JPH04116166A - Method and device for measuring vapor deposition state and vapor deposition device - Google Patents
Method and device for measuring vapor deposition state and vapor deposition deviceInfo
- Publication number
- JPH04116166A JPH04116166A JP23232690A JP23232690A JPH04116166A JP H04116166 A JPH04116166 A JP H04116166A JP 23232690 A JP23232690 A JP 23232690A JP 23232690 A JP23232690 A JP 23232690A JP H04116166 A JPH04116166 A JP H04116166A
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- Prior art keywords
- vapor deposition
- vapor
- weight
- evaporation
- plate
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Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 title claims description 21
- 238000001704 evaporation Methods 0.000 claims abstract description 54
- 230000008020 evaporation Effects 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract 3
- 230000008021 deposition Effects 0.000 claims description 26
- 238000005303 weighing Methods 0.000 claims description 22
- 238000005259 measurement Methods 0.000 claims description 15
- 238000010894 electron beam technology Methods 0.000 abstract description 8
- 230000001678 irradiating effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 25
- 239000010408 film Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、蒸気装置における蒸着状態測定方法及び測定
装置、並びに蒸気装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for measuring a vapor deposition state in a steam apparatus, and a steam apparatus.
従来の蒸着装置における蒸気量と蒸気速度を求める方法
並びに装置及びその装置を用いた蒸着方法並びに装置を
第３図により説明する。A method and apparatus for determining the amount of vapor and vapor velocity in a conventional vapor deposition apparatus, and a vapor deposition method and apparatus using the apparatus will be explained with reference to FIG.
従来の蒸着装置は、真空容器１．真空容器内を真空にす
るための真空ポンプ２、蒸発源３、蒸発源からの蒸気４
の蒸気量を測定する蒸気量モニタ５、蒸気４の蒸気速度
を測定する蒸気速度モニタ６、蒸気量並びに蒸気速度を
監視する測定計７、蒸気量並びに蒸気速度を所望の値に
する蒸発源制御装置８から構成される。蒸着装置におい
ては、得られた蒸着膜の品質管理のために蒸気量と蒸気
速度を制御する必要があり、蒸着の際にこれらを監視し
ている。Conventional vapor deposition equipment consists of a vacuum container 1. Vacuum pump 2 for creating a vacuum inside the vacuum container, evaporation source 3, and steam 4 from the evaporation source
A steam amount monitor 5 that measures the amount of steam of the steam 4, a steam speed monitor 6 that measures the vapor velocity of the steam 4, a measuring meter 7 that monitors the amount of steam and the vapor velocity, and an evaporation source control that sets the amount of steam and the vapor velocity to desired values. It consists of a device 8. In a vapor deposition apparatus, it is necessary to control the amount of vapor and vapor velocity in order to control the quality of the obtained vapor deposited film, and these are monitored during vapor deposition.
従来の蒸気量測定方法並びに装置での蒸着モニタには、
薄膜ハンドブック、日本学術振興会薄膜第１３１委員会
編、オーム社（１９８３年）第１３２頁から第１４７頁
において論じられているように、流量法や水晶振動子利
用法等が用いられている。Conventional vapor measurement methods and equipment for vapor deposition monitoring include:
As discussed in Thin Film Handbook, edited by the 131st Thin Film Committee of the Japan Society for the Promotion of Science, Ohmsha (1983), pages 132 to 147, the flow rate method, crystal oscillator utilization method, etc. are used.
従来の蒸気速度測定並びに装置には、蒸気中にレーザ光
を照射し、得られた散乱光のスペクトルからドツプラー
シフトによるものが用いられている。従って、レーザ光
源１分光器、受光器、該受光器からの信号を解析する解
析装置からなる。なお、この種の装置として関連するも
のには例えば流計計測ハンドブック、用田裕部、小宮勤
−９山崎弘部編者、日刊工業新聞社（１９７９年）、第
３６９頁から第３８２頁が挙げられる。Conventional vapor velocity measurement and equipment use methods that involve irradiating laser light into vapor and performing a Doppler shift from the spectrum of the scattered light obtained. Therefore, it consists of a laser light source, a spectrometer, a light receiver, and an analysis device for analyzing the signal from the light receiver. Note that related devices of this type include, for example, Flow Meter Measurement Handbook, edited by Hirobe Yoda, Tsutomu Komiya-9, and Hirobe Yamazaki, Nikkan Kogyo Shimbunsha (1979), pages 369 to 382.
上記従来技術は、蒸気量と蒸気速度を同時に測定する点
についての配慮がされておらず、蒸気量測定と蒸気速度
測定を各々別の方法並びに装置を用いるという問題点が
あった。更に上記従来技術は、蒸着板の重量変化から蒸
気量や蒸気速度等の蒸着状態を求めるとの考え方はない
。The above-mentioned prior art does not take into consideration the simultaneous measurement of steam amount and steam velocity, and has the problem of using different methods and devices for steam volume measurement and steam velocity measurement, respectively. Furthermore, the above-mentioned prior art does not include the idea of determining the vapor deposition state such as the amount of vapor and the vapor velocity from the change in the weight of the vapor deposition plate.
