JPH04113926U - Vacuum pressure bonding device with rubber plate structure - Google Patents
Vacuum pressure bonding device with rubber plate structureInfo
- Publication number
- JPH04113926U JPH04113926U JP1676791U JP1676791U JPH04113926U JP H04113926 U JPH04113926 U JP H04113926U JP 1676791 U JP1676791 U JP 1676791U JP 1676791 U JP1676791 U JP 1676791U JP H04113926 U JPH04113926 U JP H04113926U
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- pressure
- rubber plate
- adhesive
- lattice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
(57)【要約】
【目的】大面積の接着面を高精度に均一接着層のもとに
接着させる接着技術である、その為柔軟な接着部分に均
一な加圧力が与えられるかが課題であり、均一な加圧力
を得る真空加圧式接着構造達成がその目的である。
【構成】図1より、真空容器3は下ゴム板4の内側に格
子状の突起部を有したものと一体と成っており、その部
に接着部材10,11を載せ、次に上ゴム板1の内側面
に格子状の突起部を有するものと一体の蓋部材5をOリ
ング9を介して載せて固定する、尚真空容器3には真空
排管8,圧力計6,真空ポンプ7が接続された構成と成
っており、真空排気されると接着部材10,11の上下
面部に形成される格子状の真空排気空間2に対し均一に
分散した加圧力Pが掛かることが特徴と成っている。
【効果】(1)均一加圧の達成で、接着層の厚みが高精度
に保持され平面度の高い接着が可能。(2)大面積の接着
が平坦度(20μm/400mmカク)と高精度と成り複
合異材のベース製作や軽量化が可能と成る。
(57) [Abstract] [Purpose] This is an adhesive technology that allows a large area of adhesive surface to be adhered to a uniform adhesive layer with high precision.Therefore, the issue is whether uniform pressure can be applied to the flexible adhesive area. The purpose is to achieve a vacuum pressure bonding structure that provides uniform pressure. [Structure] From FIG. 1, the vacuum container 3 is integrated with a lower rubber plate 4 having a lattice-shaped protrusion on the inside, adhesive members 10 and 11 are placed on that part, and then the upper rubber plate A lid member 5, which is integrated with a lid member 5 having a grid-like protrusion on the inner surface of the container 1, is mounted and fixed via an O-ring 9.The vacuum container 3 is equipped with a vacuum exhaust pipe 8, a pressure gauge 6, and a vacuum pump 7. It has a connected configuration, and is characterized in that when it is evacuated, a uniformly distributed pressurizing force P is applied to the lattice-shaped vacuum evacuation space 2 formed on the upper and lower surfaces of the adhesive members 10 and 11. There is. [Effects] (1) By achieving uniform pressure, the thickness of the adhesive layer is maintained with high precision, making it possible to bond with high flatness. (2) Large-area bonding achieves flatness (20 μm/400 mm) and high precision, making it possible to manufacture bases for composite materials and reduce weight.
Description
【0001】0001
大面積のXYテーブルを高精度に制御させる精密構造部は、計測機器や、半導 体製造装置などがその利用分野であり、動向としては、高性能化,制御のスピー ド化,経済性等があげられ、その手段として接着構造採用による複合材構造のテ ーブルの軽量化、及び、制御のスピード化が期待できる。 The precision structure that controls the large-area XY table with high precision is used for measuring equipment and semiconductor devices. The field of application is body manufacturing equipment, etc., and the trend is toward higher performance and control speed. As a means of achieving this goal, composite material structures using adhesive structures have been proposed. It is expected that the weight of the cable will be reduced and control speed will be increased.
【0002】0002
図3に従来の厚板治具加圧方式のゴム板構造真空加圧式接着装置を示す。 FIG. 3 shows a conventional rubber plate structure vacuum pressure bonding device using a thick plate jig pressure method.
【0003】 図より、接着部材10,11は下ゴム板4Bの下面加圧部を有する真空容器3 内の厚板治具15上にセットし、その上に上部加圧の為の厚板治具15を載せ、 次に上ゴム板1Bの上面加圧部を有する蓋部材5をOリング9を介して図の様に 真空容器3上に固定する。0003 As shown in the figure, the adhesive members 10 and 11 are attached to a vacuum container 3 having a pressure section on the lower surface of the lower rubber plate 4B. Set it on the thick plate jig 15 inside, place the thick plate jig 15 for upper pressure on it, Next, attach the lid member 5 having the upper surface pressure part of the upper rubber plate 1B via the O-ring 9 as shown in the figure. Fix it on the vacuum container 3.
