JPH04115184U - Hybrid integrated circuit devices and trays for transporting hybrid integrated circuit devices - Google Patents
Hybrid integrated circuit devices and trays for transporting hybrid integrated circuit devicesInfo
- Publication number
- JPH04115184U JPH04115184U JP2521591U JP2521591U JPH04115184U JP H04115184 U JPH04115184 U JP H04115184U JP 2521591 U JP2521591 U JP 2521591U JP 2521591 U JP2521591 U JP 2521591U JP H04115184 U JPH04115184 U JP H04115184U
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- Prior art keywords
- integrated circuit
- hybrid integrated
- guide
- circuit device
- tray
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- 238000004806 packaging method and process Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
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- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
(57)【要 約】
【目 的】 混成集積回路装置の端子リードが、搬送中
の振動によって、トレイの側壁に当たって曲がらないよ
うな構成をした混成集積回路装置および当該混成集積回
路装置を梱包および搬送するトレイを提供する。
【構 成】 ガイド部材は、その下部の支持部が混成集
積回路装置の上面に取り付けられている。そして、混成
集積回路装置の上面と上記ガイド部材から突出している
ガイド部とでガイド溝が形成されている。一方、トレイ
は、その両側壁からガイドレールが突出しており、その
ガイドレールの先端に間隙部が形成されている。そし
て、前記混成集積回路装置に取り付けられたガイド部材
のガイド溝が、前記トレイの間隙部から入り、ガイド部
材のガイド部が前記ガイドレール上に摺動自在に載置さ
れる。
(57) [Summary] [Purpose] Packaging and packaging of hybrid integrated circuit devices and hybrid integrated circuit devices configured so that the terminal leads of the hybrid integrated circuit devices do not bend against the side walls of the tray due to vibration during transportation. Provide a tray for transport. [Structure] The lower support portion of the guide member is attached to the upper surface of the hybrid integrated circuit device. A guide groove is formed by the upper surface of the hybrid integrated circuit device and the guide portion protruding from the guide member. On the other hand, the tray has guide rails protruding from both side walls, and a gap is formed at the tip of the guide rail. Then, a guide groove of a guide member attached to the hybrid integrated circuit device enters the gap portion of the tray, and the guide portion of the guide member is slidably placed on the guide rail.
Description
【０００１】0001
本考案は、電子部品、特に混成集積回路装置の端子リードが、搬送中の振動に よって、トレイの側壁に当たっても曲がらない混成集積回路装置および当該混成 集積回路装置を搬送するトレイに関するものである。 This invention is designed to prevent electronic components, especially the terminal leads of hybrid integrated circuit devices, from vibration during transportation. Therefore, a hybrid integrated circuit device that does not bend even when it hits the side wall of the tray, and The present invention relates to a tray for transporting integrated circuit devices.
【０００２】0002
図５および図６を参照しつつ従来例における混成集積回路装置を搬送するトレ イについて説明する。図５は従来例における中空状トレイ説明図である。図６は 従来例における盤状トレイ説明図である。図５において、透視的に描かれている 中空状トレイ５１は、その中空内部に一列にたとえば、面実装用の混成集積回路 装置５２が挿入される。中空状トレイ５１の中空内部の断面の大きさは、前記混 成集積回路装置５２の端子リード５３の両端の長さおよび上下の高さの積より少 し大き目になっている。このような構成の中空状トレイ５１は、その中に多数の 前記混成集積回路装置５２を挿入して梱包すると共に搬送する際に使用される。 また、図６において、盤状トレイ６１は、その上に前記混成集積回路装置５２と 略同じ大きさの枠６２で仕切られている。そして、前記混成集積回路装置５２は 、この枠６２内に載置され、この盤状トレイ６１を数段重ねることにより梱包さ れると共に搬送される。 Referring to FIGS. 5 and 6, a train for transporting a hybrid integrated circuit device in the conventional example is explained. Let me explain about A. FIG. 5 is an explanatory diagram of a hollow tray in a conventional example. Figure 6 is It is an explanatory view of a disk-shaped tray in a conventional example. In Figure 5, it is drawn perspectively. The hollow tray 51 has, for example, surface-mounted hybrid integrated circuits arranged in a row inside the hollow tray 51. Device 52 is inserted. The cross-sectional size of the hollow interior of the hollow tray 51 is determined by less than the product of the length of both ends of the terminal lead 53 of the integrated circuit device 52 and the height of the top and bottom. It's getting bigger. The hollow tray 51 having such a configuration has a large number of It is used when the hybrid integrated circuit device 52 is inserted, packed, and transported. Further, in FIG. 6, a plate-shaped tray 61 has the hybrid integrated circuit device 52 on it. They are partitioned by frames 62 of approximately the same size. The hybrid integrated circuit device 52 is , placed in this frame 62, and packed by stacking several stages of this plate-shaped tray 61. and transported.
