JPH04102572A - Semiconductor wafer receiving carrier - Google Patents

Abstract

PURPOSE:To uniformly treat the surface of a semiconductor wafer by forming the crest parts on the inner surface of a carrier in a vertically straight line. CONSTITUTION:The crest parts 7 of grooves 6 are formed into a straight line from the top to the bottom. The semiconductor wafers are orderly placed in the grooves 6 and each carrier undergoes automatically or manually a series of processes including the immersion into a chemical and a water washing tank to treat such wafers with the chemical and water in a predetermined manner. At this time, since the crest parts 7 on the inner surface of the carrier define opening parts in almost the same shape at the top and bottom, there are no occurrence of oscillatory wave and turbulent water flow due to megasonic vibration excited from below. This method makes difficult the occurrence of shadows in the semiconductor wafer periphery and permits the wafer interior to be treated uniformly with the chemical and water.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor wafer storage carrier (hereinafter simply referred to as a carrier) used in a semiconductor wafer manufacturing process.

[Conventional technology]

Fig. 2 is a perspective view of a conventional carrier of this type. In the figure, 1 and 2 are opposing side walls on both sides, and 3 and 4 are U end plates and H1 @ face plates installed on both sides of these walls and connected to each other. 5 is an alignment bin, and 6.7 is a groove provided on the inner surface of each side wall and its peak.

Next, how to use it will be explained. For example, a semiconductor wafer (not shown) is silently stored in the groove 6 in this carrier, and the carrier is immersed in a chemical tank and a water washing tank by an automatic machine or manually, and subjected to a series of predetermined chemical processing and water washing. Used in the process.

[Problem to be solved by the invention]

However, in this case, when the vibration waves of megasonic cleaning and the water flow of overflow cleaning are amplified from below the carrier in the process of chemical bath treatment and water washing, the protrusion 7a that projects diagonally toward the inner surface at the lower part of the ridge on the inner surface. Since the lower opening is narrow, turbulence caused by carriers occurs around the wafer, creating a shadow, resulting in variations in chemical solution and water washing within the surface of the semiconductor wafer.

This invention was made to eliminate the above-mentioned drawbacks, and an object of the present invention is to provide a carrier that is less likely to cause shadows due to turbulence and turbulence in the plane of a semiconductor wafer.

[Means to solve the problem]

In the carrier according to the present invention, the mountain portions on the inner surface of the carrier are formed straight in the vertical direction.

[Effect]

In this invention, since the peaks on the inner surface of the carrier are uniformly straight, turbulence and turbulence due to the carrier do not occur during cleaning and washing with water.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. In the first section, 1 to 6 are the same as those of the conventional example, but in the present invention, the peaks 7 of the grooves 6 are formed in a straight line from top to bottom.

Next, how to use it will be explained. For example, semiconductor wafers (not shown) are stored in the groove 6 in an orderly manner, and each carrier is immersed in a chemical tank and a water washing tank using an automatic machine or manually, and used for a series of processes such as predetermined chemical processing and water washing. The method of use is the same as in the past, but when used as described above, as is clear from Figure 1, the mountain portion 7 on the inner surface of the carrier
Since the upper and lower openings have almost the same shape, vibration waves of megasonic vibrations applied from below and turbulence of water flow are not generated, which makes it difficult for shadows to form on the edge of the semiconductor wafer. Uniform chemical treatment and water washing can be performed on the wafer surface.

[Effects of the Invention] As described above, according to the present invention, the surface of a semiconductor wafer can be uniformly processed by a simple structure in which the inner surface of the side wall is formed into a straight shape.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional carrier. In the figure, 1 and 2 are side walls, 6 is a groove, and 7 is a peak. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] In a semiconductor wafer storage carrier in which a pair of side wall portions each having a groove for accommodating a wafer are integrally connected at both end faces, a pair of ridge portions on the inner surface of the side wall are parallel and linear, and a lower portion and an upper portion of the carrier A semiconductor wafer storage carrier characterized in that the openings of the sections have substantially the same shape.