本発明の目的は、蒸着板の重量から蒸着状態を求めるよ
うにした蒸着状態測定方法及び装置を提供するにある（
請求項１〜１２．１４．１５）。An object of the present invention is to provide a method and apparatus for measuring a vapor deposition state in which the vapor deposition state is determined from the weight of a vapor deposition plate.
Claims 1-12.14.15).
更に本発明は、蒸着板の重量から蒸着状態から蒸着の制
御をはかる蒸着装置を提供するにある（請求項１３）。A further object of the present invention is to provide a vapor deposition apparatus that controls vapor deposition from the weight of the vapor deposition plate and from the vapor deposition state (claim 13).
更に本発明は、蒸着板の重量から蒸気量及び蒸気速度を
求めるようにした蒸着状態測定方法及び装置を提供する
にある（請求項３〜５）。Further, the present invention provides a method and apparatus for measuring the state of vapor deposition, in which the amount of vapor and the vapor velocity are determined from the weight of the vapor deposition plate (claims 3 to 5).
本発明は、蒸着板の蒸着に伴う重量を求め、この重量か
ら蒸着状態を求めてなる（請求項１）。In the present invention, the weight of the vapor deposition plate accompanying vapor deposition is determined, and the vapor deposition state is determined from this weight (claim 1).
更に本発明は、蒸着板の重量を測定する重量計を設けて
蒸着開始から蒸着停止に至るまでの重量を測定し、この
測定重量から蒸着状態を求めてなる（請求項２）。Furthermore, the present invention provides a weighing scale for measuring the weight of the vapor deposition plate, measures the weight from the start of vapor deposition to the stop of vapor deposition, and determines the vapor deposition state from this measured weight (claim 2).
更に本発明は、蒸着板の重量を測定する重量計を設けて
蒸着開始から蒸着停止になるまでの重量を測定し、この
測定値から得られる蒸着板への蒸気原子の蒸着開始後の
蒸着の重量変化から蒸気量を求め、蒸着板への蒸気原子
の蒸着が開始又は停止した時の重量変化から蒸気速度を
求めてなる（請求項３）。Furthermore, the present invention provides a weighing scale for measuring the weight of the evaporation plate, measures the weight from the start of evaporation to the stop of evaporation, and calculates the amount of evaporation after the start of evaporation of vapor atoms onto the evaporation plate obtained from this measured value. The amount of steam is determined from the change in weight, and the velocity of steam is determined from the change in weight when the deposition of vapor atoms onto the deposition plate starts or stops (Claim 3).
更に本発明は、蒸着板の重量を測定する重量計を設けて
蒸着開始から蒸着停止に至るまでの重量を測定し、この
測定値から得られる蒸着板への蒸気原子の蒸着開始後の
蒸着板の重量変化から単位時間単位面積当りに蒸着板へ
流入する蒸気原子数を求め、蒸着板への蒸気原子の蒸着
が開始又は停止した時の重量変化から蒸気速度を求めて
なる（請求項４）。Furthermore, the present invention provides a weighing scale for measuring the weight of the vapor deposition plate, measures the weight from the start of vapor deposition to the stop of vapor deposition, and obtains the weight of the vapor deposition plate after the start of vapor deposition of vapor atoms on the vapor deposition plate obtained from this measurement value. (Claim 4) .
更に本発明は、蒸着板の重量を測定する重量計を設けて
、蒸着開始から蒸着停止に至るまでの重量を測定し、こ
の測定値から得られる蒸着板への蒸気原子の蒸着開始後
の重量変化から単位時間当りの膜厚増加分を求め、蒸着
板への蒸気原子の蒸着が開始又は停止した時の重量変化
から蒸気速度を求め、蒸着板への蒸気原子の蒸着停止後
の蒸着板の重量から蒸着膜厚を求めてなる（請求項５）
。Furthermore, the present invention provides a weight scale for measuring the weight of the vapor deposition plate, measures the weight from the start of vapor deposition to the stop of vapor deposition, and calculates the weight of the vapor atoms after the start of vapor deposition on the vapor deposition plate obtained from this measurement value. The increase in film thickness per unit time is calculated from the change, the vapor velocity is calculated from the change in weight when vapor atom deposition on the vapor deposition plate starts or stops, and the vapor velocity of the vapor deposition plate after the vapor deposition of vapor atoms on the vapor deposition plate has stopped is calculated. Determining the thickness of the deposited film from the weight (Claim 5)
.
