JPH04113436U - Vertical diffusion, CVD equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To improve the temperature controllability of wafers and to prevent breakage and damage to the reaction tube 2, etc. [Structure] By attaching a thermocouple 4 to the reaction tube 2, the temperature of the wafer 3 inserted into the reaction tube 2 can be accurately detected, and the temperature controllability of the wafer 3 can be improved and the reaction tube 2 etc. can be prevented from being damaged or scratched. You can prevent losses.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention uses a vertical heater that is installed vertically and a reaction tube inserted into the heater. Regarding mold diffusion and CVD equipment, especially the wafer that is the object to be heat-treated from the lower opening of the reaction tube. The present invention relates to a vertical diffusion and CVD device for inserting and removing ferrite.

0002

[Conventional technology]

FIG. 2 is a longitudinal sectional view showing the configuration of an example of a conventional device. This conventional device The heater 1 is placed on the stand 10, and the heat insulating material 12 and the soaking tube 13 are placed on the soaking tube holder 11. They are inserted into the heater 1. A dustproof cover is placed on the heat equalizing tube holder 11. Thermocouple protection tube 20 to which the bar 14 is attached and the thermocouple is housed in the hole of the dustproof cover 14 is attached by fitting.

0003 A reaction tube stopper plate 15 is attached to the heater pedestal 10, and a reaction tube 2 is installed inside the heater 1. The reaction tube 2 is fixed by the reaction tube stopper plate 15 and the reaction tube holding stand 16. ing. The cap 6 is placed on the cap pedestal 17, and the upper surface of the cap 6 and the boat 5 The positioning pin 9 is inserted into the hole 8 provided in the lower flange portion 7B of the cap. A boat 5 is placed on the boat 6, and a large number of wafers 3 are placed on the boat 5. It is. Also, a packing 18 that contacts the reaction tube 2 is placed around the cap 6. It is. 7A is the upper flange part, 19 is the cap holder 17, the cap 6 and the bolt. Raise and lower the boat 5 and insert and remove the cap 6 and boat 5 into the reaction tube 2. It is a vertical movement mechanism that performs

0004 In a conventional device with such a configuration, normally the heater 1 is heated and the thermocouple protection tube 20 is heated. The thermoelectromotive force is detected by the thermocouple in the inside, and it is sent to the controller via the compensation conductor 4A. convey a signal. The controller controls the temperature of heater 1 using PID control method etc. The temperature is controlled to match the set temperature in the reaction tube 2. The key is moved by the vertical movement mechanism 19. Raise the Yap pedestal 17, Cap 6, and Boat 5, and place the packing 18 on the reaction tube. Raise it until it touches 2. The wafer 3 is heated by the heater 1 and subjected to heat treatment. will be done.

[0005]

[Problem that the idea aims to solve]

In the conventional example described above, the distance between the thermocouple and the heater 1 is - Because the distance between the wafer 3 and the thermocouple is larger, the temperature control of the wafer 3 is poor. There was an issue. Also, fit the thermocouple protection tube 20 into the hole of the dustproof cover 14 and fix it. Due to the small space available and the long thermocouple of approximately 1 m, it is difficult to secure the protective tube 20. Not only is it difficult to do so, there is a risk of damaging the protection tube 20, but the heat from the heater 1 also prevents uniform heating. Since the tube holder 11 is deformed and the dustproof cover 14 is tilted, the thermocouple protection tube 2 0 falls to the reaction tube 2 side and comes into contact with the reaction tube 2, allowing the reaction tube 2 to be taken in and out of the heater 1. When doing so, there is a risk that the reaction tube 2 may be damaged or the protection tube 20 may be damaged due to such contact. there were.

[0006]

[Means to solve the problem]

In order to solve the above-mentioned problems, the device of the present invention creates a reaction inside the heater 1 as shown in Figure 1. A tube 2 is inserted, and a wafer 3, which is the object to be heat-treated, is inserted through the lower opening of the reaction tube 2. In a vertical diffusion/CVD device that performs input and extraction, a thermocouple 4 is installed in the reaction tube 2. It has a structure in which it is worn over the body.

