JPH04111400A - Evaluation method for component arrangement on printed-circuit board - Google Patents
Evaluation method for component arrangement on printed-circuit boardInfo
- Publication number
- JPH04111400A JPH04111400A JP2228118A JP22811890A JPH04111400A JP H04111400 A JPH04111400 A JP H04111400A JP 2228118 A JP2228118 A JP 2228118A JP 22811890 A JP22811890 A JP 22811890A JP H04111400 A JPH04111400 A JP H04111400A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- length
- component
- total length
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011156 evaluation Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板上に部品を配置後、接続関係をL
字近似による配線で仮定し、その混雑度により実際の配
線前に部品配置を評価する方法に係わり、実際の配線結
果に酷似した評価結果を得るための混雑度の計算方法に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for connecting components to L after arranging them on a printed circuit board.
The present invention relates to a method of evaluating component placement before actual wiring based on the degree of congestion based on the assumption that wiring is based on a linear approximation, and a method of calculating the degree of congestion to obtain an evaluation result that closely resembles the actual wiring result.
従来の方法は、特開昭63−174177号公報に記載
のように、基板全体を分割し、各分割領域毎に配線可能
な有効領域と仮想配線の経路を推定したときの水平・垂
直方向成分の面積分布を計算し、両者の面積分布の差か
ら、その分割領域の占有度を求め、この分布を表示する
ことにより配線効率の向上を図る、言い換えれば部品配
置を評価するとなっていた。The conventional method, as described in Japanese Unexamined Patent Publication No. 63-174177, divides the entire board and estimates the effective wiring area and virtual wiring route for each divided area, and calculates the horizontal and vertical components. The area distribution of the two is calculated, the degree of occupancy of the divided area is determined from the difference between the two area distributions, and this distribution is displayed to improve wiring efficiency, in other words, to evaluate component placement.
上記従来技術は、実際の配線アルゴリズムでは部品直下
の空チャネルが、搭載される部品の形状によっては使用
されない点、より少ない層で配線するという特徴につい
て配慮されておらず、仮配線の経路判定の際に、総べて
同等の空きチャネルとして扱うため、実際の配線経路と
異なる経路を選択する可能性があり、精度良く評価でき
ないという問題がある。The above-mentioned conventional technology does not take into consideration the fact that in the actual wiring algorithm, empty channels directly under the component may not be used depending on the shape of the mounted component, and the feature of wiring with fewer layers is not considered, In this case, since all channels are treated as the same free channels, there is a possibility that a route different from the actual wiring route is selected, and there is a problem that accurate evaluation is not possible.
本発明は、実際の配線アルゴリズムの特徴を考慮した仮
配線の経路判定を行い、より精度の良い評価値を提供す
ることを目的とする。An object of the present invention is to determine the route of temporary wiring in consideration of the characteristics of the actual wiring algorithm, and to provide a more accurate evaluation value.
さらに上記従来技術は、実際の配線と仮配線の経路が不
一致の場合のその誤差の影響を考慮しておらず、同様に
精度良く評価できないという問題がある。Furthermore, the above-mentioned conventional technology does not take into consideration the influence of errors when the routes of the actual wiring and the temporary wiring do not match, and there is also a problem that accurate evaluation is not possible.
本発明は、実際の配線と仮配線の経路選択による誤差を
小さくする方法についても言及しており、より精度の良
い評価値を提供することを目的とする。The present invention also refers to a method of reducing errors caused by route selection between actual wiring and temporary wiring, and aims to provide more accurate evaluation values.