【0004】 尚、真空容器3は、真空排管8より真空ポンプ7により排気されその時の圧力 が真空圧力計6に表示される。0004 In addition, the vacuum container 3 is evacuated by the vacuum pump 7 through the vacuum exhaust pipe 8, and the pressure at that time is is displayed on the vacuum pressure gauge 6.
【0005】 以上のような真空容器3で真空排気が行われると、図より、内部の真空排気空 間2は、圧力が低下し外部雰囲気(大気圧)とに圧力差が生じPの圧力1kg/cm2 が加圧力としてゴム板1B,4Bに掛る、従って、上下面の厚板治具15の周囲 のみ、つまり図示の真空排気空間2の部位のゴム板のみが強く加圧される。When vacuum evacuation is performed in the vacuum container 3 as described above, the pressure in the internal vacuum evacuation space 2 decreases, creating a pressure difference with the external atmosphere (atmospheric pressure), resulting in a pressure of P of 1 kg/kg. cm 2 is applied to the rubber plates 1B and 4B as pressurizing force. Therefore, only the periphery of the thick plate jig 15 on the upper and lower surfaces, that is, only the rubber plates in the illustrated evacuation space 2 are strongly pressurized.
【0006】 尚、その時厚板治具15の周囲近傍の上下ゴム板1B,4Bは厚板に密着して しまいそれにより周囲付近に密着部A範囲ができ其の結果密着部Aより中央側の ゴム板内部は真空排気されず、大気圧に近い圧力状態のままの為、その中央部は 全く加圧されないこととなる。[0006] At this time, the upper and lower rubber plates 1B and 4B near the periphery of the thick plate jig 15 are in close contact with the thick plate. As a result, a contact area A area is created near the periphery, and as a result, the area closer to the center than the contact area A is The inside of the rubber plate is not evacuated and the pressure remains close to atmospheric pressure, so the central part No pressure will be applied at all.
【0007】 従って、接着部材10,11に掛かる加圧力は、厚板治具15の周囲に掛る圧 力Pが厚板治具15全体分の分割した押し圧pとなつて掛るだけとなる。[0007] Therefore, the pressure applied to the adhesive members 10 and 11 is the pressure applied around the thick plate jig 15. The force P is only applied as a divided pressing force p for the entire thick plate jig 15.
【0008】 従って、充分な加圧力が掛った状態とはなっていない。[0008] Therefore, a sufficient pressing force is not applied.
【0009】[0009]
図2は、加圧用ゴム板に於ける気密シール現象による加圧されない部分が発生 する例を表したものである。 Figure 2 shows that there are parts that are not pressurized due to the airtight seal phenomenon in the pressurizing rubber plate. This shows an example.
【0010】 図によると、円板12の中央にリング13を載せそれをゴム板14で覆い矢印 のごとく真空排気した場合、円板周囲の部分の真空排気空間2は、大気圧との圧 力差により加圧力P(1kg/cm2)が掛るが、一方円板12とゴム板14との面接 触部は、円板12周囲部分の加圧力によりゴム板14が押しつけられリング13 周囲付近の部分で密着状態Aとなり、リング13によりゴム板14が押し上げら れ形成されている空間は、排気されず大気圧に近い圧力P0 と成っている。According to the figure, when the ring 13 is placed in the center of the disk 12 and covered with a rubber plate 14 and evacuated as shown by the arrow, the evacuated space 2 around the disk has a pressure difference from atmospheric pressure. On the other hand, at the area of surface contact between the disc 12 and the rubber plate 14, the rubber plate 14 is pressed by the pressing force around the disc 12, and the area near the periphery of the ring 13 is applied. In this state, the rubber plate 14 is pushed up by the ring 13 and the space formed is not evacuated and has a pressure P 0 close to atmospheric pressure.
【0011】 つまり、圧力差が生じないため加圧力も掛らない状態にある。[0011] In other words, since no pressure difference occurs, no pressing force is applied.