[0007]

[Effect]

With this configuration, the distance between the thermocouple 4 and the wafer 3 can be narrower than before. Since the temperature of wafer 3 can be detected more accurately than before, the temperature of wafer 3 can be detected more accurately than before. This means that temperature controllability can be improved. In addition, a thermocouple 4 is attached to the reaction tube 2. Therefore, even if the reaction tube 2 is taken in and out of the heater 1, the reaction tube 2 etc. are not connected to the soaking tube 1. Since there is no contact with other parts such as 3, there is no risk of damage or damage.

[0008]

【Example】

FIG. 1 is a longitudinal sectional view showing the configuration of one embodiment of the device of the present invention. Conventional equipment shown in Figure 2 above Parts that perform the same function as the parts in the installation are given the same symbols, and their explanations will be omitted. . In this embodiment, a thermocouple thin tube 2A is provided inside the straight body portion of the reaction tube 2, and this thin tube Thermocouple 4 is housed in 2A. Heat is applied to the outside of the straight body part of reaction tube 2. A thin tube 2A for a couple may be provided and the thermocouple 4 may be housed therein. Also thermoelectric The pair 4 may be housed in a hole provided in the straight body portion of the reaction tube 2.

[0009] The atmosphere inside the thin tube 2A and the inside of the reaction tube 2 are not the same. So The reason for this is to prevent the reaction gas flowing into the reaction tube 2 from coming into contact with the thermocouple 4. and to prevent the atmosphere outside the reaction tube 2 from entering the inside via the thermocouple tube 2A. This is for the purpose of

0010 In this embodiment with the above configuration, normally the heater 1 is heated and the inside of the thermocouple tube 2A is heated. The thermoelectromotive force is detected by the thermocouple 4, and the signal is sent to the controller via the compensation conductor 4A. convey. The controller controls the temperature of heater 1 using PID control method etc. The temperature in the reaction tube 2 is controlled to match the set temperature. The cat is moved by the vertical movement mechanism 19. Raise the pedestal 17, cap 6, and boat 5, and place the packing 18 on the reaction tube 2. Raise until contact. The wafer 3 is heated by the heater 1 and subjected to heat treatment. That will happen.

[0011] According to this embodiment, inside the thermocouple thin tube 2A provided inside the straight body portion of the reaction tube 2. Since thermocouple 4 is housed in As a result, the temperature of wafer 3 can be detected more accurately than before, and the temperature of wafer 3 can be detected more accurately than before. It is possible to improve the temperature controllability and to remove the reaction tube 2 from the heater 1. Even if it is inserted, the reaction tube 2 etc. will not come into contact with other parts such as the soaking tube 13. There is no risk of damage or damage.

0012

[Effect of the idea]

As described above, according to the present invention, the thermocouple 4 is attached to the reaction tube 2. Since the distance between the thermocouple 4 and the wafer 3 can be made narrower than before, the distance between the thermocouple 4 and the wafer 3 can be narrowed. The temperature can be detected more accurately than before, and the temperature controllability of the wafer 3 can be improved. Not only can the reaction tube 2 be moved in and out of the heater 1, but the reaction will continue. Since the tube 2 etc. does not come into contact with other parts such as the heat soaking tube 13, there is no risk of breakage or damage. That's not it.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing the configuration of one embodiment of the device of the present invention.

FIG. 2 is a longitudinal sectional view showing the configuration of an example of a conventional device.

[Explanation of symbols]

1 Heater 2 reaction tube 2A thin tube for thermocouple 3 wafer 4 Thermocouple 4A compensation conductor 5 Boat 6 Cap

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[Procedural amendment]

[Submission date] June 26, 1991

[Procedural amendment 1]

[Name of document to be corrected] Drawing

[Correction target item name] Full map

[Correction method] Change

[Correction details]

[Figure 1]

[Figure 2]

Claims (3)

[Scope of utility model registration request] [Claim 1] A vertical type in which a reaction tube (2) is inserted into the heater (1), and a wafer (3) to be heat-treated is inserted and taken out from the lower opening of the reaction tube (2). Diffusion, CV
D apparatus is a vertical diffusion/CVD apparatus in which a thermocouple (4) is attached to the reaction tube (2). 2. The vertical diffusion, CVD method according to claim 1, wherein the thermocouple (4) is housed in a thin thermocouple tube (2A) provided inside or outside the straight body portion of the reaction tube (2). Device. 3. The vertical diffusion/CVD apparatus according to claim 1, wherein the thermocouple (4) is housed within the straight body portion of the reaction tube (2).