【０００３】0003
近年、混成集積回路装置は、小型化の傾向にあり、端子リード数が増加してい る。小型化により狭いピッチで両側に整列された端子リードを有する混成集積回 路装置５２は、図５に示すような中空状トレイ５１に、挿入されており、このよ うな状態で梱包されると共に搬送される。しかし、中空状トレイ５１の搬送途中 に振動が加えられると、混成集積回路装置５２の端子リード５３は、中空状トレ イ５１の側壁５４に当たり、曲がる場合がしばしば発生した。このように搬送途 中に曲げられた端子リード５３を有する混成集積回路装置５２が、図示されてい ない回路基板に実装された場合、当該端子リード５３は、回路基板の所定の場所 に載置されずに、不所望の配線パターンと接続してしまうという問題を有する。 In recent years, hybrid integrated circuit devices have been trending toward miniaturization, and the number of terminal leads has increased. Ru. Hybrid integrated circuit with terminal leads aligned on both sides with narrow pitch due to miniaturization The channel device 52 is inserted into a hollow tray 51 as shown in FIG. It is packed and transported in such a condition. However, while the hollow tray 51 is being transported, When vibration is applied to the terminal lead 53 of the hybrid integrated circuit device 52, the hollow tray There were many cases where it hit the side wall 54 of the side wall 51 and bent. Transported like this A hybrid integrated circuit device 52 having terminal leads 53 bent therein is shown. If the terminal lead 53 is mounted on a circuit board that is not There is a problem in that the wiring pattern is not placed on the board and is connected to an undesired wiring pattern.
【０００４】 また、図６に示すような盤状トレイ６１の枠６２内に載置された混成集積回路 装置５２は、搬送される際の振動により、端子リード５３が枠６２に当たり曲が る場合がある。したがって、盤状トレイ６１で混成集積回路装置５２を搬送する 場合においても、前記中空状トレイ５１の場合と同じ問題を有する。0004 Further, a hybrid integrated circuit placed within a frame 62 of a plate-like tray 61 as shown in FIG. When the device 52 is transported, the terminal lead 53 hits the frame 62 and bends due to vibration. There may be cases where Therefore, the hybrid integrated circuit device 52 is transported by the plate-like tray 61. In this case, the same problem as in the case of the hollow tray 51 occurs.
【０００５】 本考案は、以上のような問題を解決するためのもので、混成集積回路装置の端 子リードが、搬送中の振動によって、トレイの側壁に当たって曲がらないような 構成をした混成集積回路装置および混成集積回路装置を梱包および搬送するトレ イを提供することを目的とする。[0005] This invention is intended to solve the above-mentioned problems, and is intended to solve the problems mentioned above. Make sure that the child lead does not bend against the side wall of the tray due to vibration during transportation. The hybrid integrated circuit device that has been configured and the training equipment for packing and transporting the hybrid integrated circuit device. The purpose is to provide
【０００６】[0006]
前記目的を達成するために、本考案の混成集積回路装置は、混成集積回路装置 の上面に支持部によって取り付けられた少なくとも一つのガイド部材と、前記混 成集積回路装置の上面と前記ガイド部材から突出したガイド部とによって形成さ れたガイド溝とから構成される。 In order to achieve the above object, the hybrid integrated circuit device of the present invention is a hybrid integrated circuit device. at least one guide member attached to the upper surface by a support; formed by the upper surface of the integrated circuit device and the guide portion protruding from the guide member. It consists of a guide groove.
【０００７】 また、本考案の混成集積回路装置を搬送する前後を開放したトレイは、前記ガ イド部１５を支持するように設けられたガイドレール２７、２８と、当該ガイド レール上に前記ガイド部材のガイド部を載置した際に、前記混成集積回路装置を 摺動自在に移動し得る間隙部とから構成される。[0007] Further, the tray with the front and back sides open for transporting the hybrid integrated circuit device of the present invention is Guide rails 27 and 28 provided to support the side part 15 and the guide When the guide portion of the guide member is placed on the rail, the hybrid integrated circuit device and a gap portion that can be slidably moved.
