JPH0411383Y2 - - Google Patents

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Publication number
JPH0411383Y2
JPH0411383Y2 JP1985085075U JP8507585U JPH0411383Y2 JP H0411383 Y2 JPH0411383 Y2 JP H0411383Y2 JP 1985085075 U JP1985085075 U JP 1985085075U JP 8507585 U JP8507585 U JP 8507585U JP H0411383 Y2 JPH0411383 Y2 JP H0411383Y2
Authority
JP
Japan
Prior art keywords
conductor pattern
main surface
zigzag
terminals
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985085075U
Other languages
Japanese (ja)
Other versions
JPS61202923U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985085075U priority Critical patent/JPH0411383Y2/ja
Publication of JPS61202923U publication Critical patent/JPS61202923U/ja
Application granted granted Critical
Publication of JPH0411383Y2 publication Critical patent/JPH0411383Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔技術分野〕 本考案は基板の対向する主表面に導体パターン
を形成してなる非常に短時間の遅延時間を得るた
めの分布定数型の遅延線の構造に関する。
[Detailed Description of the Invention] [Technical Field] The present invention relates to the structure of a distributed constant type delay line for obtaining a very short delay time, which is formed by forming conductor patterns on opposing main surfaces of a substrate.

〔従来技術とその問題点〕[Prior art and its problems]

基板の対向する主表面にジグザグ状の導体パタ
ーンとアース用の導体パターンを夫々形成してあ
り、数百ピコ秒乃至数ナノ秒の短い遅延時間を得
るためのこの種の遅延線はコンピユータやコンピ
ユータを用いた電子機器の遅延回路に多数の需要
がある。導体パターンは主にフオトエツチング技
術により形成されるが、短い遅延時間を正確に設
定するためにはその寸法精度、特にインダクタン
ス値とキヤパシタンス値を決めるジグザグ状の導
体パターンの精度を向上する必要がある。
A zigzag-shaped conductor pattern and a grounding conductor pattern are formed on the opposing main surfaces of the board, and this type of delay line is used in computers and computers to obtain a short delay time of several hundred picoseconds to several nanoseconds. There is a large demand for delay circuits for electronic devices using . The conductor pattern is mainly formed using photoetching technology, but in order to accurately set a short delay time, it is necessary to improve its dimensional accuracy, especially the accuracy of the zigzag conductor pattern that determines the inductance and capacitance values. .

導体密度が同じ主表面でほぼ同じ場合、たとえ
ば全面に広がるアース用の導体パターンを形成し
たり、ジグザグ状の導体パターンを全面に形成す
る場合には精度の向上が容易である。しかし、遅
延時間の要求から同じ主表面での導体密度を異な
らせる場合、例えばジグザグ状の導体パターンを
部分的に形成する場合にはその精度がでにくい。
すなわち、導体密度のほとんどない部分の導体を
除去するためにエツチング液に浸す時間が長くな
り、残すべき導体パターンにも損傷を生じ易いこ
とによる。
When the conductor density is almost the same on the same main surface, for example, when forming a grounding conductor pattern that spreads over the entire surface or when forming a zigzag-shaped conductor pattern over the entire surface, it is easy to improve accuracy. However, when varying the conductor density on the same main surface due to delay time requirements, for example when partially forming a zigzag conductor pattern, accuracy is difficult to achieve.
That is, the time required for immersion in the etching solution is longer in order to remove the conductor in areas where there is almost no conductor density, and the conductor pattern to be left is likely to be damaged.

〔目的〕〔the purpose〕

本考案の目的は、ジグザグ状の導体パターンの
周囲にアース用の導体パターンを形成することに
より、同じ主表面における部分的な導体密度の差
を小さくして、ジグザグ状の導体パターンの寸法
精度の向上を容易にすると共に外部ノイズの影響
を受け難くして、一挙両得の効果を得る遅延線の
提供にある。
The purpose of this invention is to reduce the difference in local conductor density on the same main surface by forming a grounding conductor pattern around the zigzag conductor pattern, thereby improving the dimensional accuracy of the zigzag conductor pattern. To provide a delay line that can be easily improved and is less susceptible to external noise, thereby obtaining a dual-purpose effect.