更に本発明は、重量を測定する重量計を設けて、蒸着開
始から蒸着停止に至るまでの重量を測定し、この測定値
から得られる蒸着板への蒸気原子の蒸着開始後の蒸着板
の重量変化から蒸気量を求めてなる（請求項６）。Furthermore, the present invention provides a weighing scale for measuring weight, measures the weight from the start of vapor deposition to the stop of vapor deposition, and calculates the weight of the vapor deposition plate after the start of vapor deposition of vapor atoms onto the vapor deposition plate obtained from this measurement value. The amount of steam is determined from the change (Claim 6).
更に本発明は、蒸着板の重量を測定する重量計を設けて
、蒸着開始又は停止時の重量を測定し、この測定値から
得られる蒸着板への蒸気原子の蒸着が開始又は停止した
時の重量変化から蒸気速度を求めてなる（請求項７）。Furthermore, the present invention provides a weighing scale for measuring the weight of the vapor deposition plate, measures the weight at the time of starting or stopping the vapor deposition, and obtains from this measurement value the time when the vapor deposition of vapor atoms on the vapor deposition plate starts or stops. The steam velocity is determined from the weight change (Claim 7).
更に本発明は、蒸着板の蒸着に伴う重量を求める手段と
、この重量から蒸着状態を求める手段と、より成る（請
求項８）。Furthermore, the present invention comprises means for determining the weight of the deposition plate as it is deposited, and means for determining the state of deposition from this weight (claim 8).
更に本発明は、蒸着板の重量を測定する重量計と、蒸着
板への蒸気原子の蒸着の開始又は停止する手段と、該手
段による開始から停止に至るまでの間の上記重量計の測
定値から蒸着状態を検出する手段とよりなる（請求項９
）。Furthermore, the present invention provides a weight scale for measuring the weight of a vapor deposition plate, a means for starting or stopping the vapor deposition of vapor atoms onto the vapor deposition plate, and a measurement value of the weight scale from the start to the stop by the means. (Claim 9)
).
更に本発明は、蒸着空間中に吊り下げてなる（請求項１
０）。Furthermore, the present invention is suspended in a vapor deposition space (claim 1).
0).
更に本発明は、上記開始又は停止する手段は、蒸発源に
近い位置に設けられたシャッタとする（請求項１１）。Furthermore, in the present invention, the means for starting or stopping is a shutter provided at a position close to the evaporation source (claim 11).
更に本発明は、蒸着板の蒸着に伴う重量を求める手段と
、蒸発源と、蒸着板への蒸気原子の蒸着の開始又は停止
する手段と、該手段による開始から停止に至るまでの間
の上記求めた重量値から蒸着状態を検出する手段と、該
蒸着状態から蒸着板への蒸着量を制御する手段とより成
る（請求項１３）。Furthermore, the present invention provides a means for determining the weight of a vapor deposition plate during vapor deposition, an evaporation source, a means for starting or stopping the vapor deposition of vapor atoms onto the vapor deposition plate, and the above-mentioned method from the start to the stop by the means. The method comprises means for detecting the vapor deposition state from the obtained weight value, and means for controlling the amount of vapor deposited on the vapor deposition plate based on the vapor deposition state (claim 13).
本発明によれば、蒸着板の蒸着に伴う重量を求め、この
重量から蒸着状態を求める（請求項１〜１２）。According to the present invention, the weight of the vapor deposition plate accompanying vapor deposition is determined, and the vapor deposition state is determined from this weight (claims 1 to 12).
更に本発明によれば、重量計による測定重量から蒸気量
、蒸気速度の両者を求める（請求項３〜５）。Furthermore, according to the present invention, both the steam amount and the steam velocity are determined from the weight measured by the weighing scale (claims 3 to 5).
更に本発明によれば、蒸着板の蒸着に伴う重量から求め
た蒸着状態から、蒸着制御をはかる（請求項１３）。Furthermore, according to the present invention, the vapor deposition is controlled based on the vapor deposition state determined from the weight of the vapor deposition plate accompanying the vapor deposition (claim 13).
先ず、本発明の詳細な説明する。 First, the present invention will be explained in detail.
蒸着板への蒸気原子の蒸着を開始又は停止することによ
り、蒸着板の重量を測定する重量計の指示値は第２図の
ように変化する。重量計の指示値は蒸着開始時期より以
前では、蒸着板の質量のみを示し一定である。蒸着を開
始した時、蒸着板には蒸気原子の衝突による力を受は重
量計の指示値が第２図のａの如く低下する。蒸着開始時
期以後は、蒸着板の質量、蒸気原子の衝突による力、蒸
着板に蒸着した蒸気原子の質量が重畳される。従って、
蒸着が進む間は蒸着板に蒸着した蒸気原子の増加により
重量計の指示値は増加する。蒸着を停止した時、蒸気原
子の衝突による力Ｆがなくなるため、重量計の指示値は
増加し、蒸着停止時期以後は、蒸着板の質量と蒸着板に
蒸着した蒸気原子の質量を示して一定となる。By starting or stopping the deposition of vapor atoms onto the deposition plate, the indicated value of the scale that measures the weight of the deposition plate changes as shown in FIG. The indicated value of the weighing scale is constant before the time when vapor deposition starts, indicating only the mass of the vapor deposition plate. When vapor deposition is started, the vapor deposition plate receives a force due to the collision of vapor atoms, and the value indicated on the weighing scale decreases as shown in FIG. 2a. After the vapor deposition start time, the mass of the vapor deposition plate, the force due to the collision of vapor atoms, and the mass of the vapor atoms deposited on the vapor deposition plate are superimposed. Therefore,
While the vapor deposition progresses, the reading on the weight scale increases due to the increase in the number of vapor atoms deposited on the vapor deposition plate. When vapor deposition is stopped, the force F caused by the collision of vapor atoms disappears, so the reading on the weight scale increases, and after the time when vapor deposition is stopped, the value remains constant, indicating the mass of the vapor deposition plate and the mass of the vapor atoms deposited on the vapor deposition plate. becomes.