【０００８】[0008]
ガイド部材は、たとえば、Ｔ字型板状部材あるいは逆Ｌ字型部材からなり、そ の下部の支持部が混成集積回路装置の上面に取り付けられている。そして、混成 集積回路装置の上面と上記ガイド部材から突出しているガイド部とでガイド溝が 形成されている。一方、トレイは、たとえば、その両側壁または上部からガイド レールが突出しており、そのガイドレールの先端に間隙部が形成されている。そ して、前記混成集積回路装置に取り付けられたガイド部材のガイド溝が、前記ト レイの間隙部から入り、ガイド部材のガイド部が前記ガイドレール上に載置され る。以上のように、トレイ内の混成集積回路装置は、トレイに入れられて梱包さ れた後、搬送中に振動が加えられると、混成集積回路装置に取り付けられたガイ ド部材の支持部がトレイのガイドレールの間隙部によって振動を規制する。した がって、混成集積回路装置の端子リードは、搬送中の振動によってトレイの側壁 に当たることがない。また、トレイには、ガイドレールが設けられており、混成 集積回路装置の位置を規制した状態で移動できるので、混成集積回路装置を回路 基板の所定位置に供給する際のカートリッジとしても使用できる。 The guide member is, for example, a T-shaped plate member or an inverted L-shaped member. A lower support is attached to the top surface of the hybrid integrated circuit device. And mixed A guide groove is formed between the top surface of the integrated circuit device and the guide portion protruding from the guide member. It is formed. On the other hand, the tray can be guided from its side walls or from the top, for example The rail protrudes, and a gap is formed at the tip of the guide rail. So The guide groove of the guide member attached to the hybrid integrated circuit device is aligned with the guide groove of the guide member attached to the hybrid integrated circuit device. The guide part of the guide member is placed on the guide rail. Ru. As described above, the hybrid integrated circuit device in the tray is packed in the tray. If vibration is applied during transportation after the hybrid integrated circuit device is The supporting portion of the tray member regulates vibration by the gap between the guide rails of the tray. did Therefore, the terminal leads of hybrid integrated circuit devices can be damaged by the side walls of the tray due to vibration during transportation. It never hits. In addition, the tray is equipped with guide rails, allowing Since the integrated circuit device can be moved with its position regulated, the hybrid integrated circuit device can be moved in a controlled manner. It can also be used as a cartridge when supplying the substrate to a predetermined position.
【０００９】[0009]
図１および図２を参照しつつ本考案の一実施例を説明する。図１は本考案の一 実施例である混成集積回路装置説明図である。図２は本考案の一実施例である中 空状トレイ説明図である。図１において、混成集積回路装置１１は、たとえば、 面実装型のもので、その両端に端子リード１２が設けられている。また、混成集 積回路装置１１の上面には、Ｔ字型板状部材１３が、たとえば、接着剤等で取り 付けられている。Ｔ字型板状部材１３は、下部に支持部１４と、支持部１４を中 心として左右上部にガイド部１５とが設けられている。また、当該Ｔ字型板状部 材１３の支持部を混成集積回路装置１１の上面に取り付けた場合、混成集積回路 装置１１の上面と前記ガイド部１５とでガイド溝１６が形成される。 An embodiment of the present invention will be described with reference to FIGS. 1 and 2. Figure 1 shows one example of this invention. FIG. 1 is an explanatory diagram of a hybrid integrated circuit device according to an embodiment. Figure 2 shows an example of the present invention. It is an explanatory diagram of an empty tray. In FIG. 1, the hybrid integrated circuit device 11 includes, for example, It is a surface mount type, and terminal leads 12 are provided at both ends. Also, a mixed collection A T-shaped plate-like member 13 is attached to the top surface of the integrated circuit device 11 using adhesive or the like. It is attached. The T-shaped plate member 13 has a support part 14 at the bottom and a support part 14 in the middle. Guide portions 15 are provided at the left and right upper portions as a center. In addition, the T-shaped plate-like part When the supporting portion of the material 13 is attached to the upper surface of the hybrid integrated circuit device 11, the hybrid integrated circuit A guide groove 16 is formed between the upper surface of the device 11 and the guide portion 15 .
