JPH04117446U - Semiconductor device measurement jig - Google Patents

Abstract

(57) [Summary] [Structure] An element fixing base a6 having a groove a5 cut out in the shape of a semiconductor element, a low-loss dielectric substrate 7 with a hole 4 in the shape of a semiconductor element in the center, and a substrate 7. It consists of a GND plate a8 pasted on the top surface of the board 7, two strip conductors 2 attached to the bottom surface of the board 7, and bumps 3 provided on the strip conductors 2. Two strip lines a1 are formed by the substrate 7 and the GND plate a8. Then, the semiconductor element is fitted into the groove a5 of the element fixing base a6, and the GND plate a8 and the strip conductor 2
The board 7 on which is attached is stacked on top of the semiconductor element, and the pins of the semiconductor element are pressed against the element fixing base a6 by the bumps 3. [Effect] With the above configuration, it is possible to accurately contact the pins of the semiconductor element with the strip line without applying any load to the pins of the semiconductor element, and there is no need for screwing, making it easy to attach and detach the semiconductor element. Furthermore, the holes in the substrate allow the semiconductor device to be cooled during use.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a semiconductor device measuring jig, particularly a strip of semiconductor device measuring jig. This invention relates to a method of attaching a line to a pin of a semiconductor element.

0002 A stripline is a line of two parallel conductors with at least one thin strip conductor. A strip conductor on one side of a parallel two-conductor line and a ground conductor on the other side. It has a structure in which a low-loss dielectric flat plate is sandwiched between the body and the body.

0003

[Conventional technology]

A conventional semiconductor device measuring jig will be described with reference to the drawings.

0004 Figure 3 is a block diagram of a conventional semiconductor device measurement jig, and Figures 4 (a) and (b) are conventional FIG. 2 is an enlarged view of a contact portion of an example semiconductor device measuring jig.

[0005] The conventional semiconductor measuring jig shown in FIGS. 3 and 4 has a groove b14 and is used to measure the semiconductor element. An element fixing base b16 with screw holes 12 drilled in accordance with the recessed positions, and an element fixing base GND plate b15 pasted on the top surface of b16 and the strip attached on GND plate b15 A strip consisting of a trip conductor, a ground conductor, and a low-loss dielectric flat plate sandwiched between them. Fix the semiconductor element to the element fixing base b16 using the supply line b17 and two screws 10. It is composed of a fixed plate 11 that is fixed.

[0006] As shown in Figure 4(a), the two pins attached to the semiconductor element are Place it on the groove b14 so as to overlap the top line b17. Place the fixing plate 11 on the semiconductor element. , lower the screw 10 to match the recess of the semiconductor element, and then tighten the screw 10 on the element fixing base b16. Screw into screw hole 12. At that time, the pin shifted from the top of strip line b17. Since it moves, it is necessary to make fine adjustments while pinching the semiconductor element with tweezers or the like.

[0007] Also, if the pin is warped as shown in Figure 4(b), hold it down with a fixing plate. There is also a gap between the pin and strip line b17, making it impossible to measure due to poor contact. There are cases where In such a case, bend the pin downward and strip line b17 This must be done in such a way that it makes contact with the pins of the semiconductor device. This may cause an unnecessary load.

[0008]

[Problem that the idea aims to solve]

The conventional semiconductor device measuring jig described above is used when fixing a semiconductor device to a device fixing table. It is difficult to align pins and strips attached to semiconductor devices. In order to make better contact with the prine, bend the pin downward and fix it to the fixing base. The disadvantage is that it puts unnecessary load on the pin and may affect the semiconductor device. There is.

[0009] Furthermore, if the semiconductor device is fixed to a fixed stand, ventilation is poor, and the semiconductor device is The disadvantage is that it cannot be cooled.

0010 The purpose of this invention is to provide an element fixing base with a groove cut out in the shape of a semiconductor element, and a central A low-loss dielectric substrate with a hole in the shape of a semiconductor element on the top surface of the substrate and the top surface of the substrate. A affixed ground conductor and at least two strip conductors attached to the underside of the board. at least two striplines consisting of a body and a strip of striplines; bumps provided on the bump conductor, and at least two pins of the semiconductor element. Align with at least two strip lines and push the pin onto the element fixing base with a bump. By attaching and measuring the semiconductor device, the above drawbacks can be overcome and the pinpoint of the semiconductor device can be improved. It is possible to accurately contact the pin and the strip line without applying any load to the pin. In addition, there is no need for screws, and semiconductor elements can be easily attached and detached. For semiconductor device measurement, semiconductor devices can be cooled by holes in the substrate during use. The aim is to provide jigs.