上記重量計・の指示値の変化から、蒸気量と蒸気速度は
次のようにして求めることができる。From the changes in the indicated values of the weight scale, the steam amount and steam velocity can be determined as follows.
蒸着開始時期と蒸着停止時期の間では、重量計の指示値
Ｍは、
Ｍ＝Ｍｏ＋Ｎ −ｍ−Ｆ ”（１）ここで、
Ｍｏ：蒸着板質量
Ｎ：蒸着した蒸気原子数
ｍ：蒸気原子の質量
Ｆ：蒸気原子の衝突による力
である。蒸着した蒸気原子数Ｎは、単位時間単位面積当
りに蒸着板へ流入した蒸気原子数φ、蒸着板の面積Ａ、
時間ｔの積で求められる。即ち、Ｎ＝φ ・ Ａｔ
・・・・・（２）
（１）式と（２）式から、重量計の指示値の時間変化ｄ
Ｍ／ｄｔは
である。重量計の指示値の時間変化ｄＭ／ｄｔは、第２
図から求められ、蒸着板の面積Ａと蒸気原子の質量ｍは
あらかじめわかれば、（３）式より蒸気量として単位時
間単位面積当りに蒸着板へ流入した蒸気原子数φが得ら
れる。一方、蒸気原子の衝突による力Ｆは蒸気原子の運
動量によるので、Ｆ＝φ・Ａ−ｍ・ｖ／ｇ ・・
・・・（４）ここで、ｇ：重力加速度
Ｖ：蒸気速度
である。蒸気原子の衝突による力Ｆは、第２図の蒸着開
始時期（又は蒸着停止時期）から求められるので、（４
）式より蒸気速度Ｖが得られる。Between the deposition start time and the deposition stop time, the indicated value M of the weighing scale is M=Mo+N−m−F” (1) where,
Mo: mass of vapor deposition plate N: number of vapor atoms deposited m: mass of vapor atoms F: force due to collision of vapor atoms. The number N of vapor atoms deposited is the number φ of vapor atoms flowing into the vapor deposition plate per unit area per unit time, the area A of the vapor deposition plate,
It is determined by the product of time t. That is, N=φ・At...(2) From equations (1) and (2), the time change d of the indicated value of the weighing scale
M/dt is. The time change dM/dt of the indicated value of the weighing scale is the second
If the area A of the vapor deposition plate and the mass m of the vapor atoms are known in advance, the number φ of vapor atoms flowing into the vapor deposition plate per unit time and unit area can be obtained from equation (3) as the amount of vapor. On the other hand, the force F caused by the collision of steam atoms is due to the momentum of the steam atoms, so F=φ・A−m・v/g ・・
...(4) Here, g: gravitational acceleration V: steam velocity. The force F caused by the collision of vapor atoms can be found from the deposition start time (or deposition stop time) in Figure 2, so (4
) The steam velocity V can be obtained from the equation.
