heat radiation rib having a semiconductor mounting space similar to 6 in FIG. 2 can be obtained.
【0010】0010
【実施例5】 図9は実施例5を示す。実施例4においては加工前の放熱板 素材22に長さ方向にのみ切り込み23. 24を加工したが実施例5では、こ れに更に幅方向B間隔内に素材と容易に分離できるつながり部Eを残してD部分 に切り込みを入れる。これを、実施例4の如く折加工した後、E部分をカットす れば、実施例4と同様の放熱リブを得ることができる。Example 5 FIG. 9 shows Example 5. In Example 4, the heat sink before processing Cut 23 into the material 22 only in the length direction. 24, but in Example 5, this In addition, a connecting part E that can be easily separated from the material is left within the widthwise distance B, and a part D is formed. Make a notch. After folding this as in Example 4, cut the E part. In this case, a heat radiation rib similar to that in Example 4 can be obtained.
【0011】[0011]
本ヒートシンクの放熱フインは薄板であるから、従来のアルミニウム押出し型 材の如く重量が大となることもなく、又、コストの高い半導体素子取付けのため の後加工が不要で若しくは僅少な後処理で対処することができる。 The heat dissipation fins of this heatsink are thin plates, so they are different from the conventional aluminum extrusion type. It does not weigh as much as other materials, and it is suitable for mounting semiconductor elements, which is expensive. No post-processing is required or it can be handled with only a small amount of post-processing.
【図1】従来のヒートシンクの一例を示す斜視図。FIG. 1 is a perspective view showing an example of a conventional heat sink.
【図2】本考案の実施例1を示す斜視図。FIG. 2 is a perspective view showing Embodiment 1 of the present invention.
【図3】図3は実施例2をしめす斜視図。FIG. 3 is a perspective view showing a second embodiment.
【図4】図4は実施例3を示す斜視図。FIG. 4 is a perspective view showing a third embodiment.
【図5】図2の実施例1の放熱フインを展開したものの
−部でA−Aで破断した平面図[Fig. 5] A plan view of the developed heat dissipation fin of Example 1 in Fig. 2, taken along A-A at the − part.
【図6】図6は実施例4の折り加工前の放熱板を示す一
部で、D−Dで破断した平面図[Fig. 6] Fig. 6 is a plan view of a part of the heat dissipation plate before folding in Example 4, taken along line D-D.
【図7】図7は図6の放熱板素材を折り加工した状態を
示す。FIG. 7 shows a state in which the heat sink material of FIG. 6 is folded.
【図8】図8は図7のE−E断面図を示す。FIG. 8 shows a sectional view taken along line EE in FIG. 7;
【図9】図9は実施例5の放熱フィンを展開したものの
一部でF−Fで破断した平面図[Fig. 9] Fig. 9 is a plan view of a part of the expanded heat dissipation fin of Example 5, cut along F-F.
