CN220718771U - Wafer chamfering equipment - Google Patents

Abstract

The utility model discloses wafer chamfering equipment which comprises a machine table, a positioning assembly, a bearing assembly, a polishing assembly, a measuring assembly, a first carrying assembly and an adjusting assembly, wherein the positioning assembly is used for positioning the notch position of a wafer to be polished, the polishing assembly is used for polishing the wafer to be polished arranged on the bearing assembly, the measuring assembly is used for measuring the size of the wafer to be polished and the size of the polished wafer, the first carrying assembly is used for carrying the wafer to be polished which is positioned by the positioning assembly to the bearing assembly, the wafer to be polished is placed on the bearing assembly in a preset posture, and the adjusting assembly is used for adjusting the polishing parameters of the polishing assembly and/or adjusting the movement amount of the bearing assembly relative to the polishing assembly in the radial direction of the wafer according to the measurement result of the measuring assembly. According to the wafer chamfering equipment, automatic measurement, carrying and polishing size compensation of the wafer can be realized, labor cost is reduced, and productivity is improved.

Description

Wafer chamfering equipment

Technical Field

The utility model relates to the technical field of semiconductors, in particular to wafer chamfering equipment.

Background

In semiconductor production, the shape of the wafer is usually circular, the edge position of the wafer is approximately right-angled, so that the edge of the wafer has sharp edges, the edge of the wafer is easily damaged to cause edge breakage, and meanwhile, quality problems such as marks and scratches are easily caused, and the subsequent production process and product quality are affected. Therefore, in the semiconductor production process, the wafer edge is generally subjected to chamfering treatment, and the chamfering process not only can enable the wafer edge to be smooth and reduce damage and trace, but also can improve the stability and reliability of chips.

However, in the related art, in the chamfering process of the wafer, the labor cost is high, and the chamfering process efficiency is low.

Disclosure of Invention

The present utility model is directed to solving at least one of the technical problems existing in the related art. Therefore, the utility model provides the wafer chamfering equipment, which can realize automatic measurement, carrying and polishing size compensation of the wafer, reduce labor cost and improve productivity.

According to an embodiment of the utility model, a wafer chamfering apparatus includes: a machine table; the positioning assembly is arranged on the machine and used for positioning the notch position of the wafer to be polished; the bearing assembly is arranged on the machine and used for bearing the wafer to be polished and the polished wafer; the polishing assembly is arranged on the machine and used for polishing the wafer to be polished, which is arranged on the bearing assembly; the measuring assembly is arranged on the machine and is used for measuring the size of the wafer to be polished and the size of the polished wafer; the first carrying assembly is arranged on the machine table and is used for carrying the wafer to be polished which is positioned by the positioning assembly to the bearing assembly, and enabling the wafer to be polished to be arranged on the bearing assembly in a preset posture; the adjusting component is matched with the bearing component and is communicated with the measuring component, and the adjusting component is used for adjusting polishing parameters of the polishing component and/or adjusting the movement amount of the bearing component relative to the polishing component in the radial direction of the wafer according to the measurement result of the measuring component.

According to the wafer chamfering equipment provided by the embodiment of the utility model, the measuring assembly, the first carrying assembly and the adjusting assembly are arranged, so that the wafer chamfering equipment can realize automatic measurement, carrying and polishing size compensation of a wafer, the whole process is automatically completed, the degree of automation is higher, the damage and the error of manual operation can be effectively reduced, the labor cost is reduced, and the productivity is improved; meanwhile, the polishing parameters of the polishing assembly can be adjusted through the adjusting assembly, so that the wafer chamfering equipment can chamfer wafers with different size requirements, and the applicability and practicality of the wafer chamfering equipment are effectively improved.

In some embodiments, the measurement assembly comprises: the first measuring mechanism is arranged adjacent to the positioning assembly and is used for measuring the size of the wafer to be polished, which is placed on the positioning assembly; the second measuring mechanism is arranged at intervals with the first measuring mechanism and is used for measuring the size of the polished wafer placed on the bearing assembly.

In some embodiments, the carrying assembly comprises a first carrying mechanism and a second carrying mechanism which are arranged at left and right intervals, the first carrying mechanism is arranged on the front side of the polishing assembly and can move relative to the polishing assembly along the front-back direction and the left-right direction, the polishing assembly is used for polishing a wafer to be polished, which is arranged on the first carrying mechanism, the second carrying mechanism is arranged adjacent to the second measuring mechanism, the second measuring mechanism is used for measuring the size of the polished wafer, which is arranged on the second carrying mechanism, and the wafer chamfering device further comprises a second carrying assembly which is arranged on the machine and used for carrying the polished wafer to the second carrying mechanism.

In some embodiments, the machine has a first arrangement area, a second arrangement area and a third arrangement area which are arranged at intervals, the third arrangement area comprises a first sub-area and a second sub-area, the first arrangement area, the second arrangement area and the first sub-area are sequentially arranged along the left-right direction, the second sub-area is located at the rear side of the first sub-area, the second measuring mechanism and the second bearing mechanism are both arranged in the first arrangement area, the first measuring mechanism and the positioning assembly are both arranged in the second arrangement area, the first bearing mechanism is movably arranged in the third arrangement area, and the polishing assembly is arranged in the second sub-area.

