JPH04119688A - Surface polishing method and device of printed wiring board - Google Patents
Surface polishing method and device of printed wiring boardInfo
- Publication number
- JPH04119688A JPH04119688A JP24054090A JP24054090A JPH04119688A JP H04119688 A JPH04119688 A JP H04119688A JP 24054090 A JP24054090 A JP 24054090A JP 24054090 A JP24054090 A JP 24054090A JP H04119688 A JPH04119688 A JP H04119688A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- piston
- polishing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板の導体表面の平滑性と粗イビ
のきめ細かさに優れた研磨方法お１合装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a polishing method and a polishing apparatus that is excellent in the smoothness of the conductor surface of a printed wiring board and the fineness of rough scratches.
（従来の技＃ｇ）
プリント配線板は、電子技術の発達とともにその配線密
度、絶縁特性、導体の絶縁化処理の細密化等、さまざま
の特性を要求されるようになってきた。(Conventional Technique #g) With the development of electronic technology, printed wiring boards are required to have various characteristics such as wiring density, insulation characteristics, and finer insulation treatment of conductors.
このような配線板の製造方法の一つとしては、両面鋼張
積層板に両面の回路を接続するためのスルーホールを形
成するための穴をあけ、その穴内壁とともに全表面に無
電解めっきを行って、その後、電解めっきを行いスルー
ホールとなるべき穴内壁を金属化し、基板表面の不要な
部分を選択的にエツチング除去するいわゆるサブトラク
ト法がある。One method for manufacturing such wiring boards is to drill holes in a double-sided steel-clad laminate to form through-holes for connecting circuits on both sides, and then apply electroless plating to the entire surface along with the inner walls of the holes. There is a so-called subtract method in which electrolytic plating is performed to metallize the inner wall of the hole that is to become a through hole, and unnecessary portions of the substrate surface are selectively etched away.
ところで、このような配線板の製造法において、スルー
ホールとなるべき穴内壁とともに全表面に無電解めっき
を行って、その後、電解めっきを行って、スルーホール
となるべき穴内壁を金属化したときに、銅箔表面の穴の
周囲は、電界の集中により他の部分に比べ、盛り上がっ
ており、ま六、銅箔表面は、めっき液中に含まれる夾雑
物を８としためっき粒子が付着しており、ｔＲＮの必要
力部分にエツチングレジストを形成した際に凹凸力によ
るレジストの欠陥部分が発生するため、回もブラシ等を
用いた機械研磨の工程を必要とする。By the way, in the manufacturing method of such a wiring board, when electroless plating is performed on the entire surface along with the inner wall of the hole that is to become a through hole, and then electrolytic plating is performed to metallize the inner wall of the hole that is to become a through hole. The area around the hole on the surface of the copper foil is more raised than other parts due to the concentration of the electric field. When an etching resist is formed in the required force area of the tRN, defective areas of the resist occur due to the uneven force, so a mechanical polishing process using a brush or the like is often required.
従来、このような研磨を行う装置としては、９３図に示
すように、複数の回転ロール１を平行Ｒ並べ、その回転
ロール】と平ｊテに複数の回転ブラシを設置し、プリン
ト配線板となるべき基板は、回転ブラシ２で研磨されな
がら回転ロールｌによって一定方向に送られるものであ
った。Conventionally, as shown in Fig. 93, a device for performing such polishing consists of a plurality of rotating rolls 1 arranged in parallel R, a plurality of rotating brushes installed on the rotating rolls and flat sides, and printed wiring boards and The substrate to be obtained was polished by a rotating brush 2 while being sent in a fixed direction by a rotating roll 1.
