JPH04112599A - Automatic inserter for electronic part - Google Patents

Abstract

PURPOSE:To prevent the generation of an error on insertion, to reduce a recovery time and treatment and to improve operating efficiency by automatically detecting the abnormality of the state of taping to the mount tape of an electronic part run. CONSTITUTION:The quantity of a feature related to the state of taping is recognized and measured by a visual recognition section 15 from the picture of an electronic part photographed by a recognition camera 18 before the electronic part is inserted to a printed board. Whether or not the electronic part, information and the quantity of the feature of which related to the previously given state of taping of the electronic part are measured, can be inserted correctly is decided, the generation of an error on insertion resulting from the abnormality of the state of taping is prevented by no insertion of the electronic part on 'normal insertion impossible', the stoppage of a machine is obviated, and the intervention of an operator with the stoppage of the machine can be unnecessitated.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention is for automatically assembling various electronic components of lead wires into a component mounting board such as a printed circuit board using insertion guide pins to configure a predetermined electric circuit. This invention relates to an automatic insertion device for electronic components using an insertion guide pin.

Conventional technology Traditionally, predetermined electronic component insertion holes have been provided in printed circuit boards, etc., in order to automatically incorporate various electronic components with lead wires into component mounting boards such as printed circuit boards to configure predetermined electric circuits. The process involves inserting the lead wires of the specified electronic components using insertion guide pins, cutting off the excess lead wires of the electronic components, and clinching the lead wires to prevent the electronic components from being removed from the printed circuit board. Automatic insertion devices for electronic components are used that perform operations automatically.

FIGS. 8 to 15 are diagrams showing the insertion operation of a general electronic component automatic insertion device.

8 to 15, 1 is an insertion guide pin, 2 is an insertion pusher, 3 is a printed circuit board, and 4 is a printed circuit board 3.
A table section equipped with a table that moves and positions within a plane;
5 is an electronic component series, 6 is a mount tape, 7 is a transfer chuck,
8 is an insertion chuck, 9 is a guide chuck, 10 is a separated electronic component, and 11 is a tip of a lead wire of the electronic component 10.

In the electronic component automatic insertion device configured as described above, a series of operations for automatically inserting the lead wire of the electronic component 10 into the component insertion hole 3a provided in the printed circuit board 3 is as follows.

First, as shown in FIG. 9, the mount tape 6 is advanced by one electronic component, and the transfer chuck 7 is rotated and closed to hold the lead wire portion of the electronic component 10 while holding the mount tape 6 and the electronic component 10. Cut the lead wire. At this time,
The cut mount tape 6 is discarded.

Next, as shown in FIG. 10, the transfer chuck 7 is returned and the insertion chuck 8 is rotated to close the electronic component 1.
0 is held by an insertion chuck 8.

After that, as shown in FIG. 11, open the transfer chuck 7,
By rotating the insertion chuck 8, the electronic component 10
is positioned directly above the component insertion hole 3a of the printed circuit board 3, and is printed based on predetermined NC data so that the insertion guide pin 1 can pass through the predetermined component insertion hole 3a on the printed circuit board 3. The board 3 is positioned, and the insertion guide pin 1 is passed through a predetermined component insertion hole 3a on the printed circuit board 3 from the side opposite to the component mounting surface.

Next, as shown in FIG. 12, the guide chuck 9 is closed, the insertion guide pin 1 is raised, the insertion pusher 2 is lowered, the insertion chuck 8 is opened, and each lead wire of the electronic component 10 is removed by the guide chuck 9. and the insertion guide pin 1 are made to face each other, and the electronic component 10 is held between the insertion pusher 2 and the insertion guide pin 1.

Next, as shown in FIGS. 13 and 14, while holding the tip 11 of the lead wire of the cut electronic component 10 in the recess 12 provided at the tip of the insertion guide pin 1, return the insertion guide pin 1 to its original position. By returning the electronic component 10 to the position , the lead wire of the electronic component 10 is inserted into the component insertion hole 3a of the printed circuit board 3.

