JPH04105955A - Thermal head and manufacture thereof - Google Patents
Thermal head and manufacture thereofInfo
- Publication number
- JPH04105955A JPH04105955A JP22378690A JP22378690A JPH04105955A JP H04105955 A JPH04105955 A JP H04105955A JP 22378690 A JP22378690 A JP 22378690A JP 22378690 A JP22378690 A JP 22378690A JP H04105955 A JPH04105955 A JP H04105955A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat generating
- protrusion
- electrode
- glaze layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 10
- 239000002131 composite material Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910006360 Si—O—N Inorganic materials 0.000 abstract 1
- 238000001354 calcination Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、感熱記録あるいは熱転写記録に使用されるサ
ーマルヘッドおよびその製造方法に係り、より詳しくは
基板上のグレーズ層および発熱部の構造とその形成方法
に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a thermal head used for thermal recording or thermal transfer recording and a method for manufacturing the same, and more specifically relates to a structure of a glaze layer on a substrate and a heat generating part. It relates to its formation method.
（従来の技術と発明か解決しようとする課題）サーマル
ヘッドに３いては、発熱部とインクリボン等との接触を
良好に行なうため、発熱部を基板より高く形成する。(Prior Art and Problems to be Solved by the Invention) In a thermal head, the heat generating part is formed higher than the substrate in order to ensure good contact between the heat generating part and an ink ribbon or the like.
このように、発熱部を高くする構造を実現する従来技術
の１つとして、セラミック基板上の一部に、ガラスでな
るグレーズ層を部分的に設け、その上に発熱部を形成す
ることか行なわれるか、しかしこの構造によると、グレ
ーズの無い部分はセラミック基板表面か露出するため、
表面か粗く、電極の断線等が発生しやすいという欠点か
あった。As described above, one of the conventional techniques for realizing a structure in which the heat generating part is raised is to partially provide a glaze layer made of glass on a part of the ceramic substrate, and then form the heat generating part on the glaze layer. However, according to this structure, the part without glaze is exposed to the surface of the ceramic substrate.
The disadvantage was that the surface was rough and the electrodes were prone to breakage.
このため、セラミック基板の大部分にグレーズ層を設け
、その一部のみを突出させる試みかなされている。例え
ば特開昭６３−７９７７５号においては、第５図に示す
ように、基板１０上の一部に予め結晶化グレーズ層１１
を形成しておき、その後非晶質のグレーズ層１２を全面
に形成して、一部に突起部１３か形成されたグレーズ基
板を得、突起部１３上に発熱部１４を形成している。For this reason, attempts have been made to provide a glaze layer over most of the ceramic substrate and make only a portion of the glaze layer protrude. For example, in Japanese Patent Application Laid-Open No. 63-79775, as shown in FIG.
is formed, and then an amorphous glaze layer 12 is formed on the entire surface to obtain a glazed substrate in which projections 13 are formed in some parts, and heat generating parts 14 are formed on the projections 13.
しかし、この技術によると、突起部１３の形成のため、
結晶化グレーズ層１１の形成と、非晶質グレーズ層１２
の形成の２つの工程か必要となる。However, according to this technique, due to the formation of the protrusion 13,
Formation of crystallized glaze layer 11 and amorphous glaze layer 12
Two steps are required to form the .
また、別の公知例として、実開昭５８−１３８６３４号
に開示されたものかあり、これは、第６図に示すように
、基板１０−ヒに厚いグレーズ層１５を形成し、次に突
起部１８を形成する部分１６をマスクし、他の部分１７
をエツチングにより除去してメサ状（頂部か平坦である
いわゆる台形）に突起した突起部１８を有するグレーズ
基板を得ている。Another known example is disclosed in Japanese Utility Model Application No. 58-138634, in which, as shown in FIG. The part 16 forming part 18 is masked and the other part 17 is masked.
is removed by etching to obtain a glaze substrate having a protrusion 18 projecting in a mesa shape (a so-called trapezoid having a flat top).
しかし、この技術による場合も、グレーズ層１５の形成
、グレーズ層１５のエツチングという２つの工程が必要
である。また、突起部１８はいわゆるメサ型しか形成で
きない。However, even with this technique, two steps are required: forming the glaze layer 15 and etching the glaze layer 15. Furthermore, the protrusion 18 can only be formed into a so-called mesa shape.