（発明が解決しようとする課！り
従来の装置によって研磨された基板は、一定の方向にの
み研磨されるので、その方向には平滑となるが、他の方
向には平滑とならず、また、その表面に研磨方向に研磨
の跡が残っており、この萌磨の粗さを段階的に小さくし
てもその跡が取れないことが多かった６必要な研磨の粗
さと表面の平滑性を得るためには、基板の送り方向を変
更して繰り返し研磨を行う必要があり、工程が長くなっ
て効率が低下することと、研磨の程度の再現性がなく、
一定の平滑性と表面粗さが得られないとし）う問題があ
った。(Issues that the invention seeks to solve!) Substrates polished by conventional equipment are polished only in a certain direction, so they are smooth in that direction but not smooth in other directions. , polishing marks remain on the surface in the polishing direction, and these marks often cannot be removed even if the roughness of this moe polishing is gradually reduced 6. In order to achieve this, it is necessary to change the feed direction of the substrate and perform polishing repeatedly, which lengthens the process and reduces efficiency, and the degree of polishing is not reproducible.
There was a problem that a certain level of smoothness and surface roughness could not be obtained.
本発明は、プリント配線板となる基板の導体表面の平滑
性と粗化の再現性に優れた研磨方法およびそのための装
置を擾供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing method with excellent reproducibility of smoothness and roughening of a conductor surface of a substrate to be a printed wiring board, and an apparatus therefor.
（課題を解決するための手段）
本発明の研磨方法は、プリント配線板を一定方向に送る
とともにその表面を複数回研磨し、かつ、研磨方向を各
研磨の度に変更することを特徴とする。(Means for Solving the Problems) The polishing method of the present invention is characterized by feeding a printed wiring board in a fixed direction, polishing its surface multiple times, and changing the polishing direction each time. .
また、このような方法に用いる装置として、平行に並べ
られた複数の回転ロールｌと、該回転ロール１と平行に
並べられた複数の円筒状ブラシ２と、該回転ロールｌお
よび円筒状ブラシ２を回転するための動力と、位置検出
器３と、制御信号により突出するピストン４と、位置検
出器３からの信号によって予め設定したタイミングによ
りピストジ４に＠面信号を送る制御装置５とを備えたこ
とを特徴とする。Further, as a device used in such a method, a plurality of rotating rolls l arranged in parallel, a plurality of cylindrical brushes 2 arranged in parallel with the rotating rolls 1, and the rotating rolls l and the cylindrical brushes 2 are used. , a position detector 3, a piston 4 that protrudes in response to a control signal, and a control device 5 that sends an @plane signal to the piston 4 at a preset timing based on a signal from the position detector 3. It is characterized by:
以下、第１図に基づいて説明する。The following will explain based on FIG.
１は、平行に並べられた複数の回転ロールであって、金
属やプラスチック等の剛性を有する棒状のものあるいは
その表面にゴムや柔軟性のある樹脂等で被覆され搬送す
るプリント配線板を損傷しないものであり、その一端に
回転力を伝達するためのベルト受け、ギヤ等を有し、か
つ、両端または両端の近くに回転の軸を固定するための
軸受けに連結されるための加工を施された部分を有する
ものである。1 is a plurality of rotating rolls arranged in parallel, which are rigid bar-shaped materials such as metal or plastic, or whose surfaces are coated with rubber or flexible resin, so as not to damage printed wiring boards being transported. It has a belt receiver, gear, etc. for transmitting rotational force at one end, and is processed to be connected to a bearing for fixing the axis of rotation at or near both ends. It has a part.