Then, as shown in FIG. 15, the excess parts of the lead wires of the electronic component 10 are cut off, and it is confirmed that the lead wires are inserted into each hole securely, and the mounted electronic component 10 is The lead wires are clinched to prevent them from falling off the printed circuit board 3, and the series of insertion operations is completed.

During this operation, as shown in FIG.
By fitting the tip 11 of the lead wire into the
The lead wire of the electronic component 10 is prevented from falling off from the insertion guide pin], and the lead wire of the electronic component 10 can be accurately guided to the component insertion hole 3a provided in the printed circuit board 3.

Problems to be Solved by the Invention However, in such an automatic insertion device for electronic components, vibrations and shocks occur when transporting or handling the electronic components, and when installing the electronic component series 5 on the automatic insertion device. Electronic parts inserted due to carelessness in handling etc. 5
Due to causes such as external force being applied to the
As shown in FIG. 17(b), the taping position of the electronic component 10 on the backing tape 6 may be out of the specified position range, or as shown in FIGS. If the taping condition of the pusher 2 is not correct, insert the electronic component 10 using the guide chuck 9
In the process of holding the lead wire of the electronic component 10 between the insertion guide pin 10 and the insertion guide pin 1,
Since the electronic component 10 cannot be properly aligned with the recess 12 at the tip of the electronic component 10 and cannot be held correctly between the insertion pusher 2 and the insertion guide pin 1, the lead wire of the electronic component 10 cannot be properly aligned with the recess 12 at the tip of the It became impossible to correctly guide the component into the component insertion hole 3a of the printed circuit board 3, resulting in component insertion errors as shown in FIGS. 16(b) and 17(b).

The electronic component 10 that caused this insertion error has already been separated from the backing tape 6 at the time of the insertion error, and the forming shape of the lead wire of the electronic component 10 is usually caused by the impact or external force when the insertion error occurs. Because the electronic component 10 is in a state where it cannot be automatically inserted, the electronic component 10 that caused this insertion error cannot be used again in the automatic insertion device.

When these insertion errors occur, it is necessary to perform recovery from the error, but this work usually involves checking the various insertion error states and then responding to the various error states and taking recovery measures. If necessary, the operator will have to check the error status and perform upstream recovery operations.
It will take a long time to resume autonomous driving.

Therefore, in order to eliminate the stoppage of the automatic electronic component insertion device due to insertion errors and improve the operating rate, it is necessary to prevent such abnormalities in the taping state of electronic components to the backing tape, which may lead to component insertion errors. It must be detected and eliminated at an earlier stage.

However, until now there has been no method to automatically measure and check the state of the taping of electronic component series (and it takes a lot of man-hours to visually inspect the state of the taping of all automatically inserted electronic component series). There is no point in having an automatic insertion device (because of the increase in the number of cases), and it is also not practical due to the nature of the work.

For this reason, we take great care when handling taped electronic parts, but it is not possible to completely eliminate disturbances in the taping condition, and insertion errors due to abnormal taping conditions can occur. Due to this occurrence, the automatic electronic component insertion equipment stopped, reducing the operating rate, and it was necessary to always have workers on standby to carry out the recovery process.

In view of these problems, the present invention automates the detection of abnormalities in the taping state of electronic parts to the mount tape in an automatic electronic component insertion device, and prevents the occurrence of insertion errors caused by abnormal taping conditions. The present invention provides a system that suppresses unnecessary work time due to recovery operations after an insertion error occurs, eliminates or reduces the need to secure workers for recovery processing, and improves operating efficiency.

Means for Solving the Problem In order to solve this problem, the automatic electronic component insertion device of the present invention includes a recognition camera for photographing taped electronic components, and a recognition camera connected to the recognition camera to capture images from the recognition camera. It is equipped with a visual recognition unit that processes the image information of the taped electronic component included in the image, a table unit two-component supply mechanism unit, an insertion guide pin, and a control unit that controls the operation of each of these parts. The visual recognition unit measures the characteristics of the taping condition, such as the position and inclination, the number of lead wires, the position and inclination of the lead wires, and the pitch dimension of the lead wires, and detects abnormalities in the taping state of electronic components to the backing tape. It is structured so that it can be judged.

action The operation in this configuration is as follows.