一方、アルミナ基板上に、ガラスてなるグレーズ層を設
けると、グレーズ層の端部か盛り上がることか知られて
いる６ （例えば、Ａｌｌ１ｅｒｉｃａｎ Ｃｅｒａ
ｍｉｃ ５ｏｃｉｅｔｙ Ｂｕｌｌｉｔｅｎ
Ｍａｙ １９６８ ．５１１−５１６ｐ）このよ
うな盛り上かり部はメニスカスと呼ばれているか、サー
マルヘッドを含めてこのような盛り上かり部は、グレー
ズ層の平坦性を損なうものとして、常に改善の対象とさ
れてきた。On the other hand, it is known that when a glaze layer made of glass is provided on an alumina substrate, the edges of the glaze layer bulge6 (for example, Allerican Cera
mic 5ociety Bulliten
May 1968. 511-516p) This kind of raised part is called a meniscus, and such raised parts, including the thermal head, are always considered to be the subject of improvement as they impair the flatness of the glaze layer. Ta.
例えば、特公昭５７−１１７９７号においては、基板を
切断することにより前記盛り上かり部を含む部分を除去
し、平坦部を利用している。For example, in Japanese Patent Publication No. 57-11797, the portion including the raised portion is removed by cutting the substrate, and the flat portion is utilized.
また、特開昭５９−１５６９７９号においては、グレー
ズ層の材質を検討することによって、盛り上かり部を極
力抑える努力かなされている。Furthermore, in Japanese Patent Laid-Open No. 59-156979, an effort is made to suppress the raised portions as much as possible by considering the material of the glaze layer.
本発明は、従来好ましくないとされてきた盛り上かり部
を積極的に利用して、発熱部を設ける突起部を少ない工
程数て形成しつるサーマルヘッドとその製造方法を提供
するものである。The present invention provides a thermal head and a method for manufacturing the same, in which a protrusion for providing a heat generating part is formed in a small number of steps by actively utilizing the raised part, which has been considered undesirable in the past.
（課題を解決するための手段）
本発明によるサーマルヘッドは、セラミック基板上に、
端部に外周の断面形状がほぼ半円弧状をなす突起部が形
成され、残りの部分か平坦部をなすグレーズ層か形成さ
れ、該半円弧状突起部の上に、発熱部および電極が設け
られ、さらにその上に耐摩耗層か形成されていることを
特徴とする。(Means for Solving the Problems) The thermal head according to the present invention has
A protrusion whose outer periphery has a substantially semicircular cross-sectional shape is formed at the end, a glaze layer having a flat portion is formed on the remaining part, and a heat generating part and an electrode are provided on the semicircular protrusion. and further has a wear-resistant layer formed thereon.
また、本発明によるサーマルヘッドの製造方法は、セラ
ミック基板上に、焼成時のガラスの表面張力により外周
の断面形状がほぼ半円弧状の突起部を形成し、残りの部
分か平坦部をなすグレーズ層を形成する工程と、該半円
弧状突起部の上に発熱体層、電極および耐摩耗層を順次
形成する工程とを含むことを特徴とするものである。Further, in the method for manufacturing a thermal head according to the present invention, a protrusion having an approximately semicircular cross-sectional shape on the outer periphery is formed on the ceramic substrate due to the surface tension of the glass during firing, and the remaining portion is a glaze that forms a flat portion. The method is characterized in that it includes a step of forming a layer, and a step of sequentially forming a heating element layer, an electrode, and a wear-resistant layer on the semicircular arc-shaped protrusion.
（作用）
本発明のサーマルヘッドは、グレーズ層を焼成する際に
ガラスの表面張力により端部に自然に形成される突起部
を利用するので、１回のグレーズ層形成工程でグレーズ
層が形成される。(Function) The thermal head of the present invention uses the protrusions that are naturally formed at the edges due to the surface tension of the glass when firing the glaze layer, so the glaze layer is formed in one glaze layer forming process. Ru.