In some embodiments, the first carrying mechanism has a holding position and a processing position, and the first carrying mechanism is movable between the holding position and the processing position, the polishing assembly is used for polishing a wafer placed on the first carrying mechanism in the processing position, wherein the polishing assembly is internally provided with a polishing cavity, an opening is formed on the front side of the polishing cavity, the first carrying mechanism in the holding position is exposed on the front side outside the polishing cavity, and the first carrying mechanism in the processing position is arranged in the polishing cavity, so that the first carrying mechanism is suitable for entering and exiting the polishing cavity through the opening.

In some embodiments, the first carrying mechanisms are multiple and are sequentially arranged along the left-right direction, and at least two of the multiple first carrying mechanisms share the same polishing assembly; or, each first bearing mechanism is respectively corresponding to one polishing assembly.

In some embodiments, the wafer chamfering apparatus further comprises: the cleaning assembly is arranged on the machine table, the cleaning assembly is arranged between the first bearing mechanism and the second bearing mechanism and is used for cleaning polished wafers, the second conveying assembly comprises a spin-drying mechanism, and the spin-drying mechanism is used for spin-drying the cleaned wafers and conveying the spin-dried wafers to the second bearing mechanism.

In some embodiments, the wafer chamfering apparatus further comprises: the rack is arranged at the front side of the machine table and is used for containing wafers to be polished; the third carrying assembly is arranged on the machine table and used for carrying the wafer to be polished placed on the storage rack to the positioning assembly.

In some embodiments, the rack comprises a storage plate horizontally arranged and positioned at the middle lower part of the machine.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of a wafer chamfering apparatus according to one embodiment of the present utility model;

fig. 2 is a schematic view of the second measuring mechanism, second carrier mechanism and adjustment assembly shown in fig. 1.

Reference numerals:

wafer chamfering apparatus 100, wafer 101,

The machine 1, the first arrangement area 1a, the second arrangement area 1b, the third arrangement area 1c, the first subarea 1d, the second subarea 1e, the positioning component 2, the bearing component 3, the first bearing mechanism 31, the second bearing mechanism 32, the polishing component 4, the measuring component 5, the first measuring mechanism 51, the second measuring mechanism 52, the first carrying component 6, the adjusting component 7, the second carrying component 8, the spin-drying mechanism 81, the cleaning component 9, the rack 10, the placing plate 101 and the third carrying component 11.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the applicability of other processes and/or the use of other materials.

Hereinafter, a wafer chamfering apparatus 100 according to an embodiment of the present utility model, which may chamfer a wafer edge, may also be referred to as a wafer edge chamfering machine, will be described with reference to the accompanying drawings.

In some embodiments of the present application, as shown in fig. 1, a wafer chamfering apparatus 100 includes a machine table 1, a positioning assembly 2, a carrier assembly 3, and a polishing assembly 4. The positioning component 2 is arranged on the machine table 1, and the positioning component 2 is used for positioning the notch position of the wafer to be polished, namely the notch position of the wafer to be polished, so that preparation is made for the posture of the wafer to be polished in the polishing process, the wafer to be polished is polished in the preset posture, and the polishing accuracy is improved. The bearing component 3 is arranged on the machine table 1, the bearing component 3 is used for bearing the wafer to be polished and the polished wafer, the polishing component 4 is also arranged on the machine table 1, and the polishing component 4 is used for polishing the wafer to be polished which is arranged on the bearing component 3.

Therefore, in the above technical scheme of the present application, the wafer to be polished after the positioning of the positioning assembly 2 is completed can be carried to the bearing assembly 3 in the gesture of the positioning completion, and the polishing assembly 4 polishes the wafer to be polished carried to the bearing assembly 3 so as to realize chamfering treatment on the wafer to be polished.

In some embodiments of the present application, as shown in fig. 1, a wafer chamfering apparatus 100 includes a machine table 1, a positioning component 2, a carrying component 3, a polishing component 4 and a first carrying component 6, where the first carrying component 6 is disposed on the machine table 1, and the first carrying component 6 is configured to carry a wafer to be polished, which is positioned by the positioning component 2, to the carrying component 3, and make the wafer to be polished place on the carrying component 3 in a preset posture.

Therefore, in the above technical solution of the present application, the first carrying assembly 6 is provided to carry the positioned wafer to be polished, and the wafer to be polished is placed in the preset posture when being placed in the carrying assembly 3, so as to make full preparation for polishing; meanwhile, the wafer to be polished is not required to be carried manually, so that the labor cost is saved, the precision of the placement posture of the wafer to be polished when the wafer to be polished is placed in the bearing assembly 3 can be improved, the error rate is reduced, and the production efficiency is improved.

Illustratively, the first handling assembly 6 may include a robot arm, so that the first handling assembly 6 can implement corresponding operations at corresponding times after receiving the instructions, thereby improving the degree of intelligence of the wafer chamfering apparatus 100.

It can be understood that the gesture of the wafer to be polished when the positioning assembly 2 finishes positioning, the carrying manner of the first carrying assembly 6, and the like all affect the preset gesture, and the gesture of the wafer to be polished when the positioning assembly 2 finishes positioning is matched with the carrying manner of the first carrying assembly 6, so that the wafer to be polished is placed in the bearing assembly 3 in the preset gesture; for example, the preset gesture may be the same as the gesture of the wafer to be polished when the positioning assembly 2 finishes positioning, and the first handling assembly 6 may not need to change the gesture of the wafer to be polished in the handling process until the wafer to be polished is placed on the carrier assembly 3; of course, the preset posture may be different from the posture of the wafer to be polished when the positioning assembly 2 finishes positioning, and the first handling assembly 6 may adjust the posture of the wafer to be polished during the handling process until the wafer to be polished is placed on the carrier assembly 3 in the preset posture.