２は、この回転ロール１七平行に並べられた複数の円筒
状ブラシであって、回転ロールｌと同様の材質の軸と、
その一端に回転力を伝達するためのベルト受け、ギヤ等
を有し、かつ、両端または両端の近くに回転の軸を固定
するための輪受けに連結されるための加工を施された部
分を有するものであって、その表面に研磨のために柔軟
性のあるブラシの毛状のものがその一端を固定されてお
り、回転してプリント配線板の表面を研磨するためのも
のである。このときに、必要′とする研磨の程度によっ
て、布状の研磨用材料をブラシに代えて用いることもあ
る。また、研磨するときに、酸化アルミニウムの粒子、
炭の粉等を水に混合したものを吹き付けて研磨すること
によって研磨を促進するものも使用できる。Reference numeral 2 denotes a plurality of cylindrical brushes arranged in parallel with each other on the rotary roll 1, each having a shaft made of the same material as the rotary roll l;
A part that has a belt holder, gear, etc. for transmitting rotational force at one end, and is processed to be connected to a wheel holder for fixing the axis of rotation at or near both ends. It has flexible brush bristles fixed at one end to its surface for polishing, and rotates to polish the surface of the printed wiring board. At this time, depending on the degree of polishing required, a cloth-like polishing material may be used in place of the brush. Also, when polishing, aluminum oxide particles,
A material that accelerates polishing by spraying a mixture of charcoal powder or the like in water can also be used.
：（は、位置検出器であって、プリント配線板の搬送位
置を確認するものであって、光センサー磁気センサー、
プリント配線板に接触する機械力によって作動するスイ
ッチ、電界強度の変化を検出するセンサー等近接物体を
検出するものならばどのようなものでも用いることがで
きる。:( is a position detector that confirms the conveyance position of the printed wiring board, and includes an optical sensor, a magnetic sensor,
Any device that can detect a nearby object, such as a switch operated by mechanical force that contacts a printed wiring board, or a sensor that detects changes in electric field strength, can be used.
４は、信号によって突出するピストンであって、信号が
ないときはプリント配線板の通過を妨げない箇所に設け
られ、信号があれば突出してプリント配線板の搬送方向
に対する向きを変更させるものであり、例えば、信号に
よって開くパルプと、バルブに連結されたエアーポンプ
からの圧縮空気によって突出する構造のエアーシリンダ
や、電慣住脣ｒよ−Ｔ磁気を全ヰＬ−その碩力によって
突出する電磁シリンダ等がある。4 is a piston that protrudes in response to a signal, and is provided at a location that does not obstruct the passage of the printed wiring board when there is no signal, and when there is a signal, the piston protrudes to change the orientation of the printed wiring board with respect to the conveyance direction. For example, there is an air cylinder that is protruded by pulp that is opened by a signal and compressed air from an air pump connected to a valve, and an electromagnetic cylinder that protrudes due to its magnetic force. There are cylinders, etc.
５は、位置検出器３からの信号によって、予め設定した
タイミングによりピストン４に信号を送る制御装置であ
って、そのタイミングの設定は、位置検出器３およびピ
ストン４の位置、プリント配線板の大きと、搬送方向に
対してプリント配線板の向きを変更する程度、搬送速度
と研磨する程度から定めるのであるが、通常は、予め一
定の材質、前処理、大きさのプリント配線板を試験的に
研磨して、必要とする研磨表面が得られる条件を求めて
おく。Reference numeral 5 denotes a control device that sends a signal to the piston 4 at a preset timing based on a signal from the position detector 3, and the timing is set depending on the positions of the position detector 3 and the piston 4, and the size of the printed wiring board. This is determined based on the extent to which the orientation of the printed wiring board is changed relative to the transport direction, the transport speed, and the extent of polishing. Usually, printed wiring boards of a certain material, pretreatment, and size are tested in advance. Determine the conditions under which the desired polished surface can be obtained by polishing.
（作用）
このような手段を用いるので、プリント配線板を一定方
向に送るとともに、その表面を複数回研磨し、かつ、研
磨方向を各研磨の度に変更することができる。(Function) By using such means, it is possible to feed the printed wiring board in a fixed direction, polish its surface multiple times, and change the polishing direction each time.
実施例
平行に並べられた複数のカイテンロールとして、ステン
レス棒の表面にゴムを被覆したものを用い、その一端に
モータの回転を伝達するためのギヤを有し、かつ、両端
に回転の軸を固定するための軸受けに連結されるポール
ベアリングを連結し、装置の筐体に固定した。Example A stainless steel rod whose surface is coated with rubber is used as a plurality of Kaiten rolls arranged in parallel, and one end of which has a gear for transmitting the rotation of a motor, and a rotation axis at both ends. A pole bearing connected to a fixed bearing was connected and fixed to the housing of the device.