上記目的で実際の配線アルゴリズムの特徴を考慮するた
めに、仮配線の経路候補領域の空きチャネル長計数時、
部品直下の空きチャネル長とその他の空きチャネル長を
各々計数し、部品直下の空きチャネル合計長に対して部
品形状固有の係数(配線可能性と呼ぶ)を乗じる処理を
追加し、さらに各層の空きチャネル合計長にその層の配
線頻度に比例した係数(配線頻度係数と呼ぶ)を乗じる
処理を追加したものである。In order to take into account the characteristics of the actual wiring algorithm for the above purpose, when counting the free channel length of the temporary wiring route candidate area,
A process is added to count the length of the free channel directly under the component and the length of other free channels, and to multiply the total length of the free channels directly under the component by a coefficient specific to the component shape (referred to as routing possibility). This is an additional process in which the total channel length is multiplied by a coefficient (referred to as a wiring frequency coefficient) proportional to the wiring frequency of that layer.
さらに、実際の配線と仮配線の経路選択による誤差を小
さくするために、上記方法で求めた空きチャネル合計長
から、各々の経路候補領域の選択確率を算呂し、仮配線
長期待値を計数したものである。Furthermore, in order to reduce the error caused by route selection between actual wiring and temporary wiring, the selection probability of each route candidate area is calculated from the total length of free channels obtained using the above method, and the expected value of the temporary wiring length is calculated. This is what I did.
ユーザ指定あるいはシステム固定により分割された1つ
の分割領域で、ある層(λ)の空きチャネル合計長(U
λ)の計数は、部品直下の空きチャネル合計長(ue上
)と部品形状固定の部品直下配線可能性(Rpi)とそ
の他の空きチャネル合計長(ueよ)から式1で求める
。In one divided area divided by user specification or system fixed, the total length of free channels (U
The count of λ) is calculated using Equation 1 from the total length of empty channels directly under the component (on ue), the possibility of wiring directly under the component with a fixed component shape (Rpi), and the total length of other empty channels (on ue).
u i =u P i X RP i + u e L
(式1)さらに1つの分割領域の(全層合計)空
きチャネル合計長(U)は、層毎の配線頻度係数(Rs
i)と上記u上から式2で求める。u i =u P i X RP i + u e L
(Formula 1) Furthermore, the total length (U) of free channels (total of all layers) in one divided area is the wiring frequency coefficient (Rs
i) and the above u using equation 2.
μ=ΣμλXRsλ (式2)式1のRp
iは部品情報として、式2のRsiは基板情報としてラ
イブラリから夫々得る方法とシステム固有の計算式、初
期値から得る方法と実行時にユーザが任意に指定する方
法がある。式1゜2から1つの分割領域空きチャネル合
計長を求めることにより、前述の配線アルゴリズムの特
徴を配慮した評価が可能となる。μ=ΣμλXRsλ (Equation 2) Rp of Equation 1
There are a method in which i is obtained as component information and Rsi in equation 2 is board information from a library, a method in which it is obtained from a system-specific calculation formula, an initial value, and a method in which the user arbitrarily specifies it at the time of execution. By determining the total length of free channels in one divided area from Equation 1.2, it becomes possible to perform an evaluation that takes into consideration the characteristics of the wiring algorithm described above.
また、ある経路上(例えば経路1)の1つの分割領域に
おける仮配線長期待値(E (L) )の計数は、その
分割領域の仮配線長(L)と経路領域全部の空きチャネ
ル合計長(経路1 : LIAcby経路2 : Ll
:、、c)と経路領域で既に計数済の仮配線期待値(経
路1:E(L)′A、、L、経路2 : E (L)
htLから式3で求める。In addition, the expected value of the tentative wire length (E (L) ) in one divided area on a certain route (for example, route 1) is calculated by the tentative wire length (L) of that divided area and the total length of free channels in all route areas. (Route 1: LIAcby Route 2: Ll
:,,c) and the tentative wiring expected value already counted in the route area (route 1: E(L)′A,,L, route 2: E(L)
It is determined from htL using equation 3.