In some embodiments of the present application, as shown in fig. 1, a wafer chamfering apparatus 100 includes a machine 1, a positioning component 2, a carrying component 3, a polishing component 4 and a measuring component 5, where the measuring component 5 is disposed on the machine 1, and the measuring component 5 is used for measuring a size of a wafer to be polished and a size of a polished wafer, in other words, the measuring component 5 can measure a size of a wafer before polishing and a size of a polished wafer.

Therefore, in the above technical scheme of the application, through setting up the measuring module 5 and measuring the size around the wafer is polished, need not the manual work and measure, for example need not to purchase separately corresponding measuring equipment in addition, need not the operating personnel and put the wafer before polishing, after polishing on other measuring equipment respectively and measure, further save cost of labor and equipment cost, and can further reduce error rate, promote production efficiency and productivity, convenient operation.

For example, for the measurement of the dimension before polishing the wafer, the measuring assembly 5 may be used to measure the dimension of the wafer to be polished placed on the positioning assembly 2, or the measuring assembly 5 is used to measure the dimension of the wafer to be polished placed on the carrying assembly 3, or the measuring assembly 5 is used to measure the dimension of the wafer to be polished carried by the first carrying assembly 6; for measurement of the polished wafer size, the measurement assembly 5 may be used to measure the polished wafer size placed on the carrier assembly 3.

It is understood that during the wafer chamfering process, the dimensions to be measured before and after polishing the wafer include, but are not limited to, the diameter of the wafer, the width of the outer peripheral surface of the wafer, the notch depth, the notch angle, etc., which are well known to those skilled in the art and will not be described herein.

In some embodiments of the present application, as shown in fig. 1, a wafer chamfering apparatus 100 includes a machine table 1, a positioning component 2, a bearing component 3, a polishing component 4, a measuring component 5 and an adjusting component 7, the adjusting component 7 is matched with the bearing component 3, and the adjusting component 7 is in communication with the measuring component 5, so that a measurement result of the measuring component 5 can be transmitted to the adjusting component 7; wherein the adjusting component 7 is used for adjusting polishing parameters of the polishing component 4 according to the measurement result of the measuring component 5, and/or the adjusting component 7 is used for adjusting the movement amount of the bearing component 3 relative to the polishing component 4 in the radial direction of the wafer according to the measurement result of the measuring component 5, and the polishing parameters can comprise at least one of polishing amount and polishing angle.

In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, which means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

It can be seen that, in the above technical solution of the present application, the adjusting component 7 may analyze whether the size of the polished wafer meets the expected requirement according to the measurement result of the measuring component 5, if so, the adjusting component 7 may not need to adjust the polishing parameter of the polishing component 4, if not, the adjusting component 7 may know the offset between the measurement result and the expected requirement according to the measurement result, and adjust the polishing parameter of the polishing component 4, and/or adjust the movement amount of the carrier component 3 relative to the polishing component 4 in the radial direction of the wafer, so as to adjust the polishing parameter of the polishing component 4 in the subsequent polishing process, such as the polishing amount, the polishing angle, etc., and/or adjust the movement amount of the carrier component 3 relative to the polishing component 4 in the radial direction of the wafer in the subsequent polishing process. For example, the adjustment assembly 7 adjusts the amount of movement, placement attitude, etc. of the polishing assembly 4 relative to the carrier assembly 3 in the radial direction of the wafer during polishing so that the polished wafer will have a size that meets the intended requirements under the polishing process of the polishing assembly 4 after adjusting the polishing parameters; and/or, the adjusting component 7 adjusts the movement amount of the bearing component 3 relative to the polishing component 4 in the radial direction of the wafer in the polishing process, so that the purpose of adjusting parameters such as polishing amount and the like can be achieved, and the size of the wafer after the next polishing tends to be expected, or the size of the wafer after the next polishing meets the expected requirement.

It can be seen that, before the polished wafer size meets the expected requirement, the adjustment component 7 can adjust the polishing parameters of the polishing component 4 at least once to realize automatic compensation of the wafer size, without manually inputting the measurement result into the wafer chamfering device, for example, to reduce the error risk of manually inputting information, without manually adjusting the polishing parameters according to the measurement result, to reduce the error rate of manually adjusting the polishing parameters, to improve the adjustment accuracy, and the like, thereby further saving the labor cost. Compared with some technologies, after polishing the wafer, the wafer is manually taken to other equipment for measurement, measurement data is manually input to the wafer chamfering equipment, inconvenience and labor cost are brought to an automatic factory line, meanwhile, the error risk of manually inputting information is increased, the measurement action and the data input compensation action are more than 30 minutes, the wafer chamfering equipment 100 in the embodiment of the application can realize automatic compensation of the wafer size, is convenient for realizing automatic production, meets the requirement of an automatic production line, enables the polished wafer to meet the expected requirement, and simultaneously reduces the error rate, improves the production efficiency and the productivity, and is convenient to operate.

Alternatively, the adjustment assembly 7 may be configured to adjust the sanding parameters of the sanding assembly 4 according to the measurement results of the measurement assembly 5 at preset time intervals; alternatively, the adjustment assembly 7 is configured to adjust the polishing parameters of the polishing assembly 4 based on the measurements of each wafer by the measurement assembly 5.

