JPH04105340A - Ic handling equipment and its use method - Google Patents

Abstract

PURPOSE:To obtain an equipment of high operating efficiency wherein waiting time between two tests is eliminated, throughput capacity is almost doubled by one handling equipment, and flexible correspondence with the change of a production line is enabled, by installing a first and a second test head parts which are separated in each mechanism and can progress independently test operations. CONSTITUTION:An IC handling equipment having a first test head part 4 and a second test head part 5 is equipped with the following; an IC mounting stand 1 which mounts IC's for which test is not finished and IC's for which test is finished; a rectangular coordinates type carriage manipulator 3 which is installed above the stand 1 so as to face the IC mounting surface of the stand 1, selectively picks up mounted IC's and carrys them in the direction parallel to the above IC mounting surface, and a first test head part 4 and a second test head part 5 which are installed so as to interpose the carriage manipulator 3 and face each other, equipped with a test robot 6 and a test robot 7, respectively, separated in each mechanism, and can progress independently test operations.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to an IC handling device having two test head sections and a method of using the same, and particularly relates to an IC handling device having two test head sections and a method for using the same. This invention relates to an IC handling device that is separated and designed to improve the operating rate, and a method of using the same.

(Prior art) Conventional IC handling equipment has two
Two IC tests may be performed using two first and second test heads.

For example, from the IC supply section, an untested IC goes to the first test,
It is transported to the Rad Department and sent to the unit (where the X test is carried out).
Next, the AC-tested ICs are transferred to the storage section for a second test, where they are subjected to a DC test, and then classified into non-defective products and defective products and sent to the storage section. In such conventional two test head type IC hand link devices, the first
Since there is a difference between the test time required for the test head section and the test time required for the second test head section, we adopt a method of use in which either one of the test head sections is stopped during test head section IIJ7')l: The disadvantage was that it caused a lot of waiting time and was inefficient.

Also, if you have enough capacity to connect two handling devices to the tester side that is connected to the test head, consider installing one more handling device and connecting it to the tester to double the processing capacity. However, it has the drawback of being too wasteful in terms of equipment investment, installation space, etc. Conventional two-test head type IC handling equipment has a function (HA + processing function) that allows test operations to be performed simultaneously in parallel on each head separately. As mentioned above, conventionally, in the IC handling device of 7) 2 test heso 1z Taigu, there are two test) between There are problems with waiting time and poor equipment operating efficiency.

In addition, if there is sufficient operating capacity on the tester side, one I
There is no high-performance hatch-jumping device that has the processing capacity of two C-handling devices, is low-cost, and space-saving, and there is a strong need for this at production sites.

On the other hand, the types of ICs and the number of ICs required to be produced are becoming increasingly diverse, and the outside of the production line on the production line is changing day by day. In order to respond to this change in the production line, the production site requires, for example, not only hatch processing that uses two test heads, but also single processing that uses only one test head, and series processing that performs AC test i + DC test. There is also a demand for an IC handling device that can be selected at any time as desired.

These are the demands of the production site. 1! - Development of an IC handling/handling device (1) that can be flexible in response to this issue and its usage method has become an important issue.

The present invention has been made in view of the above-mentioned problems, and its purpose is to eliminate the waiting time between two tests in a two-test head type IC handling device and its usage method, and to provide a two-test head type IC handling device and method for using the same. It is an object of the present invention to provide an IC handling device with good operating efficiency, which can almost double the processing capacity and can flexibly respond to changes in a production line, and a method of using the same.

[Configuration J of the Invention (Means for Solving the Problems) The IC hand link device of the present invention according to claim 1 comprises a first
and a second two test head parts.
■ Cfl mounting stand on which the IC1177 is placed and the tCa
! an orthogonal coordinate type transport manipulator that is provided above facing the surface and selectively picks up the alt IC and mounds the rC in a direction parallel to the IC 1di placement surface;
1′, which are provided facing each other with the conveyance manipulators sandwiched therebetween;
The first and second test robots 11.4 are each equipped with a test robot 1, and are separated from each other and capable of independently performing the eggplant operation. This is characterized by the fact that the following is expressed as f+i.

Further, the method of using the C handling device of the present invention as set forth in claim 2 is the method of using the IC handling device of claim 1, in which the test operation of the IC to be tested is performed between the first test head section and the second test head section. Hatch processing mode in which the test operation of the IC under test is performed in parallel with the first test head section, series processing mode in which the test operation of the IC to be tested is performed in the first test head section and then in the second test head section, and the test operation of the IC under test. It is characterized in that it is used in any one of three modes: a single processing mode in which the test is carried out in either the first test head section or the second test section, or in the RAD section. .