以下、本発明の一実施例を第１図により説明する。本実
施例は、真空容器１、真空ポンプ２、蒸発源３、蒸発源
を照射する電子銃９、蒸着板１１、蒸着板を重量計に吊
り下げる金属線Ｉ２、重量計１３、蒸着板への蒸気原子
の蒸着を開始又は停止する手段としてシャッタ（遮蔽板
）１４、回転軸１５、重量計の指示値を記録する測定系
１６、電子銃出力を制御する電子ビーム制御装置１７か
らなる。シャッタ１４は、蒸気４を遮断したり、通過さ
せたりする機能を有するものであり、蒸気遮断時には、
その蒸気通過空間に挿入し、蒸気通過時にはその蒸気通
過空間から取り除くやり方を、回転軸１５の制御によっ
て行う。電子ビーム制御装置１７により、電子銃出力の
値を所定の値にし電子ビーム１０により、蒸発物質を加
熱して蒸気４を得る。この時、シャッタ１４により蒸着
板１１が蒸気４にさらされないように遮断しておく。測
定系１Ｇにより、重量計の指示値の記録を開始した後、
シャッタ１４を回転軸１５を回転させて取り除くことに
より、蒸着板への蒸気原子の蒸着を開始する。所定の時
間経過した後、シャッタ１４により蒸気４が蒸着板１１
に当たらないようにして、蒸着板への蒸気原子の蒸着を
停止させる。この間の重量計１３による測定例第２図に
示す。An embodiment of the present invention will be described below with reference to FIG. This embodiment includes a vacuum container 1, a vacuum pump 2, an evaporation source 3, an electron gun 9 for irradiating the evaporation source, an evaporation plate 11, a metal wire I2 for suspending the evaporation plate from a weighing scale, a weighing scale 13, and a wire to the evaporation plate. A shutter (shielding plate) 14, a rotating shaft 15, a measuring system 16 for recording the indicated value of the weighing scale, and an electron beam control device 17 for controlling the output of the electron gun are used as means for starting or stopping the vapor deposition. The shutter 14 has the function of blocking the steam 4 or allowing it to pass, and when blocking the steam,
The rotary shaft 15 is controlled to insert it into the steam passage space and remove it from the steam passage space when the steam passes. The electron beam control device 17 sets the output of the electron gun to a predetermined value, and the evaporated substance is heated by the electron beam 10 to obtain vapor 4. At this time, the vapor deposition plate 11 is shut off from being exposed to the steam 4 by the shutter 14. After starting to record the indicated value of the weighing scale using measurement system 1G,
By removing the shutter 14 by rotating the rotating shaft 15, vapor deposition of vapor atoms onto the vapor deposition plate is started. After a predetermined period of time has elapsed, the shutter 14 releases the steam 4 onto the deposition plate 11.
This stops the vapor atoms from depositing on the deposition plate. An example of measurement using the weighing scale 13 during this period is shown in FIG.
この実施例では、蒸気原子としてチタンを用いた。蒸発
源から上方２０σの位置に径の大きさが１７ｍのアルミ
蒸着板を配した。電子銃出力０．８ＫＷ（径の大きさが
１０ ｎｔｎの電子ビーム）において、重量計の指示値
の時間変化として１．０６Ｘ ＩＯ−’ ｇ−ｓ−’蒸
気原子の衝突の力として１．０４ Ｘ １０−４ｇｆが
得られた。こおから、蒸気量５．８７Ｘ１０１Ｓａｎ７
”ｓ−’蒸気速度１２９０ ｔｒｒｓ−１が得られる。In this example, titanium was used as the vapor atom. An aluminum vapor-deposited plate with a diameter of 17 m was placed at a position 20σ above the evaporation source. At an electron gun output of 0.8 KW (electron beam with a diameter of 10 ntn), the time change of the indicated value on the weight scale is 1.06X IO-'g-s-' The force of collision of vapor atoms is 1.04 X 10-4gf was obtained. Kokara, steam amount 5.87X101San7
"s-" A steam velocity of 1290 trrs-1 is obtained.
ここで蒸気量とは以下に記載するものである。Here, the amount of steam is described below.
即ち、蒸着速度Ｎ＋ （単位時間、単位面積当りに蒸着
板へ蒸着した原子数）、蒸気流量Ｎ２（単位時間、単位
面積当りに蒸着板へ衝突する原子数）を指す。これら２
つの量は、衝突した原子が蒸着される場合、即ち付着率
Ｓにより、
Ｎ、＝Ｓ−Ｎ２ ・・・・・（５）の関
係がある。通常の物質では、蒸着板の温度が低ければ、
付着率は１である。本実施例においても、蒸着板の温度
は十分低く付着率は１とみなせるので、蒸気量として蒸
着速度、蒸気流量が得られた。更に蒸着停止後の蒸着板
の重量増加分を蒸着物の比重及び蒸着板の面積で割るこ
とによって蒸着膜厚を求めることが出来る。That is, it refers to the vapor deposition rate N+ (the number of atoms deposited on the vapor deposition plate per unit time and unit area) and the vapor flow rate N2 (the number of atoms that collide with the vapor deposition plate per unit time and unit area). These 2
When the colliding atoms are deposited, that is, depending on the deposition rate S, the relationship between the two quantities is as follows: N,=S-N2 (5). For normal substances, if the temperature of the deposition plate is low,
The adhesion rate is 1. In this example as well, since the temperature of the deposition plate was sufficiently low and the deposition rate could be considered as 1, the deposition rate and vapor flow rate were obtained as the amount of vapor. Further, the thickness of the deposited film can be determined by dividing the weight increase of the deposition plate after stopping the deposition by the specific gravity of the deposit and the area of the deposition plate.
一方、同時に得られた蒸気速度は、蒸着膜表面への蒸気
の衝突速度であり、膜表面での蒸気原子の移動を知るパ
ラメータとなる。On the other hand, the vapor velocity obtained at the same time is the impingement velocity of the vapor on the surface of the deposited film, and is a parameter for determining the movement of vapor atoms on the film surface.