【００１０】 一方、中空状トレイ２１は、側壁２２、２３と上面２４および下面２５とから 構成される中空部２６を有する。そして、側壁２２および側壁２３から前記中空 部２６の内部に向かってガイドレール２７およびガイドレール２８が突出してい る。また、ガイドレール２７、２８の先端には、間隙部２９が形成されている。 当該間隙部２９は、前記混成集積回路装置１１に取り付けられたＴ字型板状部材 １３の支持部１４が遊嵌できる距離を有する。さらに、ガイドレール２７、２８ と前記上面２４との間隔は、前記混成集積回路装置１１に取り付けられたＴ字型 板状部材１３のガイド部１５が摺動自在になる程度の距離を有する。0010 On the other hand, the hollow tray 21 has side walls 22 and 23, an upper surface 24, and a lower surface 25. It has a hollow part 26 configured. Then, from the side wall 22 and the side wall 23, A guide rail 27 and a guide rail 28 protrude toward the inside of the section 26. Ru. Furthermore, a gap 29 is formed at the tips of the guide rails 27 and 28. The gap 29 is a T-shaped plate member attached to the hybrid integrated circuit device 11. It has a distance that allows the thirteen supporting parts 14 to be loosely fitted. Furthermore, guide rails 27, 28 The distance between the upper surface 24 and the T-shaped The distance is such that the guide portion 15 of the plate member 13 can freely slide.
【００１１】 図４は混成集積回路装置を中空状トレイに梱包した際の断面図を示す。図４に おいて示すように、Ｔ字型板状部材１３が取り付けられた混成集積回路装置１１ は、中空状トレイ２１に入れられて梱包された後、図示されていない電子機器の 回路基板を組み立てる場所に搬送される。中空状トレイ２１は、搬送中に振動が 加えられると、混成集積回路装置１１に取り付けられたＴ字型板状部材１３の支 持部１４が中空状トレイ２１のガイドレール２７、２８における間隙部２９によ って振動を規制する。したがって、混成集積回路装置１１の端子リード１２は、 搬送中の振動によって中空状トレイ２１の側壁２２、２３に当たって曲がること がないので、前記回路基板の所定位置に取り付けられる。また、中空状トレイ２ １は、その側壁２２、２３から突出してガイドレール２７、２８が設けられてお り、当該ガイドレール２７、２８の間の間隙部２９によって、混成集積回路装置 １１の振動を規制した状態で移動させるので、混成集積回路装置１１を回路基板 の所定位置に供給する際のカートリッジとしても使用できる。[0011] FIG. 4 shows a cross-sectional view of the hybrid integrated circuit device packed in a hollow tray. In Figure 4 As shown in FIG. is placed in the hollow tray 21 and packed, and then the electronic equipment (not shown) is placed in the hollow tray 21 and packed. The circuit boards are transported to the place where they are assembled. The hollow tray 21 does not vibrate during transportation. When added, the T-shaped plate member 13 attached to the hybrid integrated circuit device 11 is supported. The holding part 14 is inserted into the gap 29 between the guide rails 27 and 28 of the hollow tray 21. to regulate vibration. Therefore, the terminal leads 12 of the hybrid integrated circuit device 11 are Bending by hitting the side walls 22 and 23 of the hollow tray 21 due to vibration during transportation. Since there are no holes, it can be attached to a predetermined position on the circuit board. In addition, hollow tray 2 1 is provided with guide rails 27 and 28 protruding from its side walls 22 and 23. The gap 29 between the guide rails 27 and 28 allows the hybrid integrated circuit device to Since the hybrid integrated circuit device 11 is moved while controlling the vibration of the circuit board 11, It can also be used as a cartridge when supplying to a predetermined location.