In the automatic electronic component insertion device of the present invention, before inserting an electronic component into a printed circuit board, first, a recognition camera placed near the component supply mechanism photographs the electronic component in the component supply mechanism. A visual recognition unit recognizes and measures features related to the taping state, such as the position and inclination of the electronic component, the number of lead wires, the position and inclination of the lead wires, and the pitch dimension of the lead wires, from the image of the electronic component.

Next, information about the taping condition, such as the position and inclination of the electronic component given in advance, the number of lead wires, the position and inclination of the lead wire, and the pitch dimension of the lead wire, and the electronic information recognized and measured by the visual recognition unit are collected. By comparing the features related to the taping state such as the position and inclination of the component, the number of lead wires, the position and inclination of the lead wires, and the pitch dimension of the lead wires using the visual recognition unit, the measured electronic component can be attached to the printed circuit board. It judges whether or not it is possible to insert it correctly, and transmits the judgment result to the control unit.

If the judgment result is ``normal insertion is possible,'' the electronic component is inserted, and if the judgment result is ``normal insertion is not possible,'' the electronic component is discarded without being inserted. Recognizes and confirms new electronic parts before inserting them, issues a warning to the operator from the control unit, and automatically stops the machine to prevent insertion errors caused by abnormal taping conditions. This can be prevented by the device's own judgment.

In addition, information on features such as the position and tilt of the electronic component, the number of lead wires, the position and tilt of the lead wire, and the pitch dimension of the lead wire, which are recognized and measured by the visual recognition unit from the image of the electronic component taken. Based on this, the control unit selects and uses the insertion guide bin that is optimal for the measured characteristics such as number 1 position and pitch dimension of the lead wire within a range that satisfies the positional relationship with the component insertion hole provided on the printed circuit board. It is also possible to insert electronic components.

Alternatively, the external shape and dimensions of the electronic component (lateral area and height of the electronic component body portion) are recognized and measured by the visual recognition unit from the photographed image of the electronic component.

Based on information on feature quantities such as width), if the recognized and measured external shape is large, the operating speed of the component supply mechanism and the speed of the insertion operation are set to low speed, so that the recognized and measured external shape is small. In this case, it is also possible to insert the electronic component by setting the operation speed of the component supply mechanism section and the speed of the insertion operation to high-speed operation.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

1 and 2 show the configuration of an automatic insertion device for electronic components according to an embodiment of the present invention. Reference numeral 13 denotes a main body of the device, and inside this main body 13 there are a control unit 14, a visual recognition unit
5 and the power section are housed. A table section 4 that holds a printed circuit board 3 on which electronic components 10 are mounted and is movable in a plane is provided on the upper surface of this device main body 13, and a mount tape supplied from a parts cassette 16 is mounted on the upper surface of this table section 4. A component supply mechanism section 17 including a transfer chuck 7 that cuts and supplies individual electronic components 10 from a series of electronic components 5 taped together by a device 6, and a recognition camera 18 located close to the component supply mechanism section 17. A light source 19 is provided at a position facing the electronic component 10 with the electronic component 10 in between. Further, an insertion chuck 8, an insertion pusher 2, and a guide chuck 9 are arranged adjacent to the component supply mechanism section 17. Further, on the lower surface of the printed circuit board 3 of the table portion 4, an insertion guide bin I having a recessed portion 12 at its tip is arranged so as to be movable up and down. A monitor display 20 is connected to the visual recognition section 15, and the device main body 13
is placed at the top of the. 3(a) to 3(d) show examples of various monitor images of the electronic component 10 taken by the recognition camera 18.

