JPH04123539U - bonding tools - Google Patents
bonding toolsInfo
- Publication number
- JPH04123539U JPH04123539U JP1991028170U JP2817091U JPH04123539U JP H04123539 U JPH04123539 U JP H04123539U JP 1991028170 U JP1991028170 U JP 1991028170U JP 2817091 U JP2817091 U JP 2817091U JP H04123539 U JPH04123539 U JP H04123539U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- guide hole
- bonding tool
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】 ボンディングツールのガイド穴にワイヤの位
置決めを行なう手段を設けることにより、ワイヤボンデ
ィング位置精度の良好なボンディングツールを提供す
る。
【構成】 超音波ボンディングに用いられボンディング
ツールにおいて、ボンディングツールを貫通するガイド
穴１２と、該ガイド穴１２の内部からボンディング面１
５に接する出口部分に形成されるボンディングワイヤ１
０をガイドする細溝１６を設ける。
(57) [Summary] [Objective] A bonding tool with good wire bonding position accuracy is provided by providing a means for positioning a wire in a guide hole of the bonding tool. [Structure] A bonding tool used for ultrasonic bonding includes a guide hole 12 that passes through the bonding tool, and a bonding surface 1 from inside the guide hole 12.
Bonding wire 1 formed at the exit portion in contact with 5
A narrow groove 16 is provided to guide 0.
Description
【０００１】0001
本考案は、半導体装置の組立装置であるワイヤボンディングに使用するボンデ ィングツールに関するものである。 This invention is a bonding device used in wire bonding, which is an assembly device for semiconductor devices. It is related to the planning tools.
【０００２】0002
従来、このような分野の技術としては、例えば、以下に示されるようなものが あった。 図３は従来の超音波ボンディングに使用するボンディングツールの先端部の断 面図、図４はそのボンディングツールの先端部の下面図である。 Conventional technologies in this field include, for example, the following: there were. Figure 3 shows a cross-section of the tip of a bonding tool used in conventional ultrasonic bonding. FIG. 4 is a bottom view of the tip of the bonding tool.
【０００３】 これらの図に示すように、ボンディングツール１には、ワイヤ１０を挿通する ガイド穴２が形成されており、その入口部３はワイヤ１０を挿入しやすいように 、ラッパ状となり、出口部４はワイヤ１０を半導体素子等の電極に押圧するボン ディング面５に接するように配置され、その出口部４の形状は４ａに示すように 、円弧状となっている。0003 As shown in these figures, a wire 10 is inserted into the bonding tool 1. A guide hole 2 is formed, and its entrance portion 3 is designed to facilitate insertion of the wire 10. , has a trumpet shape, and the exit portion 4 is a bomb that presses the wire 10 against an electrode of a semiconductor device or the like. The exit portion 4 is arranged so as to be in contact with the exit surface 5, and the shape of the exit portion 4 is as shown in 4a. , is arc-shaped.
【０００４】0004
しかしながら、上記した従来のボンディングツールでは、ガイド穴２は放電加 工処理で形成されるために、微細な穴径加工が困難であり、更に、ワイヤ１０の 挿通を容易とするために、ワイヤ径に比べ大きな穴径が必要であり、出口部４の 形状の円弧も大きくなるため、微細なワイヤを用いた場合でも、ワイヤはガイド 穴の出口部で位置ずれを生じ、半導体素子等の電極上にワイヤをボンディングし た際にも、位置ずれが大きく、接続密度の向上が図れないという問題があった。 However, in the conventional bonding tool described above, the guide hole 2 is Since it is formed by a machining process, it is difficult to process a minute hole diameter, and furthermore, the wire 10 is In order to facilitate insertion, the hole diameter must be larger than the wire diameter, and the The arc of the shape also becomes larger, so even when using a fine wire, the wire cannot be guided. Misalignment occurs at the exit of the hole, and the wire is bonded onto the electrode of a semiconductor device, etc. Even when this was done, there was a problem that the positional shift was large and it was not possible to improve the connection density.
【０００５】 本考案は、以上述べたボンディングツールのガイド穴の出口部で、ワイヤが位 置ずれを生じ、ワイヤボンディング位置がずれるという問題点を除去するために 、ボンディングツールのガイド穴にワイヤの位置決めを行なう手段を設けること により、ワイヤボンディング位置精度の良好なボンディングツールを提供するこ とを目的とする。[0005] In this invention, the wire is positioned at the exit of the guide hole of the bonding tool described above. In order to eliminate the problem of wire bonding position shifting due to misalignment. , provide a means for positioning the wire in the guide hole of the bonding tool. This enables us to provide bonding tools with good wire bonding position accuracy. aimed to.