【0012】 従って、本考案は、円板12及びリング13部に対し、均一な加圧力が掛るよ うにするために均一に分散した真空排気空間2を形成出来る加圧部構造を考案し 外部の大気圧とに圧力差を生じさせ、其の結果、均一に分散した加圧力を得るこ とを目的としている。0012 Therefore, the present invention enables uniform pressing force to be applied to the disk 12 and ring 13. In order to achieve this, we devised a pressurizing part structure that can form a uniformly distributed vacuum exhaust space 2. Creates a pressure difference with the external atmospheric pressure, resulting in a uniformly distributed pressurizing force. The purpose is to
【0013】[0013]
接着部材の加圧表面は、平面あるいは凹凸を有する場合が予想されるため、加 圧部材と成るゴム板の内側、即ち、接着部材の加圧面接触側に格子状の突起部を 設け、必ず、ゴム板と接着部材の加圧面間に真空排気空間が分散して形成される ような、格子状突起部付きゴム板構造の真空加圧式接着法を採用した。 The pressurizing surface of the adhesive member is expected to be flat or uneven; A lattice-shaped protrusion is placed on the inside of the rubber plate that serves as the pressure member, that is, on the side that contacts the pressure surface of the adhesive member. The vacuum evacuation space must be distributed and formed between the pressurized surface of the rubber plate and the adhesive member. We adopted a vacuum pressure bonding method using a rubber plate structure with lattice-like protrusions.
【0014】[0014]
接着部材に均一で充分な加圧を掛けるためには、接着部材全体に均一な加圧が 掛るような、分散した真空排気空間を作り、ゴム板外部の大気圧側とに圧力差を 発生させる構造とする必要がある。 In order to apply uniform and sufficient pressure to the bonded parts, it is necessary to apply uniform pressure to the entire bonded part. Create a dispersed vacuum evacuation space such that the It is necessary to create a structure that allows this to occur.
【0015】 即ち、図3の実施例によれば、加圧部と成る上下ゴム板1,4の内側面に格子 状の突起部を設けることにより、真空容器3内が真空排気されると、接着部材 10,11と上下ゴム板1,4間に格子状に分散した真空排気空間2が形成され 、その部と外気圧との圧力差による加圧力Pが接着部材全体に掛り効果的な真空 加圧式接着法が達成される。[0015] That is, according to the embodiment shown in FIG. By providing the shaped protrusion, when the inside of the vacuum container 3 is evacuated, the adhesive member A vacuum exhaust space 2 distributed in a grid pattern is formed between 10 and 11 and the upper and lower rubber plates 1 and 4. , a pressurizing force P due to the pressure difference between that part and the outside air pressure is applied to the entire adhesive member, creating an effective vacuum. A pressure bonding method is achieved.
【0016】[0016]
図1に実施例のゴム板内側面に格子状の突起部を有した真空加圧式接着装置の 構造図を示す。 Figure 1 shows an example of a vacuum pressure bonding device with grid-like protrusions on the inner surface of the rubber plate. A structural diagram is shown.
【0017】 図より、接着部材10,11は格子状の突起部を有した下ゴム板4と一体の真 空容器3にセットし上部より同様に突起部付きの上ゴム板1と一体の蓋部材5を シール用Oリング9を介して、図の様に真空容器3上にセットし外部雰囲気と機 密遮断させた物と成っている。[0017] As shown in the figure, the adhesive members 10 and 11 are integral with the lower rubber plate 4 having a lattice-like protrusion. Set it in the empty container 3 and insert the lid member 5 integrated with the upper rubber plate 1 with the protrusion from above in the same way. Set it on the vacuum container 3 as shown in the figure through the sealing O-ring 9, and connect it to the external atmosphere and the machine. It is made of a secretly sealed item.
【0018】 尚、接着部材10,11をセットした真空容器3は、真空排管8より真空ポン プ7により排気されその時の到達圧力は、圧力計6に表示される。[0018] The vacuum container 3 with the adhesive members 10 and 11 set therein is connected to the vacuum pump through the vacuum exhaust pipe 8. The pressure reached at that time is displayed on the pressure gauge 6.