〔問題点を解決するための技術手段〕[Technical means to solve problems]

本考案の遅延線は、基板の第1の主表面にジグ
ザグ状の導体パターンを形成し、第2の主表面に
該ジグザグ状の導体パターンと対向させてキヤパ
シタンスを得るためのアース用の導体パターンを
形成してなる遅延線において、第1の主表面のジ
グザグ状の導体パターンの存在しない部分にも別
のアース用の導体パターンを形成してあることを
特徴とする。
The delay line of the present invention has a zigzag conductor pattern formed on the first main surface of the substrate, and a grounding conductor pattern opposite to the zigzag conductor pattern on the second main surface to obtain capacitance. The delay line is characterized in that another grounding conductor pattern is formed in a portion of the first main surface where the zigzag conductor pattern does not exist.

〔実施例〕〔Example〕

以下本考案の遅延線の実施例を示す第1図乃至
第4図を参照しながら説明する。第1図は第1の
主表面の平面図、第2図は第2の主表面の平面
図、第3図aと第3図bは外部端子の平面図と側
面図、第4図は遅延線の側面図である。
Embodiments of the delay line of the present invention will be described below with reference to FIGS. 1 to 4. Fig. 1 is a plan view of the first main surface, Fig. 2 is a plan view of the second main surface, Fig. 3a and Fig. 3b are a plan view and side view of the external terminal, and Fig. 4 is a delay It is a side view of a line.

酸化アルミニウム磁器からなる基板1の第1の
主表面2にはその長さ方向に延びるジグザグ状の
導体パターン3が形成してあり、導体パターン3
の存在しない部分、つまり導体パターン3の両端
には一面にアース用の導体パターン4を形成して
ある。5と6は導体パターン3の端子、7と8は
導体パターン4の端子であり、これらの端子は外
部端子9に接続し易いように基板1の片側の側辺
近傍に設けてある。
A zigzag-shaped conductor pattern 3 extending in the length direction is formed on the first main surface 2 of the substrate 1 made of aluminum oxide porcelain.
A conductive pattern 4 for grounding is formed on the entire surface of the portion where the conductive pattern 3 is not present, that is, both ends of the conductive pattern 3. 5 and 6 are terminals of the conductor pattern 3, and 7 and 8 are terminals of the conductor pattern 4. These terminals are provided near one side of the substrate 1 so as to be easily connected to the external terminal 9.

第1の主表面2の裏側の第2の主表面10には
導体パターン3と対向してキヤパシタンスを得る
ためのアース用の導体パターン11をほぼ全面に
形成してある。導体パターン11の端子12と端
子13は、夫々端子7、端子8に平面的に重なる
位置にある。又端子14と端子15は導体パター
ン11に接続しない空の端子であり、夫々端子
6,端子5と平面的に重なる位置にある。
On the second main surface 10 on the back side of the first main surface 2, a grounding conductor pattern 11 is formed on almost the entire surface, facing the conductor pattern 3 and for obtaining capacitance. Terminals 12 and 13 of conductor pattern 11 are located at positions overlapping terminals 7 and 8, respectively, in plan. Further, the terminals 14 and 15 are empty terminals that are not connected to the conductor pattern 11, and are located at positions overlapping the terminals 6 and 5, respectively, in a plan view.

外部端子9は先端16を長さ方向に半分づつに
割つてあり、第4図に示すように基板1を先端1
6で挟み込んだ状態で表裏の端子に半田づけして
固定される。アース用の導体パターン4と導体パ
ターン11は外部端子9を介して共通接続され
る。又いずれの導体パターンも基板1に被着した
銅の膜からフオトエツチング技術を用いて形成さ
れる。
The external terminal 9 has a tip 16 split in half in the length direction, and as shown in FIG.
It is fixed by soldering to the terminals on the front and back while sandwiching it in place. The grounding conductor pattern 4 and the conductor pattern 11 are commonly connected via an external terminal 9. Further, both conductor patterns are formed from a copper film deposited on the substrate 1 using photoetching technology.