It should be noted that, the communication manner between the adjusting component 7 and the measuring component 5 is not particularly limited; for example, the adjustment assembly 7 and the measurement assembly 5 can communicate with each other by wire, or wirelessly, so that the measurement result of the measurement assembly 5 can be transmitted to the adjustment assembly 7.

In some embodiments of the present application, as shown in fig. 1, a wafer chamfering apparatus 100 includes a machine table 1, a positioning component 2, a bearing component 3, a polishing component 4, a first carrying component 6, a measuring component 5 and an adjusting component 7, where the positioning component 2, the bearing component 3, the polishing component 4, the measuring component 5 and the first carrying component 6 are all disposed on the machine table 1, the positioning component 2 is used for positioning a notch position of a wafer to be polished, the bearing component 3 is used for bearing the wafer to be polished and the polished wafer, the polishing component 4 is used for polishing the wafer to be polished disposed on the bearing component 3, the measuring component 5 is used for measuring the size of the wafer to be polished and the size of the polished wafer, the first carrying component 6 is used for carrying the wafer to be polished positioned on the positioning component 2 to the bearing component 3, and making the wafer to be polished disposed on the bearing component 3 in a preset posture, the adjusting component 7 is matched with the bearing component 3, and the adjusting component 7 is in communication with the measuring component 5, and the adjusting component 7 is used for adjusting polishing parameters of the polishing component 4 according to the measurement result of the measuring component 5.

Therefore, according to the wafer chamfering device 100 provided by the embodiment of the utility model, by arranging the measuring component 5, the first carrying component 6 and the adjusting component 7, the wafer chamfering device 100 can automatically measure, carry and compensate the polishing size of the wafer 101, the whole process is automatically completed, the degree of automation is high, the damage and the error of manual operation can be effectively reduced, the labor cost is reduced, and the productivity is improved; meanwhile, the polishing parameters of the polishing assembly 4 can be adjusted through the adjusting assembly 7, so that the wafer chamfering equipment 100 can chamfer wafers with different size requirements, and the applicability and practicality of the wafer chamfering equipment 100 are effectively improved.

In this embodiment, the structure of the polishing assembly 4 (for example, the polishing assembly 4 may include a chamfering grinding wheel), the chamfering mode and the like are not particularly limited, and only the polishing assembly 4 may polish a wafer to achieve wafer chamfering. The structure and the positioning manner of the positioning assembly 2 are not particularly limited, and only the positioning assembly 2 can realize the positioning of the wafer 101 to position the notch position of the wafer and the dimension measurement requirement before polishing.

Illustratively, the positioning assembly 2 may cooperate with the measurement assembly 5 to find the notch location of the wafer. For example, the positioning assembly 2 may include a positioning table and an offset manipulator, where the wafer to be polished is placed on the positioning table, the positioning table drives the wafer to be polished to rotate for one circle, the measurement assembly 5 obtains the center position of the wafer and the position of the notch by measuring parameters such as concentric offset of the wafer in the rotation process, and the offset manipulator adjusts the posture of the wafer according to the measured parameters and places the wafer on the positioning table again in the set posture.

In some embodiments, as shown in fig. 1, the measuring assembly 5 includes a first measuring mechanism 51, the first measuring mechanism 51 is disposed adjacent to the positioning assembly 2, and the first measuring mechanism 51 is used for measuring the size of the wafer to be polished placed on the positioning assembly 2 to obtain the size of the wafer before polishing, and since the first measuring mechanism 51 is disposed adjacent to the positioning assembly 2, no other component is blocked between the first measuring mechanism 51 and the positioning assembly 2, so that the measuring operation of the first measuring mechanism 51 is facilitated; the measuring assembly 5 further comprises a second measuring mechanism 52, the second measuring mechanism 52 being adapted to measure the size of the polished wafer placed on the carrier assembly 3.

In this case, the second measuring mechanism 52 is disposed separately from the first measuring mechanism 51, and the measuring operations of the second measuring mechanism 52 and the first measuring mechanism 51 do not interfere with each other, that is, the second measuring mechanism 52 may stop working or perform corresponding measuring operations when the first measuring mechanism 51 performs measuring operations, and similarly, the first measuring mechanism 51 may stop working or perform corresponding measuring operations when the second measuring mechanism 52 performs measuring operations.

Therefore, in the above technical solution, the first measuring mechanism 51 and the second measuring mechanism 52 are configured to measure the sizes of the wafer before and after polishing, so that the processes of measuring the sizes of the wafer before and after polishing do not interfere with each other, which is beneficial to improving the processing efficiency of the wafer chamfering device 100 on the wafer. Illustratively, when the first measuring mechanism 51 measures one of the wafers before polishing, the second measuring mechanism 52 can measure the other wafer after polishing, so that the measuring assembly 5 can measure the wafers before and after polishing simultaneously, that is, the measuring assembly 5 overlaps the time periods corresponding to the measuring processes of the wafers before and after polishing, so that the wafer chamfering device 100 can continuously perform the whole process of wafer processing.

Illustratively, as shown in fig. 2, the second measuring mechanism 52 may be a laser image head measuring mechanism, and the second measuring mechanism 52 performs measurement of the relevant dimension of the polished wafer 101 by using a laser beam and transmits the measurement result to the adjustment assembly 7.

Of course, in other embodiments of the present application, the first measuring mechanism 51 and the second measuring mechanism 52 may be integrated, where the measuring component 5 can only measure the dimension of the wafer before polishing or measure the dimension of the wafer after polishing when performing a single measurement.