【0019】 以上の様な、真空容器3部が真空排気されると、図より接着部材10,11の 周囲及び、上下面に接したゴム板1,4の格子状突起部には真空排気空間2が形 成され、外部雰囲気の大気圧とに圧力差が生じ、図で示すような分散した加圧力 Pが、形成された真空排気空間2の空間断面の大きさに応じて押し圧と成って掛 ることと成る。[0019] As shown in the figure, when the three parts of the vacuum container are evacuated, the adhesive members 10 and 11 are A vacuum exhaust space 2 is formed in the lattice-like protrusions of the rubber plates 1 and 4 that are in contact with the surrounding and upper and lower surfaces. This creates a pressure difference between the atmospheric pressure of the external atmosphere and the distributed pressurizing force as shown in the figure. P is applied as a pressing pressure depending on the size of the spatial cross section of the vacuum evacuation space 2 formed. That's what happens.
【0020】 即ち、接着部材10,11の上下面全体に格子状の突起部が接しており均一な 真空排気空間2が分散して存在することにより、均一な加圧力が掛かるものと成 っている。[0020] That is, the lattice-shaped protrusions are in contact with the entire upper and lower surfaces of the adhesive members 10 and 11, so that the adhesive members 10 and 11 are uniformly coated. By dispersing the vacuum evacuation space 2, a uniform pressurizing force can be applied. ing.
【0021】 従って、特に大面積の接着時に高精度な均一接着層が達成出来る。[0021] Therefore, a highly accurate and uniform adhesive layer can be achieved especially when bonding a large area.
【0022】[0022]
本考案の効果を下記に示す。 The effects of this invention are shown below.
【0023】 (1)均一な加圧力達成により大面積の接着が平坦度(20μm/400mmカク) と高精度 (2)高精度接着の達成により異種材同志での高精度なベース,XYテーブル等が 製作可能。[0023] (1) Achieving uniform pressure force allows for flat bonding of large areas (20 μm/400 mm) and high precision (2) High-precision bases, XY tables, etc. made of different materials can be achieved by achieving high-precision adhesion. Can be manufactured.
【0024】 (3)異種材組合せの複合接着部材の採用により軽量化が図られ動作制御のスピー ドアップ化、および経済性が期待出来る。[0024] (3) The use of composite adhesives made from a combination of different materials reduces weight and speeds up motion control. It can be expected to be more efficient and economical.
【図1】本考案のゴム板内側面に格子状の突起部を有し
た真空加圧式の接着装置を示す図である。FIG. 1 is a diagram showing a vacuum pressurizing type bonding device having a grid-like protrusion on the inner surface of a rubber plate according to the present invention.
【図2】加圧用ゴム板部に於いて、気密シール現象によ
り加圧されない部分が発生する例を表した図である。FIG. 2 is a diagram illustrating an example in which a portion of the pressurizing rubber plate portion is not pressurized due to an airtight seal phenomenon.
【図3】従来の厚板治具を介したゴム板構造の真空加圧
式接着装置を示す図である。FIG. 3 is a diagram showing a conventional vacuum pressure bonding device for rubber plate structures using a thick plate jig.
1…上ゴム板、2…真空排気空間、3…真空容器、4…
下ゴム板、5…蓋部材、6…圧力計、7…真空ポンプ、
8…排管、9…Oリング、10,11…接着部材、12
…円板、13…リング、14…ゴム板、15…厚板治
具、1B…上ゴム板、4B…下ゴム板、A…密着部、P
…加圧力(大気圧)、P0 …弱い加圧力、p…分割圧
力。1...Top rubber plate, 2...Evacuation space, 3...Vacuum container, 4...
Lower rubber plate, 5...lid member, 6...pressure gauge, 7...vacuum pump,
8... Exhaust pipe, 9... O ring, 10, 11... Adhesive member, 12
... Disc, 13... Ring, 14... Rubber plate, 15... Thick plate jig, 1B... Upper rubber plate, 4B... Lower rubber plate, A... Close contact part, P
...Applying force (atmospheric pressure), P 0 ... Weak pressing force, p... Divided pressure.