本実施例によれば、単一の重量計により、蒸着膜の厚み
を制御する蒸気量と、蒸着膜の性質を制御する蒸気速度
とを同時に得ることが出来た。According to this example, the amount of vapor that controls the thickness of the deposited film and the vapor velocity that controls the properties of the deposited film could be obtained at the same time using a single weighing scale.
以上の実施例では、蒸着状態として蒸気量と蒸気速度、
膜厚としたが、これに限定されない。更に求めた蒸着状
態をもとに、蒸着制御を行うようにしてもよい。重量計
以外の重量測定方法を採用することも可能である。In the above embodiments, the vapor amount and vapor velocity,
Although the film thickness is described above, it is not limited to this. Further, the vapor deposition may be controlled based on the obtained vapor deposition state. It is also possible to employ weight measurement methods other than using a scale.
本実施例によれば、蒸着板への蒸気原子の蒸着を開始又
は停止する手段により、蒸着板への蒸気原子の蒸着を開
始又は停止した時の、蒸着板の重量を感知する重量計の
指示値の変化から、蒸気原子の衝突の力を求めることが
できる。更に、蒸着板の重量を感知する重量計の指示値
から蒸着時に、重量計の指示値の時間変化を求め、併せ
て蒸着時の重量計の指示値の時間変化と蒸気原子の衝突
の力から、蒸気量と蒸気速度を求めることができる。According to this embodiment, the means for starting or stopping the vapor deposition of vapor atoms on the vapor deposition plate indicates an indication of a weighing scale that senses the weight of the vapor deposition plate when the vapor deposition of vapor atoms on the vapor deposition plate is started or stopped. From the change in value, the force of the collision of the vapor atoms can be determined. Furthermore, the time change in the weight scale reading during vapor deposition is determined from the reading on the weight scale that detects the weight of the deposition plate, and the time change in the weight scale reading during vapor deposition and the force of collision of vapor atoms are also calculated. , the amount of steam and steam velocity can be determined.
かくして１本実施例によれば、下記の効果がある。According to this embodiment, the following effects can be obtained.
（１）重量計のみから蒸気量、蒸気速度との両者を併せ
て検出できた。(1) It was possible to detect both the steam amount and steam velocity using only the weighing scale.
（２）蒸着膜の形成方法や形成結果に対する有力な評価
パラメータとしての蒸気速度を正しく求めることができ
る。即ち、このパラメータによれば、蒸気の蒸着対象部
での働きがわかる。蒸気速度は、蒸着対象部への蒸気の
衝突速度であり、その対象部での蒸気の働きをつかめる
。更に蒸着状態（膜厚、膜の形成状態）をつかめる。(2) The vapor velocity, which is a powerful evaluation parameter for the method and result of forming a deposited film, can be accurately determined. That is, according to this parameter, the action of the vapor on the part to be vaporized can be determined. The vapor velocity is the impingement speed of the vapor on the vapor deposition target area, and allows us to understand the effect of the vapor on the target area. Furthermore, the deposition state (film thickness, film formation state) can be determined.
本発明は、以下の効果がある。 The present invention has the following effects.
（１）０重量計のみから蒸気量、蒸気速度の両者を併せ
て検出できる。これらの量から、蒸着状態（膜厚、膜の
形成状態）を監視しながら蒸着膜を形成することが可能
となった。(1) Both the amount of steam and the steam velocity can be detected using only the zero weight scale. From these amounts, it has become possible to form a vapor deposited film while monitoring the vapor deposition state (film thickness, film formation state).
（２）、蒸着膜の形成結果に対する有力な評価パラメー
タとしての蒸気速度を求めることができる。(2) Vapor velocity can be determined as a powerful evaluation parameter for the formation result of a deposited film.
即ち、このパラメータは、蒸着膜表面への蒸気の衝突速
度であり、膜表面での蒸気原子の移動を知ることができ
る。That is, this parameter is the collision speed of vapor against the surface of the deposited film, and allows the movement of vapor atoms on the film surface to be determined.
第１図は本発明の一実施例図、第２図は本発明における
重量計の指示値の時間変化を示した図、第３図は従来技
術の構成図である。
１・・・真空容器、２・・・真空ポンプ、３・・・蒸発
源、４・・・蒸気、５・・・蒸気量モニタ、６・・・蒸
気速度モニタ、７・・・測定系、８・・・蒸発源制御装
置、９・・・電子銃、１０・・・電子ビーム、１１・・
・蒸着板、１２・・・金属線、１３・・・重量計、１４
・・・シャッタ、１５・・・回転軸、１６・・・測定系
、１７・電子ビーム制御装置。FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing changes over time in the indicated value of a weighing scale according to the present invention, and FIG. 3 is a configuration diagram of a conventional technique. DESCRIPTION OF SYMBOLS 1... Vacuum container, 2... Vacuum pump, 3... Evaporation source, 4... Steam, 5... Steam amount monitor, 6... Vapor velocity monitor, 7... Measurement system, 8... Evaporation source control device, 9... Electron gun, 10... Electron beam, 11...