It can be appreciated that the specific structures of the first measuring mechanism 51 and the second measuring mechanism 52 may be set according to the corresponding dimension parameters of the wafer acquired according to actual needs, which is not limited in this embodiment.

In the embodiment of the present application, the setting position of the adjustment assembly 7 is not particularly limited; for example, as shown in fig. 1, the adjusting component 7 may be disposed inside the machine 1.

In some embodiments, as shown in fig. 1, the carrier assembly 3 includes a first carrier mechanism 31, where the first carrier mechanism 31 is disposed on a front side of the polishing assembly 4, and the first carrier mechanism 31 is movable relative to the polishing assembly 4 along a front-back direction and a left-right direction, that is, the first carrier assembly 3 is movable relative to the polishing assembly 4 along the front-back direction, and the first carrier assembly 3 is also movable relative to the polishing assembly 4 along the left-right direction, and the polishing assembly 4 is used for polishing a wafer to be polished placed on the first carrier mechanism 31. As can be seen, the first carrying assembly 6 can carry the wafer to be polished, which is positioned by the positioning assembly 2, to the first carrying mechanism 31, and enable the wafer to be polished to be placed on the first carrying mechanism 31 in a preset posture; then, the first carrying mechanism 31 drives the wafer to be polished to a position matched with the polishing assembly 4, so that the subsequent polishing assembly 4 polishes the wafer placed on the first carrying mechanism 31.

Moreover, since the first bearing mechanism 31 is disposed on the front side of the polishing assembly 4, and the first bearing mechanism 31 can move relative to the polishing assembly 4 along the front-rear direction and the left-right direction, when the wafer chamfering device 100 is used by an operator, the operator can be disposed on the front side of the wafer chamfering device 100, so that the polishing assembly 4 is relatively far away from the operator, noise and the like at the position where the operator is located are reduced, and influence of gas, particles and the like generated in the polishing process on the operator is reduced.

In the above-mentioned scheme, the first carrying mechanism 31 can move relative to the polishing assembly 4 along the front-back direction and the left-right direction, so that the wafer is placed approximately horizontally, the radial direction of the wafer is the horizontal direction, and the adjusting assembly 7 can be used for adjusting the movement amount of the first carrying mechanism 31 relative to the polishing assembly 4 in the front-back direction and/or the left-right direction during polishing according to the measurement result of the measuring assembly 5.

The carrier assembly 3 further includes a second carrier 32, the second carrier 32 and the first carrier 31 are disposed at left and right intervals, and the second measuring mechanism 52 is used for measuring the size of the polished wafer placed on the second carrier 32. The second carrying mechanism 32 is disposed adjacent to the second measuring mechanism 52, so that no other component is blocked between the second measuring mechanism 52 and the second carrying mechanism 32, and the measuring operation of the second measuring mechanism 52 is facilitated.

In the technical proposal, the bearing mechanism for containing the wafer in the polishing process and the bearing mechanism for containing the polished wafer in the dimension measurement are not the same bearing mechanism,

in the above technical solution, the first measuring mechanism 51 and the second measuring mechanism 52 are configured to measure the sizes of the wafers before and after polishing, so that the processes of measuring the sizes of the wafers before and after polishing do not interfere with each other, which is beneficial to improving the processing efficiency of the wafer chamfering device 100 on the wafers. Illustratively, when the first measuring mechanism 51 measures one of the wafers before polishing, the second measuring mechanism 52 measures the other wafer after polishing, so that the measuring assemblies 5 can measure the wafers before polishing and after polishing simultaneously, i.e. the measuring assemblies 5 overlap with each other in time periods corresponding to the measuring processes of the wafers before polishing and after polishing, so as to facilitate the continuous process of the wafer chamfering device 100 for the whole wafer processing procedure

As shown in fig. 1, the wafer chamfering apparatus 100 further includes a second carrying assembly 8, where the second carrying assembly 8 is disposed on the machine table 1, and the second carrying assembly 8 is used for carrying polished wafers to the second carrying mechanism 32, so that after polishing the wafers on the first carrying mechanism 31, the second carrying assembly 8 can carry the wafers to the second carrying mechanism 32 to prepare for measurement by the second measuring mechanism 52. The second carrying assembly 8 is for carrying polished wafers from the first carrying mechanism 31 to the second carrying mechanism 32.

Therefore, in the above technical solution of the present application, the second handling assembly 8 is provided to handle the polished wafer, so as to fully prepare for measuring the polished wafer size; meanwhile, the wafer to be polished is convenient to improve the precision of the placing posture when being placed in the second bearing mechanism 32, the error rate is reduced, and the production efficiency is improved.

Illustratively, the second handling assembly 8 may include a robotic arm, so that the second handling assembly 8 can perform corresponding operations at a corresponding time after receiving the instruction, thereby improving the degree of intelligence of the wafer chamfering apparatus 100.

In some embodiments, as shown in fig. 1, the machine 1 has a first arrangement area 1a, a second arrangement area 1b, and a third arrangement area 1c that are disposed at intervals, the third arrangement area 1c includes a first sub-area 1d and a second sub-area 1e, the second sub-area 1e is located at a rear side of the first sub-area 1d, and the first arrangement area 1a, the second arrangement area 1b, and the first sub-area 1d are sequentially disposed in a left-right direction, so that the second arrangement area 1b is located between the first arrangement area 1a and the first sub-area 1d in the left-right direction.