【０００６】[0006]
本考案は、上記目的を達成するために、超音波ボンディングに用いられるボン ディングツールにおいて、ボンディングツールを貫通するガイド穴と、該ガイド 穴の内部からボンディング面に接する出口部分に形成されるボンディングワイヤ をガイドする細溝を設けるようにしたものである。 In order to achieve the above object, the present invention has developed a bond for use in ultrasonic bonding. In the bonding tool, a guide hole passing through the bonding tool and the guide Bonding wire formed from inside the hole to the exit part that contacts the bonding surface A thin groove is provided to guide the
【０００７】[0007]
本考案によれば、上記のように、ボンディングツールを貫通するガイド穴と、 該ガイド穴の内部からボンディング面に接する出口部分に形成されるボンディン グワイヤをガイドする細溝を設けるようにしたので、ボンディング面でのワイヤ の位置決めを精確に行うことができ、高精度のワイヤボンディングを行うことが できる。 According to the present invention, as described above, the guide hole passing through the bonding tool; A bond formed from the inside of the guide hole at the exit portion that contacts the bonding surface. Since a narrow groove is provided to guide the bonding wire, the wire It is possible to perform accurate positioning and high-precision wire bonding. can.
【０００８】 また、ガイド穴自体は、従来と同様に大きな穴径のままでよいので、ワイヤを 容易に挿通することができ、作業性も良好である。[0008] In addition, the guide hole itself can remain as large in diameter as before, so the wire It can be easily inserted and has good workability.
【０００９】[0009]
以下、本考案の実施例を図面を参照しながら詳細に説明する。 図１は本考案の実施例を示すボンディングツールの先端部の断面図、図２はそ のボンディングツールの先端部の下面図である。 これらの図に示すように、ボンディングツール１１には、放電加工によるガイ ド穴１２が形成されている。そのガイド穴１２の出口部１４は、ワイヤを押圧す るボンディング面１５から離れて位置している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Figure 1 is a cross-sectional view of the tip of a bonding tool showing an embodiment of the present invention, and Figure 2 is a cross-sectional view of the tip of the bonding tool. FIG. 3 is a bottom view of the tip of the bonding tool. As shown in these figures, the bonding tool 11 has a guide formed by electrical discharge machining. A hole 12 is formed. The outlet portion 14 of the guide hole 12 presses the wire. The bonding surface 15 is located away from the bonding surface 15.
【００１０】 このガイド穴１２の内部から出口部１４のボンディング面１５に接する部分に かけて、ボンディングワイヤをガイドする細溝１６がレーザ加工により形成され る。ワイヤ１０はガイド穴１２の入口部１３から挿入され、細溝１６の先端部１ ６ａにより、ボンディング面１５でのワイヤの位置決めがなされ、良好なボンデ ィング位置精度が得られる。0010 From the inside of this guide hole 12 to the part of the outlet part 14 that contacts the bonding surface 15 Then, a narrow groove 16 for guiding the bonding wire is formed by laser processing. Ru. The wire 10 is inserted through the entrance portion 13 of the guide hole 12, and the wire 10 is inserted into the tip portion 1 of the narrow groove 16. 6a, the wire is positioned on the bonding surface 15 to ensure good bonding. position accuracy can be obtained.
【００１１】 本実施例では、レーザ加工により、半径１０μｍの半円状の細溝１６をガイド 穴１２の全域にわたって形成し、直径１０μｍのワイヤを用いた場合、ボンディ ング位置精度はわずか３μｍと良好な値を得ることができた。 本実施例では、前述のワイヤ位置決めの細溝を用いたが、その形状は半円状に 限られるものではなく、ワイヤの位置を決めるものであれば、矩形、Ｖ字形等で もよく、また、加工法も特にレーザに限定されるものではない。[0011] In this embodiment, a semicircular narrow groove 16 with a radius of 10 μm is guided by laser processing. If the hole 12 is formed over the entire area and a wire with a diameter of 10 μm is used, the bond We were able to obtain a good value for the positional accuracy of only 3 μm. In this example, the thin groove for wire positioning described above was used, but its shape was semicircular. There is no limit to this, but as long as it determines the position of the wire, it can be rectangular, V-shaped, etc. Furthermore, the processing method is not particularly limited to laser.