1 ヒートシンク基板
2 半導体素子
3 ヒートシンクの放熱フイン
4 半導体取付けのためのスペース
5 ヒートシンク基板
6 ヒートシンクの放熱フイン
7 基板とフインの接合部
8 半導体素子取付けのためのスペース
9 半導体素子
10 放熱フイン素材に開けられた半導体取付けのため
の除去部分
11 ヒートシンク基板
12 放熱フイン
13 基板と放熱フインの接合部
14 上面板
15 上面板と放熱フインの接合部
16 半導体素子取付けのためのスペース
17 基板
18 放熱フイン
19 基板と放熱フインの接合部
20 半導体素子取付けのためのスペース
21 半導体素子
22.実施例4の放熱板リブ
23.実施例4の放熱板素材に加工した切り込み
24.実施例4の放熱板素材に加工した切り込み
25.図7において23.24を切り取る切断部
26.図7において23.24を切り取る切断部1 Heat sink substrate 2 Semiconductor element 3 Heat sink heat dissipation fin 4 Space for semiconductor attachment 5 Heat sink substrate 6 Heat sink heat dissipation fin 7 Joint area between substrate and fin 8 Space for semiconductor element attachment 9 Semiconductor element 10 Open in the heat dissipation fin material Removal portion 11 for attaching a semiconductor element Heat sink board 12 Heat dissipation fin 13 Joint part 14 between the board and heat dissipation fin Top plate 15 Joint part 16 between the top plate and heat dissipation fin Space 17 for mounting a semiconductor element Substrate 18 Heat dissipation fin 19 Substrate and the joint portion 20 of the heat dissipation fin, the space 21 for mounting the semiconductor element, and the semiconductor element 22. Heat sink rib 23 of Example 4. Cuts made in the heat sink material of Example 4 24. Cuts made in the heat sink material of Example 4 25. Cutting section 26.23.24 in FIG. Cutting section to cut out 23.24 in Figure 7
Claims (4)
盤上にロー付けしてなる放熱器において素材の放熱板の
薄板を半導体素子取付け部分を予め切除し空間となし、
然る後に該薄板を蛇行成型し、基板と接合してなる放熱
器。Claim 1: In a heat sink made by brazing a heat sink made of a meander-molded thin plate onto a base, the thin plate of the heat sink is made of a material by cutting out the semiconductor element mounting portion in advance to create a space,
The thin plate is then meander-molded and bonded to a substrate to form a heatsink.
放熱板を基板及び予め設定の半導体素子取付けのための
穴をあけた上面板との間に接合してなる放熱器。2. A heat radiator according to claim 1, wherein the serpentine-molded thin plate heat radiator is joined between a substrate and a top plate having predetermined holes for mounting semiconductor elements.
板上にロー付けしてなる放熱器において、素材の放熱板
の薄板に半導体取付け部分の長さ方向に予め切り込みを
入れて折り加工し、然る後に図8の25,26を切り欠
いてなる、放熱器リブを持つ放熱器。[Claim 3] In a heatsink in which a heatsink plate made of a meander-molded thin plate is brazed onto a substrate, the thin plate of the heatsink material is pre-cut in the length direction of the semiconductor mounting portion and folded. , followed by notching 25 and 26 in FIG. 8, and a heat radiator having heat radiator ribs.
り込みを幅B方向に図9の如く、つながり部分Eを残し
てD部分に切り込みを入れ、素材を折り加工した後E部
分をカツトして実施例4と同様の放熱リブを得る放熱
器。4. In claim 3, the notch for the semiconductor mounting portion is made in the width direction B, as shown in FIG. 9, by making a notch in the D portion leaving the connecting portion E, and cutting the E portion after folding the material. A radiator that obtains heat radiating ribs similar to Example 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5929791U JPH04125455U (en) | 1991-04-26 | 1991-04-26 | heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5929791U JPH04125455U (en) | 1991-04-26 | 1991-04-26 | heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04125455U true JPH04125455U (en) | 1992-11-16 |
Family
ID=31929979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5929791U Pending JPH04125455U (en) | 1991-04-26 | 1991-04-26 | heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04125455U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10145065A (en) * | 1996-11-13 | 1998-05-29 | Pro Saido Kk | Cooling material |
JP2019204498A (en) * | 2018-05-24 | 2019-11-28 | 廣達電腦股▲ふん▼有限公司Quanta Computer Inc. | Cooling device and server device |
-
1991
- 1991-04-26 JP JP5929791U patent/JPH04125455U/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10145065A (en) * | 1996-11-13 | 1998-05-29 | Pro Saido Kk | Cooling material |
JP2019204498A (en) * | 2018-05-24 | 2019-11-28 | 廣達電腦股▲ふん▼有限公司Quanta Computer Inc. | Cooling device and server device |
US10779439B2 (en) | 2018-05-24 | 2020-09-15 | Quanta Computer Inc. | Remote heat exchanger |
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