（実施例）
以下本発明によるサーマルヘッドの一実施例を示す断面
図であり、■はアルミナ等のセラミック製基板、２は該
基板ｌ上に形成されたガラスてなるグレーズ層、３は例
えば多結晶シリコンてなる発熱体層、４は該発熱体層３
上に形成されたアルミニウム等てなる電極てあり、前記
グレーズ層２の端部に第２図に示すように形成された突
起部２ａ上に電極４の欠落部を設けることにより、欠落
部では電流か発熱体層３を流れる構造となり、突起部２
ａに発熱部５か形成される。６は発熱部５の摩耗を防止
する耐摩耗層てあり、例えば、Ｂ−Ｐ−８ｉ複合体、あ
るいはＬａ−３ｉ−０−Ｎ複合体または酸化タンタルＴ
ａＪｓ等により形成される。(Embodiment) The following is a cross-sectional view showing an embodiment of the thermal head according to the present invention, where ■ is a ceramic substrate such as alumina, 2 is a glaze layer made of glass formed on the substrate l, and 3 is a multilayer A heating element layer made of crystalline silicon; 4 is the heating element layer 3;
By providing a missing portion of the electrode 4 on the protrusion 2a formed at the end of the glaze layer 2 as shown in FIG. It has a structure in which the water flows through the heating element layer 3, and the protrusion 2
A heat generating portion 5 is formed at a. Reference numeral 6 denotes a wear-resistant layer that prevents wear of the heat generating part 5, and is made of, for example, a B-P-8i composite, a La-3i-0-N composite, or a tantalum oxide T.
It is formed by aJs etc.
第３図および第４図はこのサーマルヘッドの製造工程を
示す図であり、まず、第３図に示すように、製品となる
基板の数枚分の広さを有するアルミナ基板ｌ上に、印刷
によりガラスペーストを塗着して焼成する。この際、グ
レーズ層２の外周が焼成時の表面張力により断面形状が
ほぼ半円弧状に盛り上かった突起部２ａが形成され、残
りが平坦部２ｂとなる。FIGS. 3 and 4 are diagrams showing the manufacturing process of this thermal head. First, as shown in FIG. Apply glass paste and fire. At this time, the outer periphery of the glaze layer 2 is formed with a protrusion 2a whose cross section is raised in a substantially semicircular arc shape due to the surface tension during firing, and the remaining portion becomes a flat portion 2b.
次に第４図の左半部に示すように、発熱体層３、電極４
、耐摩耗層６を形成する。なお、本実施例においては、
発熱体層３を構成する多結晶シリコンはＣＶＤ法により
形成し、アルミニウムてなる電極４は蒸着により形成し
、１、ａ−５ｉ−０−Ｎ複合体でなる耐摩耗層６をスパ
ッタリンクにより形成するか、または、Ｂ−Ｐ−３ｉ複
合体をＣＶＤ法により形成した。次に第４図の１点鎖線
７に沿って基板１を切断する。なおこの基板１は、駆動
用電気回路を構成する別の基板（図示せず）と共に、別
の放熱を兼ねた板材に固定される。Next, as shown in the left half of FIG.
, forming the wear-resistant layer 6. In addition, in this example,
The polycrystalline silicon constituting the heating element layer 3 is formed by CVD, the electrode 4 made of aluminum is formed by vapor deposition, and the wear-resistant layer 6 made of a 1, a-5i-0-N composite is formed by sputter linking. Alternatively, a B-P-3i complex was formed by a CVD method. Next, the substrate 1 is cut along the one-dot chain line 7 in FIG. Note that this substrate 1 is fixed to another plate material that also serves as heat radiation, together with another substrate (not shown) constituting a driving electric circuit.
なお、上記のように形成される突起部２ａの高さＨ（第
２図参照）は、４０ｇｍ以下てはサーマルヘッドの突起
部２ａとしては低すぎるため、４０ル１以上必要である
。また、突起部２ａとしては、現状の技術ては、８０ｇ
ｙｒを超えるものを精度良く量産することは難しい。Note that the height H (see FIG. 2) of the protrusion 2a formed as described above is required to be 40 gm or more since it is too low for the protrusion 2a of the thermal head if it is less than 40 gm. In addition, as for the protrusion 2a, the current technology is 80g.
It is difficult to mass-produce products exceeding yr with high precision.
（発明の効果）
本発明によれば、１回のグレーズ層形成工程て、突起部
を有するグレーズ層を形成することかでき、製造工程か
簡略化される。(Effects of the Invention) According to the present invention, a glaze layer having protrusions can be formed in a single glaze layer forming process, thereby simplifying the manufacturing process.
また、外周の断面形状がほぼ円孤状をなす突起部かグレ
ーズ層の端部に形成されるので、発熱部を端部に位置さ
せることかてき、これにより、基板を小型化できる。Furthermore, since the protrusion whose outer periphery has a substantially arcuate cross-sectional shape is formed at the end of the glaze layer, the heat generating section can be located at the end, thereby making it possible to downsize the substrate.