・Vapour-deposited plate, 12... Metal wire, 13... Weight scale, 14
...Shutter, 15.Rotation axis, 16.Measurement system, 17.Electron beam control device.
Claims (15)
着状態を求めてなる蒸着状態測定方法。1. A method for measuring the state of vapor deposition, which involves determining the weight of a vapor deposition plate as it is deposited, and determining the state of vapor deposition from this weight.
始から蒸着停止に至るまでの重量を測定し、この測定重
量から蒸着状態を求めてなる蒸着状態測定方法。2. A method for measuring the state of vapor deposition in which a weighing scale is installed to measure the weight of the vapor deposition plate, the weight is measured from the start of vapor deposition to the stop of vapor deposition, and the state of vapor deposition is determined from the measured weight.
始から蒸着停止に至るまでの重量を測定し、この測定値
から得られる蒸着板への蒸気原子の蒸着開始後の蒸着板
の重量変化から蒸気量を求め、蒸着板への蒸気原子の蒸
着が開始又は停止した時の重量変化から蒸気速度を求め
てなる蒸着状態測定方法。3. A weight scale is installed to measure the weight of the evaporation plate, and the weight is measured from the start of evaporation to the stop of evaporation.The weight change of the evaporation plate after the start of evaporation of vapor atoms on the evaporation plate obtained from this measured value is A method for measuring the state of vapor deposition by determining the amount of vapor and determining the vapor velocity from the change in weight when the vapor deposition of vapor atoms on the vapor deposition plate starts or stops.
始から蒸着停止に至るまでの重量を測定し、この測定値
から得られる蒸着板への蒸気原子の蒸着開始後の蒸着板
の重量変化から単位時間単位面積当りに蒸着板へ流入す
る蒸気原子数を求め、蒸着板への蒸気原子の蒸着が開始
又は停止した時の重量変化から蒸気速度を求めてなる蒸
着状態測定方法。4. A weight scale is installed to measure the weight of the evaporation plate, and the weight is measured from the start of evaporation to the stop of evaporation.The weight change of the evaporation plate after the start of evaporation of vapor atoms on the evaporation plate obtained from this measured value is A method for measuring the state of vapor deposition by determining the number of vapor atoms flowing into the vapor deposition plate per unit time and unit area, and calculating the vapor velocity from the weight change when the vapor atoms start or stop being deposited on the vapor deposition plate.
始から蒸着停止に至るまでの重量を測定し、この測定値
から得られる蒸着板への蒸気原子の蒸着開始後の蒸着板
の重量変化から単位時間当りの膜厚増加分を求め、蒸着
板への蒸気原子の蒸着が開始又は停止した時の重量変化
から蒸気速度を求め、蒸着板への蒸気原子の蒸着停止後
の蒸着板の重量から蒸着膜厚を求めてなる蒸着状態測定
方法。5. A weight scale is installed to measure the weight of the evaporation plate, and the weight is measured from the start of evaporation to the stop of evaporation.The weight change of the evaporation plate after the start of evaporation of vapor atoms on the evaporation plate obtained from this measured value is Calculate the increase in film thickness per unit time, calculate the vapor velocity from the change in weight when the vapor deposition of vapor atoms on the vapor deposition plate starts or stops, and calculate the vapor velocity from the weight of the vapor deposition plate after the vapor deposition of vapor atoms on the vapor deposition plate stops. A method of measuring the deposition state by determining the thickness of the deposited film.
始から蒸着停止に至るまでの重量を測定し、この測定値
から得られる蒸着板への蒸気原子の蒸着開始後の蒸着板
の重量変化から蒸気量を求めてなる蒸着状態測定方法。6. A weight scale is installed to measure the weight of the evaporation plate, and the weight is measured from the start of evaporation to the stop of evaporation.The weight change of the evaporation plate after the start of evaporation of vapor atoms on the evaporation plate obtained from this measured value is A method of measuring the state of vapor deposition by determining the amount of vapor.
始又は停止時の重量を測定し、この測定値から得られる
蒸着板への蒸気原子の蒸着が開始又は停止した時の重量
変化から蒸気速度を求めてなる蒸着状態測定方法。7. A weight scale is installed to measure the weight of the evaporation plate, and the weight at the start or stop of evaporation is measured.The vapor velocity can be determined from the weight change obtained from this measurement value when the evaporation of vapor atoms on the evaporation plate starts or stops. A method for measuring the state of vapor deposition.
量から蒸着状態を求める手段と、より成る蒸着状態測定
装置。8. A vapor deposition state measuring device comprising means for determining the weight of a vapor deposition plate due to vapor deposition, and means for determining the vapor deposition state from this weight.