[0011]

[Means to solve the problem] The semiconductor device measuring jig of the present invention is a device that has a groove cut out in the shape of a semiconductor device. A fixed base, a low-loss dielectric substrate with a hole in the shape of a semiconductor element in the center, and a substrate. and a ground conductor affixed to the top side of the board and at least two ground conductors attached to the bottom side of the board. at least two striplines consisting of a strip conductor of and a bump provided on the strip conductor of the line, at least one of the semiconductor elements. Align the two pins with at least two strip lines, and align the pins with bumps. Semiconductor elements are measured by pressing them against the child fixing table.

0012

【Example】

Next, embodiments of the present invention will be described in detail with reference to the drawings.

[0013] Fig. 1 is a block diagram of a semiconductor device measuring jig according to an embodiment of the present invention, and Fig. 2 is a block diagram of a semiconductor device measuring jig according to an embodiment of the present invention. FIG. 3 is an enlarged view of the contact portion of the semiconductor device measuring jig.

[0014] The semiconductor device measurement jig shown in FIGS. 1 and 2 is hollowed out in the shape of a semiconductor device. A low-loss device with an element fixing base a6 having a groove a5 and a hole 4 in the shape of a semiconductor element in the center. A dielectric substrate 7, a GND plate a8 pasted on the top surface of the substrate 7, and a GND plate a8 attached to the bottom surface of the substrate 7. The two attached strip conductors 2 and the bar provided on the strip conductors 2 3. Then, the above two strip conductors 2, the substrate 7 and G Two strip lines a1 are formed with the ND plate a8.

[0015] Here, place the semiconductor element in the groove a5 cut out in the shape of the semiconductor element on the element fixing base a6. Insert the board 7 with the GND plate a8 and the strip conductor 2 attached to the semiconductor Overlap from the top of the element. At this time, as shown in FIG. 2, the bump 3 is connected to the pin of the semiconductor element. Since the pin is pressed against the element fixing base a6, the strip plate can be removed without applying any load to the pin. The strip conductor 2 of the in-a1 and the pin are in reliable contact. Also, there is a hole 4 on the board 7. Since it is bright, the semiconductor element is cooled during use.

[0016]

[Effect of the idea] As explained above, the semiconductor device measuring jig of the present invention is capable of fixing a semiconductor device. Fit into the groove cut out in the shape of the semiconductor element on the stand, GND plate and strip line. The board with the bumps attached is stacked on top of the semiconductor element, and at this time, the bumps are By pressing the child pin against the element fixing base and by drilling a hole on the board, the pin It is possible to accurately contact the pin and the stripline without applying any load to the In addition, there is no need for screws, and semiconductor elements can be easily attached and detached. Another advantage is that the semiconductor element can be cooled during use.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a semiconductor device measuring jig according to an embodiment of the present invention.

FIG. 2 is an enlarged view of the contact portion of the semiconductor device measuring jig of this embodiment.

FIG. 3 is a block diagram of a conventional semiconductor device measuring jig.

FIG. 4 is an enlarged view of a contact portion of a conventional semiconductor device measuring jig.

[Explanation of symbols]

1 strip line a 2 strip conductor 3 Bump 4 holes 5 Groove a 6 Element fixing stand a 7 Board 8 GND plate a 10 screws 11 Fixed plate 12 Screw hole 14 Groove b 15 GND board b 16 Element fixing base b 17 Strip line b

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[Procedural amendment]

[Submission date] March 26, 1992

[Procedural amendment 1]

[Name of document to be amended] Specification

[Name of item to be corrected] Name of invention

[Correction method] Change

[Correction details]

[Name of the invention] Semiconductor device measurement jig

Claims (1)

[Scope of utility model registration request] 1. An element fixing table having a groove cut out in the shape of a semiconductor element, a low-loss dielectric substrate having a hole in the shape of the semiconductor element in the center, and a substrate attached to the upper surface of the substrate. at least two strip lines comprising a ground conductor and at least two strip conductors attached to the lower surface of the substrate; and bumps provided on the strip conductors of the strip lines; A semiconductor device measuring jig, characterized in that the semiconductor device is measured by aligning at least two pins with at least two of the strip lines and pressing the pins against the device fixing table with the bumps.