Wherein, the second measuring mechanism 52 and the second carrying mechanism 32 are both disposed in the first arrangement area 1a, the first measuring mechanism 51 and the positioning assembly 2 are both disposed in the second arrangement area 1b, the polishing assembly 4 is disposed in the second sub-area 1e, the first carrying mechanism 31 is movably disposed in the third arrangement area 1c, and then the first carrying mechanism 31 is disposed in the third arrangement area 1c, and the position of the first carrying mechanism 31 in the third arrangement area 1c is changeable.

In the above technical solution, the first arrangement area 1a, the second arrangement area 1b, and the third arrangement area 1c are provided, so that the partition arrangement of each mechanism or each component on the machine 1 is conveniently realized, and the layout rationality of each component of the wafer chamfering device 100 is improved, so that the arrangement area of the machine 1 is more reasonably utilized; and the second bearing mechanism 32 is convenient to realize and is arranged near the second measuring mechanism 52, the positioning assembly 2 is convenient to realize and is arranged near the first measuring mechanism 51, other mechanisms or assemblies such as the first bearing mechanism 31, the polishing assembly 4 and the like are not easy to be blocked between the second bearing mechanism 32 and the second measuring assembly 5 and are also not easy to be blocked between the positioning assembly 2 and the first measuring mechanism 51, and the measuring convenience is improved.

In addition, since the first arrangement region 1a, the second arrangement region 1b, and the third arrangement region 1c are provided at intervals, it is convenient to achieve the zonal maintenance of the wafer chamfering apparatus 100, and the maintenance convenience of the wafer chamfering apparatus 100 is improved. Illustratively, the first arrangement region 1a and the second arrangement region 1b are separated by a partition, and/or the second arrangement region 1b and the third arrangement region 1c are separated by a partition.

Illustratively, the first carrying mechanism 31 has a carrying position and a processing position in the third arrangement area 1c, and the first carrying mechanism 31 is movable between the carrying position and the processing position, and the polishing assembly 4 is configured to polish a wafer placed on the first carrying mechanism 31 in the processing position, wherein in the carrying position, the first carrying mechanism 31 is disposed on the first sub-area 1d, and in the processing position, the first carrying mechanism 31 is disposed on the second sub-area 1e.

In some embodiments, as shown in fig. 1, the first carrying mechanism 31 has a carrying position and a processing position, and the first carrying mechanism 31 is movable between the carrying position and the processing position, and the polishing assembly 4 is used for polishing the wafer placed on the first carrying mechanism 31 in the processing position; wherein, the polishing assembly 4 has a polishing cavity therein, an opening is formed on a front side of the polishing cavity, the first carrying mechanism 31 at the holding position is exposed on the front side outside the polishing cavity, and the first carrying mechanism 31 at the processing position is disposed in the polishing cavity, so that the first carrying mechanism 31 is adapted to enter and exit the polishing cavity through the opening.

In the above technical solution, when the first carrying mechanism 31 is at the holding position, the first carrying mechanism 31 is located outside the polishing cavity, and the first carrying mechanism 31 is located at the front side of the polishing assembly 4, so that the first carrying assembly 6 carries the wafer to be polished positioned by the positioning assembly 2 to the first carrying mechanism 31; when the first bearing mechanism 31 is positioned at the processing position, the first bearing mechanism 31 is positioned in the polishing cavity so as to isolate particles and the like generated in the polishing process of the wafer through the cavity wall of the polishing cavity, reduce scattering and the like of the particles generated in the polishing process and facilitate centralized processing of the particles and the like; after polishing, the first carrying mechanism 31 can drive the polished wafer to move to the holding position again, so that the first carrying mechanism 31 and the polished wafer are exposed outside the polishing cavity, and the second carrying assembly 8 is convenient for carrying the polished wafer to the second carrying mechanism 32.

In some embodiments, as shown in fig. 1, the first carrying mechanisms 31 are plural, and the plural first carrying mechanisms 31 are sequentially disposed along the left-right direction.

Wherein at least two of the plurality of first carrying mechanisms 31 share the same polishing assembly 4, and at least one preparation position can be provided for polishing of the polishing assembly 4 corresponding to the at least two first carrying mechanisms 31 of the same polishing assembly 4, so as to reduce the time interval between two adjacent wafer polishing processes. For example, when one of the first carrying mechanisms 31 carries a wafer and the polishing assembly 4 polishes the wafer on one of the first carrying mechanisms 31, the first carrying assembly 6 can carry the wafer to be polished on the other first carrying mechanism 31, after polishing the wafer, the polished wafer is driven to leave the processing position by the one first carrying mechanism 31, and the other first carrying mechanism 31 directly drives the wafer to move towards the processing position, so as to reduce the time interval between two adjacent wafer polishing processes and improve the chamfering efficiency of the wafer chamfering device 100.

Or, each of the plurality of first carrying mechanisms 31 is disposed corresponding to one polishing assembly 4, for example, the number of the first carrying mechanisms 31 is equal to the number of the polishing assemblies 4, which is favorable for improving the chamfering efficiency of the wafer chamfering device 100 on the wafer, and the plurality of polishing assemblies 4 can be disposed in turn along the left-right direction, and each polishing assembly 4 can be disposed at the rear side corresponding to the first carrying mechanism 31, so that the distance between each polishing assembly 4 and the operator is larger. Illustratively, at least two of the plurality of grinding assemblies 4 may simultaneously separately grind different wafers.