(Function) The two test heads, the first and second, of the IC handling device of the present invention are completely separated on the tSS, and can perform test operations independently from each other.

These two test head sections are connected by one orthogonal coordinate transport manipulator. Immediately below this orthogonal coordinate type transport manipulator, there is provided an IC mounting table on which untested ICs and tested ICs 3ii classified into non-defective products, defective products, etc. are placed. The transport manipulator can pick up a desired untested IC on the IC mounting table and can place a tested IC at a predetermined position. In addition, the conveyance manipulator immediately responds to a request (signal) from the first or second test head to attach an untested IC to the head.
It is possible to supply ICs or to receive tested ICs from the head section. In an IC handling device having such a configuration and function, by changing the software program that controls the operation of the device, one of the three modes (styles) of batch processing mode, series processing mode, and single processing mode can be selected. You can choose one or two depending on your preference.

(Embodiment) Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 5 is a perspective view showing an example of the configuration of an IC handling device of the present invention. Untested and tested I
C is stored in a tray (not shown) and placed on the tray set stand 2.
It is placed on the IC mounting table 1P via the IC mounting table 1P. On the 5-tray set stand 2, there are 2 trays for untested ICs,
Two trays for good ICs and one tray for defective ICs are set.

An orthogonal coordinate type transport manipulator 3 is provided substantially parallel to and opposite to the ICf1 placement surface of the IC placement table 1.

FIG. 2 is a schematic diagram showing the mechanism of the transport manipulator 3. The transport manipulator 3 includes a slider 3a for moving in the X direction, a slider 3a for moving in the Y direction,
Directional movement slider 3tl, IC pickup I [13
It consists of c, etc. The IC pickup machine 113c has an untested IC transporting hand 3m and a tested IC11.
It has a sending hand 3n.

The reason for providing two hands is that the test has not been completed with hand 3II (holding C and proceeding to test 1~). The purpose of this IC receiver is to accommodate the tested ICs that are already on the tray, and then supply the untested ICs. The unfinished EC is efficiently supplied. The IC pickup mechanism 3C moves along the X-direction movement slider 3a, and the slider 3a moves along the Y-direction slider 3b by a desired distance specified by the software program. It is possible to do so.

Thereby, the pickup mechanism 3C can pick up a desired untested IC on the ICa placement table 1 or place a tested IC at a desired position.

In FIG. 1, a first test head section 4 and a second test head M5 are provided facing each other with a transport manipulator 3 in between. Both test heads 4 and 5 are connected to first and second test robots (referred to as rotary contact hands in this embodiment) 6 and 7, respectively, and the first and second rotary IC receivers are connected to plates 8 and 9. , and first and second test sowing parts 10 and 11, etc. In this embodiment, the configurations of the first and second test head sections are the same.

Figure 3(a) shows the first (or second) rotary IC receiver f.
Perspective view showing the mechanism of f18 (or 9), same figure (b)
is a diagram for explaining the effect of the uke. Same figure (
In a), the 180 degree rotating part 8C is provided with an IC receiver plate 8a at one end and an IC receiver plate 8b at the other end, and is held on a pedestal 8d via a rotating shaft 8e. . 1
The 80 degree rotating section 8C is intermittently energized by the rotation drive section 8f and rotates 180 degrees each time. The same figure (b
), the IC receiver @8a passes the tested IC to the transport hand 3n at the IC pickup am3C (p!l), and the IC receiver @8a transfers the tested IC from the transport hand 31 to
While C is being supplied, the IC receiver 8b receives and delivers the untested 1C and dispenses the eggplant 10 completed on the side of the first rotary contact hand 6, which will be described later.

In other words, by combining the 2nd hand pisoqua knob mechanism and the rotary contact hand, there is a mechanism that is designed to efficiently handle IC dispensing and receiving. ) is a perspective view showing the appearance of the rotary contact hand 6 (or 7), and FIG. 5 is a configuration diagram illustrating the action of the hand 6 on the rotary contactor 1. In both figures, the 180 degree rotating part 6C is 1, and the mount 6 is
g, and is intermittently driven by a rotation drive unit 6d to rotate 5180 degrees.

The contact hands 6a and 6b are arranged to face each other with a 180 degree rotation 6C in between, and are interlocked with the rotation part 6c to rotate 1
It can rotate 80 degrees and slide up and down, and each has an IC holding mechanism at the lower end of the contact hand.
The contact-side cylinder 6f is above the IC test socket part 1°, and the IC receiver is above the tray 8a, and the receiver is the storage-side cylinder! ! '-6e are provided respectively.