第１図は本発明によるサーマルヘッドの一実施例を示す
断面図、第２図は該実施例の基板にグレーズ層を形成し
たものの一部を示す斜視図、第３図および第４図は該実
施例の製造二［程を示す断面図、第５図並びに第６図は
従来のサーマルヘッドをそれぞれ示す断面図である。
１、基板、２：グレーズ層、２ａ：突起部、２ｂ平坦部
、３：発熱体層、４：電極、５：発熱部、６ 耐摩耗層FIG. 1 is a cross-sectional view showing an embodiment of the thermal head according to the present invention, FIG. 2 is a perspective view showing a part of the thermal head in which a glaze layer is formed on the substrate of the embodiment, and FIGS. 5 and 6 are cross-sectional views showing a conventional thermal head, respectively. 1. Substrate, 2: Glaze layer, 2a: Projection, 2b Flat portion, 3: Heat generating layer, 4: Electrode, 5: Heat generating portion, 6 Wear resistant layer
Claims (1)
半円弧状をなす突起部が形成されかつ残りの部分が平坦
部をなすグレーズ層が形成され、該半円弧状突起部の上
に、発熱部および電極が設けられ、さらにその上に耐摩
耗層が形成されていることを特徴とするサーマルヘッド
。 ２、セラミック基板上に、焼成時のガラスの表面張力に
より外周の断面形状がほぼ半円弧状の突起部を形成し、
残りの部分が平坦部をなすグレーズ層を形成する工程と
、該半円弧状突起部の上に発熱体層、電極および耐摩耗
層を順次形成する工程とを含むことを特徴とするサーマ
ルヘッドの製造方法。[Claims] 1. A glaze layer is formed on a ceramic substrate, the glaze layer having a protrusion whose outer periphery has a substantially semicircular cross-sectional shape at its end and a flat portion in the remaining portion; A thermal head characterized in that a heat generating part and an electrode are provided on the arcuate protrusion, and a wear-resistant layer is further formed on the heat generating part and the electrode. 2. On the ceramic substrate, the surface tension of the glass during firing forms a protrusion whose outer periphery has an approximately semicircular cross-sectional shape,
A thermal head comprising the steps of forming a glaze layer whose remaining portion is a flat portion, and sequentially forming a heating element layer, an electrode, and a wear-resistant layer on the semicircular arc-shaped protrusion. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22378690A JPH04105955A (en) | 1990-08-24 | 1990-08-24 | Thermal head and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22378690A JPH04105955A (en) | 1990-08-24 | 1990-08-24 | Thermal head and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04105955A true JPH04105955A (en) | 1992-04-07 |
Family
ID=16803696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22378690A Pending JPH04105955A (en) | 1990-08-24 | 1990-08-24 | Thermal head and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04105955A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013071355A (en) * | 2011-09-28 | 2013-04-22 | Toshiba Hokuto Electronics Corp | Thermal print head and method for manufacturing the same |
-
1990
- 1990-08-24 JP JP22378690A patent/JPH04105955A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013071355A (en) * | 2011-09-28 | 2013-04-22 | Toshiba Hokuto Electronics Corp | Thermal print head and method for manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6295239A (en) | Thermal head | |
| JPH04105955A (en) | Thermal head and manufacture thereof | |
| JP2005224950A (en) | Thermal head and its manufacturing method | |
| JP2816207B2 (en) | Thick film type thermal head and method of manufacturing the same | |
| JPH041063A (en) | Thermal head and manufacture method therefor | |
| JPS6351155A (en) | Preparation of thermal head | |
| JPS63202465A (en) | Thermal head with cavity | |
| JP2507118B2 (en) | Thermal head manufacturing method | |
| JPS6242464Y2 (en) | ||
| JPH04128059A (en) | Thermal head | |
| JPS61139453A (en) | Thermal head | |
| JPH02156602A (en) | Thermal head | |
| JP2591233B2 (en) | Manufacturing method of thermal head | |
| JPH09100183A (en) | Thick film grazed substrate and its production | |
| JP2791643B2 (en) | Thermal print head | |
| JPH0782921B2 (en) | Method of manufacturing thermal head | |
| JPH02303854A (en) | Thermal head and its manufacture | |
| JPH0839849A (en) | Thermal head | |
| JPH03199059A (en) | Thermal head | |
| JPH05330107A (en) | Thermal printing head | |
| JPS62158062A (en) | Thermal head and production thereof | |
| JPH05330110A (en) | Production of thermal head | |
| JPS62109664A (en) | Thermal head | |
| JP2599948B2 (en) | Manufacturing method of thermal head | |
| JPH02286260A (en) | Thermal printing head |