In some embodiments, as shown in fig. 1, the wafer chamfering apparatus 100 further includes a cleaning component 9, where the cleaning component 9 is disposed on the machine table 1, and the cleaning component 9 is used to clean polished wafers, so as to clean particles on the surfaces of the wafers, and improve accuracy of measurement of polished wafer dimensions, and meanwhile, the polished wafers do not need to be manually cleaned, so that labor cost is further saved.

The cleaning assembly 9 is disposed between the first carrying mechanism 31 and the second carrying mechanism 32, for example, the cleaning assembly 9 is also disposed in the second arrangement area 1b, after polishing is completed on the wafer, the cleaning assembly 9 is carried from the first carrying mechanism 31 to the cleaning assembly 9, after cleaning is completed on the wafer, the cleaning assembly 9 is carried to the second carrying mechanism 32, and the general carrying directions of the two carrying processes are relatively consistent.

For example, the positioning assembly 2 is also arranged between the first bearing mechanism 31 and the second bearing mechanism 32, after the positioning assembly 2 finishes positioning the wafer to be polished, the first carrying assembly 6 carries the wafer to be polished which finishes positioning the positioning assembly 2 to the first bearing mechanism 31 along the first direction, after finishing polishing the wafer, the wafer is carried to the cleaning assembly 9 along the second direction for cleaning, and the cleaned wafer is carried to the second bearing mechanism 32 along the second direction for size measurement; wherein, the wafer is carried from the first carrying mechanism 31 to the cleaning assembly 9, and the wafer is carried from the cleaning assembly 9 to the second carrying mechanism 32, at least one of the two carrying can be realized by the second carrying assembly 8, the first direction and the second direction are opposite, and both are approximately parallel to the left-right direction, so that an overlapping space exists between a carrying space corresponding to the carrying of the wafer before polishing and a carrying space corresponding to the carrying of the wafer after polishing in the left-right direction, so that the occupation space of the wafer chamfering device 100 in the left-right direction is conveniently saved.

In some embodiments, as shown in fig. 1, the second carrying assembly 8 includes a spin-drying mechanism 81, where the spin-drying mechanism 81 is used to spin-dry the cleaned wafer and carry the spin-dried wafer to the second carrying mechanism 32, so as to measure the size of the polished wafer, improve the accuracy of measuring the size of the polished wafer, and meanwhile, spin-dry the polished wafer without manual work, thereby further saving labor cost.

Illustratively, in the above technical solution, the wafer is transported from the first carrying mechanism 31 to the cleaning assembly 9, and the wafer is transported from the cleaning assembly 9 to the second carrying mechanism 32, both of which can be realized by the second transporting assembly 8.

In some embodiments, as shown in fig. 1, the wafer chamfering apparatus 100 further includes a rack 10 and a third carrying assembly 11, the rack 10 is disposed on the front side of the machine 1, and the rack 10 is used for holding wafers to be polished so as to store a plurality of wafers to be polished on the rack 10, the third carrying assembly 11 is disposed on the machine 1, and the third carrying assembly 11 is used for carrying the wafers to be polished disposed on the rack 10 to the positioning assembly 2, so as to further improve the intelligentization degree of the wafer chamfering apparatus 100.

Illustratively, the third handling assembly 11 may include a robot arm, so that the third handling assembly 11 can implement corresponding operations at corresponding times after receiving the instructions, thereby improving the degree of intelligence of the wafer chamfering apparatus 100.

Optionally, the wafer chamfering apparatus 100 includes a second handling assembly 8 and a third handling assembly 11, the third handling assembly 11 and the second handling assembly 8 being integrated; of course, in other examples, the third handling assembly 11 and the second handling assembly 8 may be provided separately.

In some embodiments, as shown in fig. 1, the rack 10 includes a storage plate 101, where the storage plate 101 is horizontally disposed, and the storage plate 101 is located at a middle lower portion of the machine 1, so that the storage plate 101 is located at a position below a middle portion of the machine 1 in an up-down direction, so that the third handling component 11 is convenient to take, and the rack 10 has a simple structure, is convenient to implement, and has low cost.

In some embodiments, as shown in fig. 1, the wafer chamfering apparatus 100 includes a machine table 1, a positioning component 2, a carrying component 3, a polishing component 4, a measuring component 5, a first carrying component 6, an adjusting component 7, a second carrying component 8, a cleaning component 9, and a rack 10; the wafer chamfering device 100 simply starts the wafer loading-wafer chamfering device 100 to chamfer the wafer, adjusts the polishing parameters according to the size of the wafer polished last time, and compensates the wafer, so that the wafer polished next time meets the expected requirement, and polishing continuous operation is realized.