【００１２】 更に、加工する箇所もワイヤがガイド穴の出口部の先端近傍で位置決めできれ ば、ガイド穴の全域に形成する必要はなく、出口部の付近のみでもよい。 また、本考案は上記実施例に限定されるものではなく、本考案の趣旨に基づき 種々の変形が可能であり、それらを本考案の範囲から排除するものではない。0012 Furthermore, the wire cannot be positioned near the tip of the exit of the guide hole at the location to be machined. For example, it is not necessary to form it in the entire area of the guide hole, and it may be formed only in the vicinity of the exit part. Furthermore, the present invention is not limited to the above embodiments, but based on the spirit of the present invention. Various modifications are possible and are not excluded from the scope of the invention.
【００１３】[0013]
以上、詳細に説明したように、本考案によれば、ボンディングツールのガイド 穴の出口部分に細溝を形成し、ボンディング面でのワイヤの位置決めを精確に行 うようにしたので、高精度のワイヤボンディングを行うことができる。 また、ガイド穴自体は、従来と同様に大きな穴径のままでよいので、ワイヤを 容易に挿通することができ、作業性も良好である。 As explained in detail above, according to the present invention, the bonding tool guide A thin groove is formed at the exit of the hole to accurately position the wire on the bonding surface. As a result, highly accurate wire bonding can be performed. In addition, the guide hole itself can remain as large in diameter as before, so the wire It can be easily inserted and has good workability.
【図１】本考案の実施例を示すボンディングツールの先
端部の断面図である。FIG. 1 is a sectional view of the tip of a bonding tool showing an embodiment of the present invention.
【図２】本考案の実施例を示すボンディングツールの先
端部の下面図である。FIG. 2 is a bottom view of the tip of a bonding tool showing an embodiment of the present invention.
【図３】従来のボンディングツールの先端部の断面図で
ある。FIG. 3 is a sectional view of the tip of a conventional bonding tool.
【図４】従来のボンディングツールの先端部の下面図で
ある。FIG. 4 is a bottom view of the tip of a conventional bonding tool.
１０ ワイヤ １１ ボンディングツール １２ ガイド穴 １３ 入口部 １４ 出口部 １５ ボンディング面 １６ 細溝 １６ａ 細溝の先端部 10 wire 11 Bonding tool 12 Guide hole 13 Entrance 14 Exit part 15 Bonding surface 16 Narrow groove 16a Tip of narrow groove
───────────────────────────────────────────────────── フロントページの続き (72)考案者 烏野 ゆたか 東京都港区虎ノ門１丁目７番12号 沖電気 工業株式会社内 ──────────────────────────────────────────────── ─── Continuation of front page (72) Creator Yutaka Karasuno Oki Electric, 1-7-12 Toranomon, Minato-ku, Tokyo Inside Kogyo Co., Ltd.
Claims (1)
ィングツールにおいて、（ａ）ボンディングツールを貫
通するガイド穴と、（ｂ）該ガイド穴の内部からボンデ
ィング面に接する出口部分に形成されるボンディングワ
イヤをガイドする細溝を具備することを特徴とするボン
ディングツール。1. A bonding tool used for ultrasonic bonding, which includes (a) a guide hole passing through the bonding tool, and (b) a guide hole for guiding a bonding wire formed from the inside of the guide hole at an exit portion that contacts a bonding surface. A bonding tool characterized by having a narrow groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991028170U JPH04123539U (en) | 1991-04-24 | 1991-04-24 | bonding tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991028170U JPH04123539U (en) | 1991-04-24 | 1991-04-24 | bonding tools |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04123539U true JPH04123539U (en) | 1992-11-09 |
Family
ID=31912312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991028170U Withdrawn JPH04123539U (en) | 1991-04-24 | 1991-04-24 | bonding tools |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04123539U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021086892A (en) * | 2019-11-27 | 2021-06-03 | 三菱電機株式会社 | Semiconductor manufacturing apparatus |
-
1991
- 1991-04-24 JP JP1991028170U patent/JPH04123539U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021086892A (en) * | 2019-11-27 | 2021-06-03 | 三菱電機株式会社 | Semiconductor manufacturing apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19950713 |