このようにして、端子5と端子6を入力と出力
用の端子とする遅延線が構成される。なお外部端
子9の基板1への接続は導体パターンの形状によ
つて両側の側辺で行うこともできる。又実施例で
は導体パターン4と導体パターン11は一面に形
成されているが、渦電流損を減少するためにスリ
ツト状に導体を除去したり、均一な模様で除去し
てもよい。要するに導体密度が同じ主表面で大き
く変化しなければよい。さらに基板1は他のセラ
ミツクや合成樹脂を用いることもできる。
In this way, a delay line is constructed in which terminals 5 and 6 serve as input and output terminals. Note that the external terminals 9 can be connected to the substrate 1 on both sides depending on the shape of the conductor pattern. Further, in the embodiment, the conductor pattern 4 and the conductor pattern 11 are formed on one surface, but in order to reduce eddy current loss, the conductor may be removed in a slit shape or in a uniform pattern. In short, it is sufficient that the conductor density does not vary greatly on the same main surface. Furthermore, the substrate 1 can also be made of other ceramics or synthetic resins.

〔効果〕〔effect〕

以上述べたように本考案の遅延線は、ジグザグ
状の導体パターンの形成されている主表面にもア
ース用の導体パターンを形成してあり、導体密度
の部分的な差を小さくして製造時におけるジグザ
グ状の導体パターンの寸法精度を容易に向上でき
る構造である。従つて遅延時間が正確に設定でき
る。
As mentioned above, the delay line of the present invention has a grounding conductor pattern formed on the main surface on which the zigzag conductor pattern is formed, reducing local differences in conductor density during manufacturing. This is a structure that can easily improve the dimensional accuracy of the zigzag-shaped conductor pattern. Therefore, the delay time can be set accurately.

さらに両方の主表面にアース用の導体パターン
があることにより、ノイズの影響をうけにくいの
でパルスノイズの多い使用環境において特に有用
である。
Furthermore, since there are conductor patterns for grounding on both main surfaces, the device is less susceptible to noise, making it particularly useful in environments where there is a lot of pulse noise.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図と第2図は本考案の遅延線の実施例にお
ける基板を示す平面図、第3図aと第3図bは外
部端子の平面図と側面図、第4図は遅延線の側面
図である。 1……基板、2……第1の主表面、3……ジグ
ザグ状の導体パターン、4,11……アース用の
導体パターン、5,6,7,8,12,13,1
4,15……端子、9……外部端子、10……第
2の主表面、16……先端。
1 and 2 are plan views showing the substrate in the embodiment of the delay line of the present invention, FIGS. 3a and 3b are plan views and side views of external terminals, and FIG. 4 is a side view of the delay line. It is a diagram. DESCRIPTION OF SYMBOLS 1... Board, 2... First main surface, 3... Zigzag conductor pattern, 4, 11... Grounding conductor pattern, 5, 6, 7, 8, 12, 13, 1
4, 15... terminal, 9... external terminal, 10... second main surface, 16... tip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の第1の主表面にジグザグ状の導体パター
ンを形成し、第2の主表面に該ジグザグ状の導体
パターンと対向させてキヤパシタンスを得るため
のアース用の導体パターーンを形成してなる遅延
線において、第1の主表面のジグザグ状の導体パ
ターンの存在しない部分にも別のアース用の導体
パターンを形成してあることを特徴とする遅延
線。
A delay line formed by forming a zigzag conductor pattern on a first main surface of a substrate, and forming a grounding conductor pattern opposite to the zigzag conductor pattern on a second main surface to obtain capacitance. A delay line characterized in that another ground conductor pattern is formed also in a portion of the first main surface where the zigzag conductor pattern does not exist.
JP1985085075U 1985-06-05 1985-06-05 Expired JPH0411383Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985085075U JPH0411383Y2 (en) 1985-06-05 1985-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985085075U JPH0411383Y2 (en) 1985-06-05 1985-06-05

Publications (2)

Publication Number Publication Date
JPS61202923U JPS61202923U (en) 1986-12-20
JPH0411383Y2 true JPH0411383Y2 (en) 1992-03-23

Family

ID=30635138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985085075U Expired JPH0411383Y2 (en) 1985-06-05 1985-06-05

Country Status (1)

Country Link
JP (1) JPH0411383Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49769A (en) * 1972-04-19 1974-01-07

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55104801U (en) * 1979-01-18 1980-07-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49769A (en) * 1972-04-19 1974-01-07

Also Published As

Publication number Publication date
JPS61202923U (en) 1986-12-20

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