Collection hand ha or 6b gu) On the other hand, for example, hand 6b, IC sogeri part 10, end of test, same 1
(The second one is in Contaf I, and the other one is in Contough 7 F.
At step 6a, the IC receiver dispenses the tested rc onto the tray 8a, and the IC receiver that rotated the next untested IC is removed from the tray 8b, and waits until the test is completed. After the test is completed, the rotating part 6c is rotated 180 degrees and the above operation is repeated.

In FIG. 1, first and second test head sections 4 and 5 are shown.
are extensions of the rC mounting table, and are arranged at both left and right ends when viewed from the front. 2 frame 12 is ■C! ! It supports the mounting table 1 and houses the operation, control, measuring devices, etc. of this IC handling device inside. Also, below the first and second test head sections 4 and 5, there are first and second test head stations 13 and 14, respectively, whose heights can be adjusted. Equipped with an h-measuring device.

Next, we will discuss the operation example of the above IC handling device in the sixth section.
This will be explained with reference to the figures. In the same figure, the same numbers as in Figures 1 to 5 indicate the same parts.
To the first test... After performing the AC test on the test subject 10 in the t-do part 4, in the second test Δ, in the rad part 5, the DC of the [0]
This is an example of series 1/8 filling mode for testing.

■IC! ! Take the untested IC from the final inspection tray 15a placed on the mounting table 1 with the untested IC (W!
Place it on a. Note that the arrow-thin line indicates the flow of the IC, and the numbers written together with the vertical-arrow-thin line indicate the order in which the IC flows.

■The plate 8a of the IC receiver rotates 180 degrees! For example, the contact hand 6a picks up the final inspection IC placed on -8, and 1
Rotate 80 degrees and contact the IC test sogent part.
Perform an AC test.

■After the test, the IC receiver returns the IC to the tray and places it in the
The CC bits hook mechanism 30 takes the second test head section 5 fI! The IC receiver No. 1 is placed on a book, and the test head section 5 performs a DC test.

■After the DC test, place the IC receiver from the plate.
C Bi, ・l Cup a ellipse '3c is taken, and if it is a defective product, it is taken to the defective product tray 15b, and if it is a good product, -h is taken to the non-defective product tray 15.
rct to c! −@Send and store.

■Unsafe) ~ The tray 15a is empty, or the good tray 15
When it becomes full, it is replaced manually by a worker. Note that two final inspection trays and two non-defective trays are provided so that processing can be continued without interruption during manual tray replacement.

Next, a method of using the IC handling device will be explained.

The production conditions of the IC production line (IC type, production quantity, delivery date, etc.) are changing day by day. In order to accommodate this change, the IC handling device is designed to be able to select one of three processing modes, batch processing mode, series processing mode, and single processing mode, as desired.

The batch processing mode is a mode of use in which the first and second test heads perform test operations in parallel and simultaneously;
Two test heads often have the same test operation, for example, one tester and two handling devices.
One favorite capacity for one machine, p).

This processing mode is selected when there is a demand for short delivery times, etc. Note that the test contents of the two test heads in this mode may be different from each other. In the series processing mode, the test operation of the IC to be tested is performed in the first test head section, then the second test is performed in the 18th section. This is selected when, for example, it is desired to perform a post-stress test on an IC that has become . For example, an AC tester is installed in the first test head, and a DC tester is installed in the second test head.
After connecting each tester and performing an AC test,
It is used when it is desired to perform a DC test on an AC-tested IC. In unit processing mode, the test operation is
When the IC test is performed using either the test head section or the second test head section, and there is no need to divide the IC test into two tests, or when the tester side is used for two handling devices. It is selected when there is no capacity or when production conditions do not require the capacity for batch processing.Next, the above EC handling equipment is used.
6 describes how to use the desired processing mode without replacing the testers connected to the first and second test heads with ones compatible with said processing mode. For example, this can be done mainly by switching a control software program built into the IC handling device. The control software programs can be roughly divided into: ■ the core main program (referred to as the (X-Y) robot program in this embodiment), ■ the first test head program, and ■ the third test head program, as shown in Figure 7. There are 3 programs or 2 test head programs. As shown in the figure, ■ Focusing on the robot program,
To each of ■ and ■ - Sodobrodalum or hanging there. As shown by the arrows in the figure, each head program is controlled by a robot program, or the head programs are completely separated and have no connection with each other.6 In other words, the two head programs are , each can execute its processing without interfering with each other at all.

The programs for the three processing modes are all set within the robot program, and the settings can be switched arbitrarily by the user by providing a switch.