E(L)”LX ((LLAcc−E(L)ALL)/
(LLAt、c−E(L)Atc” LiAcc−E
(L)ac、、) ) (式3)ここで、右
辺()内は、経路1の選択確率である。この仮配線期待
値を経路1,2の全領域で計数することにより、実際の
配線との経路の違いによる影響を低減でき、精度の良い
評価値を提供することが可能となる。E(L)"LX ((LLAcc-E(L)ALL)/
(LLAt, c-E(L)Atc” LiAcc-E
(L) ac, , ) ) (Formula 3) Here, the value in parentheses on the right side is the selection probability of route 1. By counting this tentative wiring expected value over the entire area of routes 1 and 2, it is possible to reduce the influence of the difference between the routes and the actual wiring, and it is possible to provide a highly accurate evaluation value.
以下1本発明の一実施例として、処理の流れを第1図に
より説明する。図中1は部品実装情報、基板情報から配
線不可能なチャネルを読み取り、空きチャネル情報を保
持するテーブルに登録する。The flow of processing will be explained below as an embodiment of the present invention with reference to FIG. 1 in the figure reads channels that cannot be wired from component mounting information and board information, and registers them in a table that holds vacant channel information.
また、部品直下のチャネルであることを示すフラグを立
てる。このテーブル構造とチャネルの関係を第2図に示
す。各層の1単位チャネル長毎に1セルのエリアがあり
、空き/配線不可と部品直下/その他を区別するための
二種類のフラグで1セルを構成する。第1図中2は、分
割領域毎に第2図に示すテーブルから部品直下とそれ以
外空きチャネル合計長を計数し、部品直下の配線可能性
と層毎の配線頻度係数を夫々部品実装情報、基板情報か
ら入力し、前述の式1,2にて1分割領域の空きチャネ
ル合計長を計算する。第1図中3は、論理情報から結線
すべきピン−ピンを計算し、L字形の仮配線で近似した
時の経路領域位置を計算する。第1図中4は、3で求め
た経路領域の空きチャネル合計長を経路毎に合計する(
経路は2つ)。Additionally, a flag is set to indicate that the channel is directly under the component. The relationship between this table structure and channels is shown in FIG. There is one cell area for each unit channel length of each layer, and one cell is composed of two types of flags for distinguishing between empty/no wiring and directly under a component/other. 2 in Fig. 1 is calculated from the table shown in Fig. 2 for each divided area by counting the total length of free channels directly under the component and other free channels, and calculating the wiring possibility directly under the component and the wiring frequency coefficient for each layer using the component mounting information, respectively. Input from the board information, and calculate the total length of free channels in one divided area using equations 1 and 2 described above. 3 in FIG. 1 calculates the pin-to-pin to be connected from the logical information, and calculates the route area position when approximated by L-shaped temporary wiring. 4 in Figure 1 is the total length of free channels in the route area obtained in 3 for each route (
There are two routes).
第1図中5は、4で求めた空きチャネル合計長と分割領
域の仮配線長と既に計数済みの仮配線長期待値から前述
の式3により仮配線長期待値を計算し、計数する。第1
図中6で、論理情報の有無を判定し、残りの情報が有る
場合は3、無い場合は7を実行する。第1図中7は、計
数した仮配線長期待値を2で計算した空きチャネル合計
長で割り、その比率を8でリスト、端末装置、補助記憶
装置に表示あるいは出力する。At 5 in FIG. 1, the expected value of the temporary wire length is calculated and counted using the above-mentioned equation 3 from the total free channel length obtained in step 4, the temporary wire length of the divided area, and the already counted expected value of the temporary wire length. 1st
At 6 in the figure, the presence or absence of logical information is determined, and if there is remaining information, step 3 is executed, and if there is no remaining information, step 7 is executed. 7 in FIG. 1 divides the counted expected value of the temporary wiring length by 2 by the calculated total length of free channels, and displays or outputs the ratio as 8 on a list, terminal device, or auxiliary storage device.
本発明によれば、配線前の情報から、実際の配線アルゴ
リズムの特徴を考慮して仮配線を推定するため、実際の
配線に近い評価結果が得られ、評価の精度向上を図る効
果がある。According to the present invention, tentative wiring is estimated from pre-wiring information in consideration of the characteristics of the actual wiring algorithm, so that evaluation results close to actual wiring can be obtained and the accuracy of evaluation can be improved.