気原子の蒸着の開始又は停止する手段と、該手段による
開始から停止に至るまでの間の上記重量計の測定値から
蒸着状態を検出する手段と、より成る蒸着状態測定装置
。9. A weighing scale for measuring the weight of the vapor deposition plate, a means for starting or stopping the vapor deposition of vapor atoms onto the vapor deposition plate, and detecting the vapor deposition state from the measured values of the weight scale from the start to the stop by the means. A vapor deposition state measuring device comprising: means for measuring the deposition state;
てなる請求項９の蒸着状態測定装置。10. 10. The vapor deposition state measuring device according to claim 9, wherein said weight scale comprises a vapor deposition plate suspended in a vapor deposition space.
置に設けられたシャッタとする請求項９の蒸着状態測定
装置。11. 10. The evaporation state measuring device according to claim 9, wherein the means for starting or stopping is a shutter provided at a position close to the evaporation source.
量，蒸気速度とする請求項９の蒸着状態測定装置。12. 10. The vapor deposition state measuring device according to claim 9, wherein the vapor deposition state in said detecting means is vapor amount and vapor velocity.
源と、蒸着板への蒸気原子の蒸着の開始又は停止する手
段と、該手段による開始から停止に至るまでの間の上記
求めた重量値から蒸着状態を検出する手段と、該蒸着状
態から蒸着板への蒸着量を制御する手段と、より成る蒸
着装置。13. A means for determining the weight of the vapor deposition plate due to vapor, an evaporation source, a means for starting or stopping the vapor deposition of vapor atoms onto the vapor deposition plate, and from the weight value obtained above from the start to the stop by the means. A vapor deposition apparatus comprising: means for detecting a vapor deposition state; and means for controlling an amount of vapor deposited on a vapor deposition plate based on the vapor deposition state.
る材質とする、請求項１〜７のいずれか１つの蒸着状態
測定方法。14. 8. The vapor deposition state measuring method according to claim 1, wherein the vapor deposition plate is made of a material to which all collided vapor atoms adhere.
る材質とする、請求項８〜１２のいずれか１つの蒸着状
態測定装置。15. The vapor deposition state measuring device according to any one of claims 8 to 12, wherein the vapor deposition plate is made of a material to which all collided vapor atoms adhere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23232690A JP2942327B2 (en) | 1990-09-04 | 1990-09-04 | Evaporation apparatus, method for producing evaporated film, and measurement apparatus used in evaporation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23232690A JP2942327B2 (en) | 1990-09-04 | 1990-09-04 | Evaporation apparatus, method for producing evaporated film, and measurement apparatus used in evaporation apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04116166A true JPH04116166A (en) | 1992-04-16 |
| JP2942327B2 JP2942327B2 (en) | 1999-08-30 |
Family
ID=16937446
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23232690A Expired - Fee Related JP2942327B2 (en) | 1990-09-04 | 1990-09-04 | Evaporation apparatus, method for producing evaporated film, and measurement apparatus used in evaporation apparatus |
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| Country | Link |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997030187A1 (en) * | 1996-02-14 | 1997-08-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for control of a vacuum vaporization process |
| WO1997030186A1 (en) * | 1996-02-14 | 1997-08-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for control of plasma enhanced vacuum coating processes |
| DE102011008047A1 (en) | 2010-11-24 | 2012-05-24 | Von Ardenne Anlagentechnik Gmbh | Controlling deposition process in vacuum apparatus, comprises e.g. measuring physical property, as control variable with dead time for layer deposition, and supplying dead time dependent measurement of control variable to controller |
| DE102013100942A1 (en) | 2013-01-30 | 2014-07-31 | Von Ardenne Anlagentechnik Gmbh | Controlling an evaporation rate of an evaporant in a vacuum coating plant, comprises determining evaporation rate of evaporant in vacuum chamber, and adjusting sheet property by control algorithm using Smith predictor and controller |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110257775A (en) * | 2019-06-17 | 2019-09-20 | 深圳市华星光电技术有限公司 | Evaporation coating device and evaporation coating method |
-
1990
- 1990-09-04 JP JP23232690A patent/JP2942327B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997030187A1 (en) * | 1996-02-14 | 1997-08-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for control of a vacuum vaporization process |
| WO1997030186A1 (en) * | 1996-02-14 | 1997-08-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for control of plasma enhanced vacuum coating processes |
| US6086963A (en) * | 1996-02-14 | 2000-07-11 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Method and device for control of a vacuum vaporization process |
| DE102011008047A1 (en) | 2010-11-24 | 2012-05-24 | Von Ardenne Anlagentechnik Gmbh | Controlling deposition process in vacuum apparatus, comprises e.g. measuring physical property, as control variable with dead time for layer deposition, and supplying dead time dependent measurement of control variable to controller |
| DE102013100942A1 (en) | 2013-01-30 | 2014-07-31 | Von Ardenne Anlagentechnik Gmbh | Controlling an evaporation rate of an evaporant in a vacuum coating plant, comprises determining evaporation rate of evaporant in vacuum chamber, and adjusting sheet property by control algorithm using Smith predictor and controller |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2942327B2 (en) | 1999-08-30 |
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