In the electronic component automatic insertion device configured as described above, the operation for detecting an abnormality in the taping state of the electronic component 10 to the mount tape 6 is as follows. Note that the electronic component 10 is taken out from the component supply mechanism section 17, and various chucks and insertion guide bins 1. The part inserted into the component insertion hole 3a of the printed circuit board 3 using the insertion pusher 2 will be explained using FIGS. 5(a) to 5(g).

The electronic component 10 used for automatic insertion is supplied taped to a backing tape 6, as shown in FIG. 5(a). When inserting this electronic component 10 into the printed circuit board 3, first, the mount tape 6 is fed from the component supply mechanism section 17 for one electronic component, and the recognition camera 18
The taped state of the electronic component 10 was photographed in the component supply mechanism section 17, and the position of the electronic component 10 and the number of lead wires were recorded.

The visual recognition unit 15 recognizes and measures characteristic amounts related to the taping state, such as the position of the lead wire and the pitch dimension of the lead wire.

If the electronic component 10 is properly taped to the backing tape 6, the photographed image of the electronic component 1o will be as shown in FIG.
), the specifications regarding the position, number of lead wires, position of the lead wires, pitch dimension of the lead wires, etc. are satisfied.

Next, information regarding the taping state such as the position, the number of lead wires, the position of the lead wires, and the pitch dimension of the lead wires for the electronic component 10 given in advance, and the electronic component recognized and measured by the visual recognition unit 15 are provided. 10, the number of lead wires, the position of the lead wires, the pitch dimension of the lead wires, and other features related to the taping state by the visual recognition unit 15, thereby quantitatively understanding the taping state of the electronic component 10. and determine whether it is possible to correctly insert the electronic component 10 into the printed circuit board 3 using the transfer chuck 7, insertion chuck 8, guide chuck 9, insertion pusher 2, and insertion guide bin 1. becomes possible.

To explain whether or not this normal insertion is possible, using examples of photographed images of various taping states of the electronic component 10, in the case of FIG. 3(b), the taping position of the electronic component 10 is the normal taping position 10a. In the case of FIG. 3(C), the position of one of the taped lead wires of the electronic component 10 is deviated from the normal taping position 1iF10a of the lead wire. (
In the case of d), the electronic component 10 is in the normal taped state 10.
This is the case when it is tilted against.

When the electronic component 10 in the taped state shown in FIG. Using the guide chuck 9, insert the tip 11 of the lead wire of the electronic component 10 separated from the backing tape 6 into the recess 12 at the tip of the guide bin 1.
Since the electronic component 10 cannot be accurately guided and the electronic component 10 cannot be correctly held between the insertion pusher 2 and the insertion guide bin 1, it becomes impossible to correctly insert the electronic component 10 into the printed circuit board 3. For this reason, the visual recognition unit 15
is recognized by the visual recognition unit 15 using information regarding the taping state given in advance such as the position of the electronic component 10, the number of lead wires, the position of the lead wires, and the pitch dimension of the lead wires.

Measured position of electronic component 10 and number of lead wires.

The position of the lead wire, the pitch dimension of the lead wire, and other characteristic quantities related to the taping state are compared, and if this difference exceeds a specified limit, it is determined that normal insertion is impossible.

The judgment result obtained in this way is transmitted from the visual recognition unit 15 to the control unit 14, and if the judgment result is "normal insertion possible", the insertion operation of the electronic component 10 is executed, and the judgment result is If the electronic component 10 cannot be inserted normally, discard it without inserting it, and replace it with a new electronic component 10 of the same type.
The control unit 14 issues an alarm to the operator, automatically stops the machine, and the machine itself determines whether an insertion error has occurred due to an abnormality in the taping condition. This can be prevented in advance.

In addition, Fig. 4(a), (b) to Fig. 6(a), (
As shown in b), information on features such as the number of lead wires of the electronic component, the position of the lead wires, and the pitch dimension of the lead wires is recognized and measured by the visual recognition unit 15 from the photographed image of the electronic component 10. Based on this, the control unit selects the insertion guide pin that is most suitable for the measured characteristics such as number 1 and pitch dimension of the lead wire within a range that satisfies the positional relationship with the component insertion hole 3a provided in the printed circuit board 3. It is also possible to insert electronic components using selection.