また、仮配線長の期待値を計数するため、実際の配線と
異なる経路を推定した場合でもその影響を抑制すること
ができ、同様に評価の精度向上を図る効果がある。Further, since the expected value of the temporary wiring length is counted, even if a route different from the actual wiring is estimated, the influence can be suppressed, and there is also an effect of improving the accuracy of evaluation.
第1図は本発明の一実施例の処理の流れと各処理におけ
る入出力機器を示す図、第2図は空きチャネル数を計数
するためのテーブル構造と基板上のチャネルの対応を示
す図である。
高 1 図
纂2 図Fig. 1 is a diagram showing the processing flow of an embodiment of the present invention and input/output equipment in each process, and Fig. 2 is a diagram showing the correspondence between the table structure for counting the number of empty channels and the channels on the board. be. High 1 Illustrated 2 Diagram
Claims (2)
領域(または基板全体)単位に配線に使用可能な空きチ
ャネルの合計長と接続関係をL字近似した評価のための
配線(仮配線)の合計長を集計し、両者の比率表示また
は後者のみの分布表示により、プリント基板設計におけ
る部品配置を配線前に評価する方法において、以下の(
a)〜(c)のいずれかあるいは総てを実現したことを
特徴とするプリント基板部品配置評価方法。 (a)部品直下の領域が実際には配線されにくいことを
考慮して、仮配線の経路決定時に 部品直下の空チャネル合計長を部品形状に 固有な割合だけ計数する方法 (b)仮配線でL字近似する際に計数される経路候補領
域の空きチャネル合計長を、実際 の配線における各層の使用頻度に比例した 各層空きチャネル合計長の全層合計で算出 する方法 (c)仮配線をL字近似する際に考える2種の経路上候
補領域の両方で、配線しやすさに 比例した仮配線長(仮配線長期待値)を計 数する方法。1. From the component mounting information, logic information, and board information, calculate the total length of free channels that can be used for wiring in each board division area (or the entire board) and the total wiring (temporary wiring) for evaluation by L-shaped approximation of the connection relationship. The following (
A printed circuit board component placement evaluation method characterized by realizing any or all of a) to (c). (a) A method of counting the total length of empty channels directly under the component by a proportion specific to the component shape when determining the temporary wiring route, taking into account that the area directly under the component is difficult to actually route. (b) In the temporary wiring A method of calculating the total length of free channels in the route candidate area, which is counted during L-shaped approximation, by the total length of free channels in each layer, which is proportional to the frequency of use of each layer in the actual wiring. (c) Temporary wiring is set to L A method of counting the tentative wire length (expected tentative wire length) that is proportional to the ease of wiring in both of the two route candidate regions considered when making a shape approximation.
仮配線合計長に代えて、空き領域面積と仮配線の合計面
積を対象としたことを特徴とするプリント基板部品配置
評価方法。2. A printed circuit board component placement evaluation method characterized in that the target area is the vacant area area and the total area of temporary wiring instead of the total length of empty channels and the total length of temporary wiring as used in claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2228118A JPH04111400A (en) | 1990-08-31 | 1990-08-31 | Evaluation method for component arrangement on printed-circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2228118A JPH04111400A (en) | 1990-08-31 | 1990-08-31 | Evaluation method for component arrangement on printed-circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04111400A true JPH04111400A (en) | 1992-04-13 |
Family
ID=16871492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2228118A Pending JPH04111400A (en) | 1990-08-31 | 1990-08-31 | Evaluation method for component arrangement on printed-circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04111400A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5787268A (en) * | 1994-10-20 | 1998-07-28 | Fujitsu Limited | Interactive circuit designing apparatus |
-
1990
- 1990-08-31 JP JP2228118A patent/JPH04111400A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5787268A (en) * | 1994-10-20 | 1998-07-28 | Fujitsu Limited | Interactive circuit designing apparatus |
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