For example, the wafer chamfering apparatus 100 performs chamfering processing on the wafer 101 as follows: placing the wafer cassette on the storage rack 10, taking out the wafer in the wafer cassette by the second carrying assembly 8, placing the wafer in the positioning assembly 2, positioning the notch of the wafer by the positioning assembly 2, and performing size measurement on the wafer placed on the positioning assembly 2 by the first measuring mechanism 51, wherein the measured parameters comprise the diameter of the wafer, the edge width, the notch and the like; the first carrying assembly 6 carries the wafer on the positioning assembly 2 to the first bearing mechanism 31, the first bearing mechanism 31 drives the wafer to move to a processing position, the polishing assembly 4 polishes the wafer on the first bearing mechanism 31 to realize chamfering treatment, and the processing parameters comprise the diameter and the edge surface width of the wafer; the polished silicon wafer is dried by a drying mechanism 81 and is conveyed to a second bearing mechanism 32, the second measuring mechanism 52 performs size measurement on the wafer placed on the second bearing mechanism 32, and the measured parameters comprise the diameter of the wafer, the edge surface width, the notch and the like; the measurement assembly 5 transmits the measurement results to the adjustment assembly 7, and the adjustment assembly 7 automatically compares and analyzes the measurement results and adjusts the polishing parameters of the polishing assembly 4 so as to prepare for the next polishing, so that the wafer polished next time meets the expected requirement. For example, the previous measurement result of the diameter of the polished wafer is 300.5mm, and the diameter of the expected required wafer is 300mm, and the polishing parameters are adjusted by the adjusting component 7, so that the diameter of the wafer at the subsequent polishing position meets the requirement of 300 mm.

Other configurations and operations of the wafer chamfering apparatus 100 according to an embodiment of the present utility model are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. A wafer chamfering apparatus, comprising:

a machine table;

the positioning assembly is arranged on the machine and used for positioning the notch position of the wafer to be polished;

The bearing assembly is arranged on the machine and used for bearing the wafer to be polished and the polished wafer;

the polishing assembly is arranged on the machine and used for polishing the wafer to be polished, which is arranged on the bearing assembly;

the measuring assembly is arranged on the machine and is used for measuring the size of the wafer to be polished and the size of the polished wafer;

the first carrying assembly is arranged on the machine table and is used for carrying the wafer to be polished which is positioned by the positioning assembly to the bearing assembly, and enabling the wafer to be polished to be arranged on the bearing assembly in a preset posture;

the adjusting component is matched with the bearing component and is communicated with the measuring component, and the adjusting component is used for adjusting polishing parameters of the polishing component and/or adjusting the movement amount of the bearing component relative to the polishing component in the radial direction of the wafer according to the measurement result of the measuring component.

2. The wafer chamfering apparatus according to claim 1, wherein the measurement assembly comprises:

the first measuring mechanism is arranged adjacent to the positioning assembly and is used for measuring the size of the wafer to be polished, which is placed on the positioning assembly;

The second measuring mechanism is arranged at intervals with the first measuring mechanism and is used for measuring the size of the polished wafer placed on the bearing assembly.

3. The wafer chamfering apparatus according to claim 2, wherein the carrier assembly includes a first carrier mechanism and a second carrier mechanism arranged at a left-right interval, the first carrier mechanism being provided on a front side of the polishing assembly and being movable in a front-rear direction and a left-right direction with respect to the polishing assembly, the polishing assembly being for polishing a wafer to be polished placed on the first carrier mechanism, the second carrier mechanism being provided adjacent to the second measuring mechanism for measuring a size of the polished wafer placed on the second carrier mechanism,

the wafer chamfering equipment further comprises a second carrying assembly, wherein the second carrying assembly is arranged on the machine table and used for carrying polished wafers to the second bearing mechanism.

4. The wafer chamfering apparatus according to claim 3, wherein the machine has a first arrangement region, a second arrangement region, and a third arrangement region that are provided at intervals, the third arrangement region including a first sub-region and a second sub-region, the first arrangement region, the second arrangement region, and the first sub-region being provided in order in a left-right direction, the second sub-region being located on a rear side of the first sub-region,

The second measuring mechanism and the second bearing mechanism are both arranged in the first arrangement area, the first measuring mechanism and the positioning assembly are both arranged in the second arrangement area, the first bearing mechanism is movably arranged in the third arrangement area, and the polishing assembly is arranged in the second sub-area.

5. The wafer chamfering apparatus according to claim 3, wherein said first carrying mechanism has a holding position and a processing position, and said first carrying mechanism is movable between said holding position and said processing position, said polishing assembly for polishing a wafer placed on said first carrying mechanism in said processing position,

the polishing device comprises a polishing assembly, a polishing cavity, a first bearing mechanism and a first bearing mechanism, wherein the polishing cavity is formed in the polishing assembly, an opening is formed in the front side of the polishing cavity, the first bearing mechanism in the containing position is exposed to the front side outside the polishing cavity, and the first bearing mechanism in the processing position is arranged in the polishing cavity, so that the first bearing mechanism is suitable for entering and exiting the polishing cavity through the opening.

6. The wafer chamfering apparatus according to claim 5, wherein the first carrying mechanism is plural and is provided in order in a left-right direction,

At least two of the plurality of first load bearing mechanisms share the same polishing assembly; or,

each first bearing mechanism is arranged corresponding to one polishing assembly.

7. The wafer chamfering apparatus according to claim 3, further comprising:

the cleaning assembly is arranged on the machine table, the cleaning assembly is arranged between the first bearing mechanism and the second bearing mechanism and is used for cleaning polished wafers, the second conveying assembly comprises a spin-drying mechanism, and the spin-drying mechanism is used for spin-drying the cleaned wafers and conveying the spin-dried wafers to the second bearing mechanism.

8. The wafer chamfering apparatus according to any one of claims 1-7, further comprising:

the rack is arranged at the front side of the machine table and is used for containing wafers to be polished;

the third carrying assembly is arranged on the machine table and used for carrying the wafer to be polished placed on the storage rack to the positioning assembly.

9. The wafer chamfering apparatus according to claim 8, wherein the shelf comprises a storage plate horizontally disposed at a middle lower portion of the machine.