回転ロールと平行に並べられた複数の円筒状ブラシとし
て、回転ロールと同様に、その一端にモータの回転を伝
達するためのギヤを有し、かつ、両端に回転の軸を固定
するための軸受けに連結されるボールベアリングを連結
し、装置の筐体に固定し、ブラシの毛状のものが該一端
を固定しである回転ブラシと、布状の研磨用材料をブラ
シに代えて用いた回転パフを２種用い、その固定位置は
第２図に示すとおりとした。As a plurality of cylindrical brushes arranged parallel to the rotating roll, it has a gear at one end to transmit the rotation of the motor, and bearings at both ends to fix the axis of rotation, similar to the rotating roll. A rotating brush in which a ball bearing is connected to a rotating brush, which is fixed to the housing of the device, and one end of which is fixed to the bristles of the brush, and a rotating brush in which a cloth-like polishing material is used in place of the brush. Two types of puffs were used, and their fixed positions were as shown in FIG.
位置検出器は、光センサーを用いたもので、常に照射す
るＬＥＤと、その反射光によって近接物体を検出するＰ
Ｚ−４１（キーエンス株式会社製商品名）を用いた。設
置位置は、第２図に示すように、２本の回転ロールの間
に、２箇所とした。The position detector uses an optical sensor, with an LED that constantly illuminates and a P sensor that detects nearby objects using the reflected light.
Z-41 (trade name manufactured by Keyence Corporation) was used. As shown in FIG. 2, the installation positions were two between two rotating rolls.
また、２つの位置検出器は回転ブラシおよび各回転パフ
の前方に必ず設置し、合計６つの位置検出器を用いた。Further, two position detectors were always installed in front of the rotating brush and each rotating puff, and a total of six position detectors were used.
信号によって突出するピストンは、工：アシリンダＣＤ
ＱＩＢ２０−３０ＤＣ（焼結金属株式会社製商品名）を
用いた。設置位置は、第２図に示すように、位置検出装
置の近くであって、２本の回転ロールの間に２箇所とし
た。また、２つのエア位置検出器からの信号によって、
予め設定したタイミングによってエアシリンダの電磁バ
ルブを開く制御装置は、タイマーであるＨ３Ｙ−２（立
石電機株式会社製商品名）を用い、位置検出からの信号
によってタイマーがセットされ、設定の時間が経過する
と、タイマーは信号を出力して、同時にリセットされる
。その出力信号は、エアシリンダの！磁バルブを駆動し
て開き、エアシリンダ搬送する力に押されてプリント配
線板の向きが変わり、一定の時間の後に、そのピストン
が下へ降り、向きの変えられたプリント配線板は、回転
ブラシへ送られ、その方向に研磨される。The piston that protrudes by the signal is
QIB20-30DC (trade name, manufactured by Sintered Metal Co., Ltd.) was used. As shown in FIG. 2, the installation positions were two places near the position detection device and between two rotating rolls. Also, depending on the signals from the two air position detectors,
The control device that opens the solenoid valve of the air cylinder at a preset timing uses a timer, H3Y-2 (trade name, manufactured by Tateishi Electric Co., Ltd.).The timer is set by a signal from position detection, and the set time elapses. The timer then outputs a signal and is reset at the same time. The output signal is that of the air cylinder! The magnetic valve is driven and opened, and the direction of the printed wiring board changes as it is pushed by the force conveyed by the air cylinder.After a certain period of time, the piston descends, and the printed wiring board whose direction has been changed is moved by the rotating brush. and polished in that direction.
次のゾーンでは、その向きの傾いたプリント配線板が２
つの位置検出器のうちいずれか一方の位置検出器によっ
て検出され、その検出された方に該当するピストンが突
出し、同様に向きを変えられて研磨される。In the next zone, the tilted printed wiring board is 2
The piston is detected by one of the two position detectors, and the piston corresponding to the detected one protrudes and is similarly turned and polished.