Next, the outline of the robot program when set to batch processing mode is shown in Fig. 8 in a simple flowchart.
In the figure, the first and second test head parts are abbreviated as H1 and H2, respectively, and the untested IC and tested IC are abbreviated as final test IC and tested IC, respectively. The robot program consists of steps 101 and 10.
2, the "
It is waiting for processing start command 1, and when the start command is received from one head, it supplies untested ICs/receives tested ICs to that head, processes it, and then sends it to the other head. It continues to wait for the "processing start command" from.
At this time, although not shown, the first and second test head programs execute their processing without interfering with each other, as in 1- above. That is, even if the processing of the first test head section is interrupted due to machine trouble or the like, the processing of the second test head section will continue to be executed and will not receive any y-writes.

Also, for robot/soto programs that are performing batch processing, if the trouble in the first test head section is resolved, "Unless processing start command J is issued, the IC to the first test head section will not be activated."
No supply/receive processing is performed, and processing is exchanged only with the second test head section.

In this specification, "batch processing" refers to a software program, which means that the first and second test head programs, which do not interfere with each other and are processed completely independently, are It can be said that the processing is performed by a robot program that controls the supply of untested ICs to each head section and the reception of tested ICs from each head section without biasing all of them.

Next, the outline of the flowchart of the robot program when set to series processing mode and single processing mode is as follows.
They are shown in FIG. 0 and FIG. 10, respectively.

('In the handling device, the first and second test head parts are completely separated from each other and can perform test operations independently of each other, and the two test head parts are arranged in an orthogonal structure controlled by a robot program. Further, the IC loading and unloading mechanism connected to the coordinate type transport manipulator only needs to be provided with one C mounting table which is shared by the two test heads.

Further, the IC handling device can be used in a desired processing mode by selecting a batch processing mode, a series processing mode, or a single processing mode built into the robot program.

The above-mentioned IC handling device can provide the processing capacity of two IC handling devices, and can provide a high-performance handling device that is both low cost and space-saving, and can reduce the amount of capital investment.

In the above embodiment, the configurations of the first and second test heads are equal to each other.
7 tons, support the sheep, pj: In the cotton example above,
Although a rotary contact hand was used for test robots 1 to 1 in tests 1 to △ and 1, a robot with an arm that works freely may also be used.

``Effect of the Invention 1 As detailed above, the present invention eliminates the waiting time between two tests of a two-test head type IC handling device, and substantially increases the processing capacity of a single IC handling device. We were able to provide an IC handling device with high operating efficiency that can double the number of production lines and flexibly respond to changes in the production line, and a method for using the same.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an example of the configuration of the IC hand link device of the present invention, Fig. 2 is a perspective view showing the mechanism of the transport manipulator, and Fig. 3 (a) shows the mechanism of the rotary receiver plate. FIG. 4 is a perspective view showing the external appearance of the rotary contact hand, and FIG. 5 is a configuration diagram of the rotary contact hand. , ¥4b Figure is a diagram explaining an example of the operation of the above-mentioned [C handling device. Figure 7 is a diagram showing an outline of a software program for controlling the above-mentioned [C handling device.
3 is a flowchart of a robot program for each processing mode selected when using the C handling device. DESCRIPTION OF SYMBOLS 1...IC3[stand, 3...Orthogonal coordinate type transfer manipulator, 4...First test head section, 5...
・Second test head section, 6 and 7...first and second
Rotary contact hand (test robot), 8 and 9...The first and second rotary IC receivers are plates. Fig. 1 2q (b) Fig. 3 Fig. 4 Fig. 6 (N127): Ijl Private Mr. Kori 2 Tohan F”\ Fig. 5 Fig. 6 Fig. 9m7 Fig. 8 Fig. 9

Claims (1)

[Claims] 1. An IC having two test head sections, a first and a second test head section.
The handling device includes an IC mounting table on which untested and tested ICs are placed, and an IC mounting table provided above the IC mounting surface of the IC mounting table to selectively pick up the placed ICs. A Cartesian coordinate type transport manipulator that transports the IC in a direction parallel to the IC mounting surface, and a transport manipulator that is provided facing each other with the transport manipulator in between, each equipped with a test robot, and mechanically separated from each other. and a first and second test head section each capable of independently performing a test operation.
C handling device. 2. The method of using the IC handling device according to claim 1, wherein the test operation of the IC to be tested is carried out in parallel in the first test head section and the second test head section; A series processing mode in which test operation is performed in one test head section and then carried out in a second test head section, and a single processing mode in which test operation of the IC to be tested is performed in either the first test head section or the second test head section. A method of using an IC handling device characterized by using it in any one of three processing modes.