For example, as shown in the images shown in FIGS. 4(a) and 4(b), when the lead wire pitch P of the electronic component 10 is narrow, insertion is performed using insertion guide pins 1a and 1b among the insertion guide pins 1a to IC. If the lead wire pitch P of the electronic component 10 is wide as shown in the images shown in FIGS. 5(a) and 5(b), the insertion is performed using the insertion guide pin 1a and the IC. Furthermore, when the electronic component 10 has three lead wires as shown in the images shown in FIGS. 6(a) and 6(b),
Insertion is performed using all of the insertion guide pins 1a to IC.

In addition, as shown in FIGS. 7(a) to (C), the external shape and dimensions of the electronic component (of the electronic component element body portion) are recognized and measured by the visual recognition unit 15 from the photographed image of the electronic component 10. Based on information on feature quantities such as area, height, width, etc., if the recognized and measured external shape is large, the operating speed of the component supply mechanism section 17 and the speed of the insertion operation are set to low speed, and the recognition and measurement are performed. If the external shape is small, it is also possible to automatically insert the electronic component 10 by setting the operation speed and the insertion operation speed of the component supply mechanism section 17 to high-speed operation.

For example, when the area of the photographed image of the electronic component 10 is large as in the case of FIG. 7(a), the mass of the electronic component 10 is also large. 7 and the electronic component 10 with the insertion chuck 8
The electronic component 10 moves within each chuck due to acceleration/deceleration and centrifugal force when moving the electronic component 10, making it impossible to hold it correctly between the insertion pusher 2 and the insertion guide pin 1.
It is necessary to perform each feeding and insertion operation at low speed, while the electronic component 10 photographed as in the case of FIG. 7(C)
If the area of the image of Since the movement of the electronic component 10 within each chuck due to this can be ignored, it is possible to increase the number of insertion points per unit time by increasing the speed of each feeding and insertion operation.

Effects of the Invention As described above, the present invention uses a recognition camera to recognize and measure the taping state of inserted electronic components to the backing tape, so that the automatic insertion device itself can detect whether or not there is an abnormality in the taping state before insertion. It is now possible to detect the electronic component in an abnormal taping state, which would result in an insertion error if the insertion operation is continued, and discard the electronic component, ensuring that the electronic component is taped in the correct state. By inserting new electronic components of the same type,
It is possible to prevent the machine from stopping due to insertion errors, eliminate the need for operator intervention, and, if necessary, insert the electronic component based on the image of the electronic component obtained from the visual recognition device. Position and tilt of electronic components, number of lead wires.

By measuring characteristic quantities such as the position and inclination of the lead wires and the pitch dimensions of the lead wires, it is possible to eliminate the need to specify this information in advance using NC data etc. of the electronic component to be inserted. In addition, the external shape and dimensions of the electronic component (lateral area, height 2 width of the electronic component body part)
By selecting the operating speed and insertion speed of the feeding mechanism section that are optimal for the recognized and measured external shape based on information on feature quantities such as, small to large electronic components can be stably inserted This is of great industrial value.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an automatic electronic component insertion device according to an embodiment of the present invention, FIG. 2 is a block diagram of the main parts, and FIG.
) to (d) are explanatory diagrams showing examples of images obtained by photographing an electronic component according to an embodiment of the present invention with a recognition camera;
Figures (a) and (b) to Figure 6 (a) and (b) are images obtained by photographing an electronic component with a recognition camera according to an embodiment of the present invention, and an insertion diagram used when inserting an electronic component. FIGS. 7(a) to 7(C) are explanatory diagrams showing the relationship with the guide pin, and show the relationship between the image obtained by photographing an electronic component with a recognition camera and the speed at which the electronic component is inserted according to an embodiment of the present invention. 8 to 15 are explanatory diagrams showing the component insertion operation in the automatic electronic component insertion device, and FIG. 16(a)
,(b),Figure 17(a). (b) is an explanatory diagram showing the relationship between the irregularity of the taping state of electronic components to the mount tape and the occurrence of insertion errors in a conventional automatic electronic component insertion device. 1...Insertion guide pin, 2...Insertion pusher, 3...Printed circuit board, 4-...
Table section, 5...Electronic components, 6...
・Mount tape, 7...Transfer chuck, 8...
...Insertion chuck, 9...Guide chuck, 10...Electronic component, 11...Tip of lead wire, 12...Recess, 13・・・・・・
Device main body, 14... Control section, 15...
Visual recognition section, 16...Parts cassette, 17.
. . . Component supply mechanism section, 18 . . . Recognition camera, 19 . . . Light source, 20 . . . Monitor display. Name of agent: Patent attorney Haruaki Ogata and two others 恢I4.・Control @919 15, Visual 1tum Shu 20 Advance dispatch/Monitor tense play chart chart chart chart chart chart chart chart