（発明の効果）
以上に説明したように、本発明によって、プリント配線
板を一定方向に送るとともに、その表面を複数回研磨し
、かつ、研磨方向を各研磨の度に変更することができる
ので、プリント配線板の導体表面の平滑性と粗化のきめ
こまかさに優れた研磨方法およびそのための装置を優供
することができた。(Effects of the Invention) As explained above, according to the present invention, it is possible to send a printed wiring board in a fixed direction, polish its surface multiple times, and change the polishing direction each time. , we were able to provide a polishing method that is excellent in smoothness and fineness of roughening of the conductor surface of a printed wiring board, and an apparatus for the same.
第１図（Ａ）は本発明の一実施例の特徴部分を説明する
ための装置の概略を示す斜視図、第１図（Ｂ）は本発明
の一実施例の特徴部分を説明するための装置の概略を示
す上面図、第２図は本発明の一実施例の装置の概要を示
す上面図、第３図は従来例の装置の概略を示す斜視図で
ある。
符号の説明
１、回転ロール ２６回転ブラシ
３、位置検出器 ４．ピストン
５、制御装置FIG. 1(A) is a perspective view schematically showing an apparatus for explaining the characteristic parts of one embodiment of the present invention, and FIG. 1(B) is a perspective view showing the outline of the apparatus for explaining the characteristic parts of one embodiment of the present invention. FIG. 2 is a top view schematically showing an apparatus according to an embodiment of the present invention, and FIG. 3 is a perspective view schematically showing a conventional apparatus. Explanation of symbols 1. Rotating roll 26 Rotating brush 3. Position detector 4. Piston 5, control device
Claims (2)
を複数回研磨し、かつ、研磨方向を各研磨の度に変更す
ることを特徴とするプリント配線板の研磨方法。1. A method for polishing a printed wiring board, characterized by feeding the printed wiring board in a fixed direction, polishing the surface of the board multiple times, and changing the polishing direction each time.
転ロール（１）と平行に並べられた複数の円筒状ブラシ
（２）と、該回転ロール（１）および円筒状ブラシ（２
）を回転するための動力と、位置検出器（３）と、制御
信号により突出するピストン（４）と、位置検出器（３
）からの信号によって予め設定したタイミングによりピ
ストン（４）に制御信号を送る制御装置（５）とを備え
たことを特徴とする請求項１に記載のプリント配線板の
研磨方法に使用される装置。2. A plurality of rotating rolls (1) arranged in parallel, a plurality of cylindrical brushes (2) arranged in parallel with the rotating rolls (1), and the rotating rolls (1) and cylindrical brushes (2).
), a position detector (3), a piston (4) that protrudes in response to a control signal, and a position detector (3).
) A control device (5) that sends a control signal to the piston (4) at a preset timing based on a signal from the piston (4). .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24054090A JPH04119688A (en) | 1990-09-11 | 1990-09-11 | Surface polishing method and device of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24054090A JPH04119688A (en) | 1990-09-11 | 1990-09-11 | Surface polishing method and device of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04119688A true JPH04119688A (en) | 1992-04-21 |
Family
ID=17061055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24054090A Pending JPH04119688A (en) | 1990-09-11 | 1990-09-11 | Surface polishing method and device of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04119688A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106064327A (en) * | 2015-04-24 | 2016-11-02 | 高亚松 | Rolling structure of grinder |
| CN106064346A (en) * | 2015-04-24 | 2016-11-02 | 高亚松 | Rolling structure of grinding machine |
-
1990
- 1990-09-11 JP JP24054090A patent/JPH04119688A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106064327A (en) * | 2015-04-24 | 2016-11-02 | 高亚松 | Rolling structure of grinder |
| CN106064346A (en) * | 2015-04-24 | 2016-11-02 | 高亚松 | Rolling structure of grinding machine |
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