【００１２】 図３は本考案の他の実施例である混成集積回路装置説明図である。図３におい て、混成集積回路装置１１の上面には、逆Ｌ字型部材３１が取り付けられている 。逆Ｌ字型部材３１は、下部に支柱３３からなる支持部と、当該支柱３３から一 方に折曲げられたガイド部３２とが設けられている。また、当該逆Ｌ字型部材３ １の支柱３３を混成集積回路装置１１の上面に、たとえば、接着剤で取り付けた 場合、混成集積回路装置１１の上面と前記ガイド部３２とでガイド溝１６が形成 される。このような構成の逆Ｌ字型部材３１は、図３に示すごとく、混成集積回 路装置１１の上面に少なくとも３個取り付けた状態で、図２に示す中空状トレイ ２１に挿入して梱包する。その後の逆Ｌ字型部材３１の作用は、Ｔ字型板状部材 １３と全く同様であるから説明を省略する。0012 FIG. 3 is an explanatory diagram of a hybrid integrated circuit device according to another embodiment of the present invention. Figure 3 Smell An inverted L-shaped member 31 is attached to the top surface of the hybrid integrated circuit device 11. . The inverted L-shaped member 31 has a support portion consisting of a column 33 at the bottom and a portion extending from the column 33. A guide portion 32 is provided which is bent in the opposite direction. In addition, the inverted L-shaped member 3 1 is attached to the top surface of the hybrid integrated circuit device 11 with adhesive, for example. In this case, a guide groove 16 is formed between the upper surface of the hybrid integrated circuit device 11 and the guide portion 32. be done. The inverted L-shaped member 31 having such a configuration is a hybrid integrated circuit as shown in FIG. At least three hollow trays shown in FIG. 21 and pack it. The subsequent action of the inverted L-shaped member 31 is that of the T-shaped plate member. Since it is exactly the same as No. 13, the explanation will be omitted.
【００１３】 以上、本考案の実施例を詳述したが、本考案は、前記実施例に限定されるもの ではない。そして、実用新案登録請求の範囲に記載された本考案を逸脱すること がなければ、種々の設計変更を行うことが可能である。たとえば、混成集積回路 装置に取り付けるガイド部材の形状は、Ｔ字型板状部材あるいは逆Ｌ字型部材に 限定されるものではなく、トレイのガイドレールに係合して摺動自在に移動でき るものであればよい。また、トレイは、中空状部材のもの以外に、上面がない形 状のもの、あるいは逆Ｌ字型のガイドレールを上方から対向するようにして設置 しても良い。このように上方から逆Ｌ字型のガイドレールを設置すると、一つの トレーに対して、複数列のガイドレールを取り付けることができる。さらに、ガ イド部材およびトレイの材質は、安価な合成樹脂で、簡単に一体成形ができるも のであれば、どのようなものでも良い。さらに、ガイドレールあるいはガイド部 材の支持部等にたとえば、テフロン（商標名）を被覆しておけば長いトレイにし ても、混成集積回路装置の移動が滑らかになる。[0013] Although the embodiments of the present invention have been described in detail above, the present invention is limited to the above embodiments. isn't it. and departing from the invention stated in the scope of the utility model registration claim. If not, various design changes can be made. For example, hybrid integrated circuits The shape of the guide member attached to the device can be a T-shaped plate member or an inverted L-shaped member. The tray can be slidably moved by engaging with the guide rail of the tray. It is fine as long as it is suitable. In addition, trays other than those with hollow members may have a shape that does not have a top surface. or inverted L-shaped guide rails facing each other from above. You may do so. If you install an inverted L-shaped guide rail from above like this, one Multiple rows of guide rails can be attached to the tray. In addition, The material for the side parts and tray is an inexpensive synthetic resin that can be easily molded into one piece. Anything is fine as long as it is. Furthermore, the guide rail or guide section For example, if the support part of the material is coated with Teflon (trade name), you can make a long tray. However, the hybrid integrated circuit device can be moved smoothly.
【００１４】[0014]
本考案によれば、混成集積回路装置の上面にガイド部と支持部とからなるガイ ド部材を取り付け、トレイにガイド部を摺動自在に案内するガイドレールを設け たので、混成集積回路装置の端子リードがトレイの側壁に当たることない。した がって、混成集積回路装置の端子リードは、曲がらないので、回路基板に取り付 ける際に所定位置に取り付けられる。また、ガイドレールが設けられたトレイは 、混成集積回路装置を所定位置に搬送できるので、混成集積回路装置を回路基板 の所定位置に供給する際のカートリッジとして使用できる。 According to the present invention, a guide consisting of a guide part and a support part is provided on the top surface of a hybrid integrated circuit device. Attach the guide member and install a guide rail on the tray to slidably guide the guide part. Therefore, the terminal leads of the hybrid integrated circuit device do not come into contact with the side walls of the tray. did Therefore, the terminal leads of hybrid integrated circuit devices do not bend and are difficult to attach to the circuit board. It can be attached to a predetermined position during installation. In addition, trays with guide rails are , since the hybrid integrated circuit device can be transported to a predetermined position, the hybrid integrated circuit device can be transferred to the circuit board. It can be used as a cartridge when supplying to a predetermined location.