Claims (3)

[Claims] (1) A table part that holds a board having a component insertion hole into which a lead wire of an electronic component is inserted and is movable in plane; a component supply mechanism part of the electronic component taped to a mount tape; and a part of the board. a head portion incorporating an insertion pusher for inserting the lead wire of the electronic component into the insertion hole;
The tip has a recess into which the tip of the lead wire fits, and when inserting the electronic component into the board, it passes through the component insertion hole from the opposite side of the component mounting surface of the board and connects with the insertion pusher. a plurality of insertion guide pins that guide the lead wire to the component insertion hole while holding the electronic component between them; a recognition camera disposed near the component supply mechanism section to photograph the electronic component; a light source for illuminating the component; a visual recognition section that is electrically connected to the recognition camera and processes image information included in the image from the recognition camera; the table section; the supply mechanism section;
A control unit that controls operations of the head unit, the insertion guide pin, etc. is provided, the electronic component is photographed in the supply mechanism unit by the recognition camera, and the position and position of the electronic component are determined from the photographed image of the electronic component. The visual recognition unit recognizes and measures the characteristic quantities related to the taping state, such as the inclination, the number of lead wires, the position and inclination of the lead wires, and the pitch dimension of the lead wires, and determines the predetermined position and inclination of the electronic component. , information on the taping state such as the number of lead wires, the position and inclination of the lead wires, the pitch dimension of the lead wires, the position and inclination of the electronic component, the number of lead wires, the position and inclination of the lead wires, and the pitch dimension of the lead wires. The visual recognition unit determines whether or not it is possible to insert the electronic component into the board by comparing the characteristic amounts related to the taping state, such as, and transmits the determination result to the control unit; If the judgment result indicates that the electronic component can be inserted normally, the insertion operation of the electronic component is performed, and if the judgment result indicates that the electronic component can be inserted normally, the electronic component is discarded without being inserted and a new electronic component of the same type is inserted. An automatic electronic component insertion device configured to insert a component, issue a warning to a worker from the control section, and stop the machine. (2) The control unit determines the position and inclination of the electronic component, the number of lead wires, the position and inclination of the lead wire, the pitch dimension of the lead wire, etc., which are recognized and measured by the visual recognition unit from the photographed image of the electronic component. The electronic component is inserted using the insertion guide pin that is most suitable for the measured number of lead wires, the position of the lead wires, the pitch dimension of the lead wires, etc., based on the information on the feature values. The automatic insertion device for electronic components according to claim 1. (3) The control unit controls the operation speed and insertion of the electronic component supply mechanism based on information on features such as the external shape and dimensions of the electronic component recognized and measured by the visual recognition unit from the photographed image of the electronic component. Adjust the speed of the operation, and if the recognized and measured external shape is large, the operating speed of the supply mechanism section and the speed of the insertion operation are set to low speed, and the recognized and measured external shape is small. 2. The automatic electronic component insertion apparatus according to claim 1, wherein in some cases, the electronic component is inserted by setting the operation speed and the insertion operation speed of the supply mechanism part to high speed.