Claims (1)
て、ゴム板部の内側面に格子状の突起部を設ける事によ
り、その突起部が接着部材の上下面との接触部に格子状
の真空排気空間を形成させ、其の結果真空排気空間部と
外部大気圧との圧力差によって接着部材を均一に加圧出
来ることを特徴とするゴム板構造の真空加圧式接着装
置。Claim 1: In a vacuum pressure bonding device having a rubber plate structure, a lattice-shaped protrusion is provided on the inner surface of the rubber plate, so that the protrusion forms a lattice in the contact area with the upper and lower surfaces of the adhesive member. 1. A vacuum pressure bonding device having a rubber plate structure, which is characterized in that a vacuum evacuation space is formed in the form of a vacuum evacuation space, and as a result, a bonding member can be uniformly pressurized due to the pressure difference between the evacuation space portion and external atmospheric pressure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1676791U JPH04113926U (en) | 1991-03-20 | 1991-03-20 | Vacuum pressure bonding device with rubber plate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1676791U JPH04113926U (en) | 1991-03-20 | 1991-03-20 | Vacuum pressure bonding device with rubber plate structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04113926U true JPH04113926U (en) | 1992-10-06 |
Family
ID=31903649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1676791U Pending JPH04113926U (en) | 1991-03-20 | 1991-03-20 | Vacuum pressure bonding device with rubber plate structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04113926U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005166767A (en) * | 2003-12-01 | 2005-06-23 | Fuji Electric Holdings Co Ltd | Apparatus and method of vacuum laminating |
JP2013120865A (en) * | 2011-12-08 | 2013-06-17 | Bridgestone Corp | Solar cell module manufacturing method |
JP2017511614A (en) * | 2014-03-06 | 2017-04-20 | ソリブロ ハイ=テヒ ゲゼルシャフト ミット ベシュレンクテル ハフツングSolibro Hi−Tech GmbH | LAMINATING APPARATUS AND METHOD FOR MANUFACTURING LAMINATE |
-
1991
- 1991-03-20 JP JP1676791U patent/JPH04113926U/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005166767A (en) * | 2003-12-01 | 2005-06-23 | Fuji Electric Holdings Co Ltd | Apparatus and method of vacuum laminating |
JP4576829B2 (en) * | 2003-12-01 | 2010-11-10 | 富士電機システムズ株式会社 | Vacuum laminating apparatus and vacuum laminating method |
JP2013120865A (en) * | 2011-12-08 | 2013-06-17 | Bridgestone Corp | Solar cell module manufacturing method |
JP2017511614A (en) * | 2014-03-06 | 2017-04-20 | ソリブロ ハイ=テヒ ゲゼルシャフト ミット ベシュレンクテル ハフツングSolibro Hi−Tech GmbH | LAMINATING APPARATUS AND METHOD FOR MANUFACTURING LAMINATE |
US10814599B2 (en) | 2014-03-06 | 2020-10-27 | NICE Solar Energy GmbH | Laminating apparatus and method for producing a laminate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910009320B1 (en) | Polishing apparatus | |
JP2856216B2 (en) | Method of bonding adhesive tape to semiconductor wafer | |
JP3175232B2 (en) | Semiconductor wafer bonding method | |
US8465619B2 (en) | Semiconductor die collet | |
JP4221271B2 (en) | Tape applicator | |
JPS61145839A (en) | Semiconductor wafer bonding method and bonding jig | |
JP2534196B2 (en) | Wafer sticking method | |
JPH04113926U (en) | Vacuum pressure bonding device with rubber plate structure | |
KR20100118558A (en) | Sticking method and sticking device of sticking material | |
JP4699644B2 (en) | Bonding device and bonding method | |
JP2000349136A (en) | Pasting device of adhesive material and pasting thereof | |
JPH10154671A (en) | Semiconductor manufacturing device and manufacture of semiconductor device | |
JP2517025B2 (en) | Semiconductor wafer mounter | |
JP2003273049A (en) | Vacuum bonding device of wafer | |
CN221160033U (en) | Vacuum chuck | |
JP4626217B2 (en) | Vacuum pressure bonding method in room temperature bonding method | |
JPS6129704Y2 (en) | ||
JP4615202B2 (en) | Method and apparatus for attaching semiconductor thin film | |
CN215847716U (en) | Vacuum adsorption platform | |
JPS63198351A (en) | Adhesion of semiconductor wafer | |
JPH0938858A (en) | Vacuum chuck device for polishing thin piece member | |
JPS6135203A (en) | Method of bonding board material | |
JPH0435152Y2 (en) | ||
JPS6179640A (en) | Manufacture of honeycomb panel | |
JP2001189293A (en) | Method and device for adhering wafer |