【図１】本考案の一実施例である混成集積回路装置説明
図である。FIG. 1 is an explanatory diagram of a hybrid integrated circuit device that is an embodiment of the present invention.
【図２】本考案の一実施例である中空状トレイ説明図で
ある。FIG. 2 is an explanatory diagram of a hollow tray that is an embodiment of the present invention.
【図３】本考案の他の実施例である混成集積回路装置説
明図である。FIG. 3 is an explanatory diagram of a hybrid integrated circuit device according to another embodiment of the present invention.
【図４】混成集積回路装置を中空状トレイに梱包した際
の断面図を示す。FIG. 4 shows a cross-sectional view of the hybrid integrated circuit device packed in a hollow tray.
【図５】従来例における中空状トレイ説明図である。FIG. 5 is an explanatory diagram of a hollow tray in a conventional example.
【図６】従来例における盤状トレイ説明図である。FIG. 6 is an explanatory diagram of a disc-shaped tray in a conventional example.
１１ 混成集積回路装置 ２４ 上面
１２ 端子リード ２５ 下面
１３ Ｔ字型板状部材 ２６ 中空部
１４ 支持部 ２７ ガイド
レール
１５ ガイド部 ２８ ガイド
レール
１６ ガイド溝 ２９ 間隙部
２１ 中空状トレイ ３１ 逆Ｌ字
型部材
２２ 側壁 ３２ ガイド
部
２３ 側壁 ３３ 支柱11 Hybrid integrated circuit device 24 Top surface 12 Terminal lead 25 Bottom surface 13 T-shaped plate member 26 Hollow part 14 Support part 27 Guide rail 15 Guide part 28 Guide rail 16 Guide groove 29 Gap part 21 Hollow tray 31 Inverted L-shaped member 22 Side wall 32 Guide part 23 Side wall 33 Support column
Claims (2)
４によって取り付けられた少なくとも一つのガイド部材
１３、３１と、前記混成集積回路装置１１の上面と前記
ガイド部材１３から突出したガイド部１５とによって形
成されたガイド溝１６と、を備えたことを特徴とする混
成集積回路装置。Claim 1: A support portion 1 is provided on the upper surface of the hybrid integrated circuit device 11.
4, and a guide groove 16 formed by the upper surface of the hybrid integrated circuit device 11 and the guide portion 15 protruding from the guide member 13. Hybrid integrated circuit device.
イド部１５を支持するように設けられたガイドレール２
７、２８と、当該ガイドレール２７、２８上に前記ガイ
ド部材１３、３１のガイド部１５、３２を載置した際
に、前記混成集積回路装置１１が摺動自在に移動し得る
間隙部２９と、を備えたことを特徴とする請求項１の混
成集積回路装置を搬送するトレイ。2. A guide rail 2 provided to support the guide portion 15 in a tray with an open front and rear sides.
7, 28, and a gap 29 in which the hybrid integrated circuit device 11 can slidably move when the guide portions 15, 32 of the guide members 13, 31 are placed on the guide rails 27, 28. 2. A tray for transporting a hybrid integrated circuit device according to claim 1, further comprising: .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991025215U JP2509818Y2 (en) | 1991-03-25 | 1991-03-25 | Hybrid integrated circuit device and tray for carrying hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991025215U JP2509818Y2 (en) | 1991-03-25 | 1991-03-25 | Hybrid integrated circuit device and tray for carrying hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04115184U true JPH04115184U (en) | 1992-10-12 |
| JP2509818Y2 JP2509818Y2 (en) | 1996-09-04 |
Family
ID=31909994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991025215U Expired - Lifetime JP2509818Y2 (en) | 1991-03-25 | 1991-03-25 | Hybrid integrated circuit device and tray for carrying hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509818Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3100190U (en) * | 2003-09-01 | 2004-04-30 | 洋▲きん▼科技股▲ふん▼有限公司 | Liquid flow type heat conductive sheet |
-
1991
- 1991-03-25 JP JP1991025215U patent/JP2509818Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3100190U (en) * | 2003-09-01 | 2004-04-30 | 洋▲きん▼科技股▲ふん▼有限公司 | Liquid flow type heat conductive sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509818Y2 (en) | 1996-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960319 |