JPH04102472U - contact probe bottle - Google Patents

Description

[Detailed explanation of the invention] <Industrial application field>
The present invention relates to contact probe pins that connect a board to be tested and a detection circuit during an operation test of an electronic circuit board.

<Conventional technology>
A conventional contact probe pin will be explained with reference to FIGS. 3 to 6.

FIG. 3 is a configuration diagram of a contact device for testing an electronic circuit and a board to be tested. In the figure, the contact device 11 includes a plurality of contact probe pins 12, a fixing plate 13 for fixing the contact probe pins 12, and a wiring section 15 for connecting the contact probe pins 12 to an external electrical measurement section 14. . A signal cable 16 connects the electrical measuring section 14 and the wiring section 15. Further, 17 is a substrate to be inspected, and 18 is a table on which the substrate to be inspected 17 is placed. In such a configuration, the board to be tested 17 is placed on the table 18, the table 18 is raised or the contact probe pin fixing plate 13 is lowered, and the contact probe pins 12 are crimped to the conductor pattern of the board to be tested 17. The electrical measurement section 14 and the board to be tested 17 are electrically connected, and the test is performed by transmitting and receiving a predetermined signal between them.

Figure 4 shows a typical contact probe pin 12.
FIG. The contact probe pin 12 includes a contact pin 19 body, a spring 20 for applying the pressure necessary for the contact pin 19 to contact the aforementioned substrate 17 to be inspected, a bearing 21 for holding the contact pin 19, and the spring 20. It is composed of.

FIGS. 5(a) to 5(c) show the contact probe pin 12.
FIG. 3 is a diagram showing the operation when the substrate 17 comes into contact with the substrate 17 to be inspected. In the figure, 22 is a substrate body, 23 is a conductor pattern, 24 is a chip component, and 25 is an impurity insulating layer.

First, as shown in FIG. 5(a), the contact probe pins 12 and the substrate to be inspected 17 are brought close together, and then, as shown in FIG. 5(b), the contact probe pins 12 and
The tip of the contact probe pin 12 is brought into contact with the substrate to be inspected 17, but in this state, sufficient contact cannot be obtained yet, and when the contact probe pin 12 and the substrate to be inspected 17 are brought closer together, as shown in FIG. 5(c). , the contact pin 19 sinks into the bearing 21 and pushes the spring 20, and the tip end is pressed against the substrate 17 to be inspected. In this way, sufficient contact is ensured.

<Problems that the idea aims to solve>
By the way, as shown in FIGS. 5(a) to 5(c), the surface of the conductor pattern 23 on the board to be inspected 17 is contaminated with adhesion of flux, etc. that occurs when soldering circuit components, and due to an oxide film on the surface of the solder. There is an impurity insulating layer 25. The tip of the contact probe pin 12 has a sharp shape such as a cone or a needle, and it bites into the impurity insulating layer and makes contact with it by contact pressure. Depending on the thickness of the layer 25, the contact probe pin 12 may not be able to reach the conductor pattern 23, resulting in a problem of poor contact. Conventionally, countermeasures have been taken against such poor contact, such as adding a cleaning operation to the substrate manufacturing process to remove the impurity insulating layer 25. However, even with these measures, the problem of poor contact still occurs.

Therefore, an object of the present invention is to solve such problems and provide a contact probe pin with high contact reliability.

<Means to solve the problem>
In order to achieve the above object, the present invention provides a contact probe pin that is brought into contact with a conductor pattern of the circuit board during an operation test of the circuit board, and a contact pin that brings a tip into direct contact with the conductor pattern, and a housing that accommodates the contact probe pin. and a spring housed between the bottom of the contact pin and the bearing. and a guide groove is formed in the bearing obliquely with respect to the longitudinal direction of the bearing, corresponding to the guide pin.

<Effect>
The tip of the contact probe pin is formed into a drill shape, and the drill-shaped tip is rotated when the contact probe contacts the substrate to be inspected, so even if an impurity insulating layer exists on the surface of the substrate to be inspected, The impurity insulating layer is scraped off by the drill-like tip, allowing the contact probe to reliably contact the substrate to be inspected.

<Example>
An embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is an external view of a contact probe pin according to this embodiment. As shown in the figure, the contact pin 2 of the contact probe pin 1 has a tip 3 shaped like an end mill drill, and a guide pin 4 is attached to the shaft. Furthermore, the bearing 5
The guide groove 6 is opened diagonally with respect to the longitudinal direction, that is, in a spiral shape. 7 is a spring housed in the bearing 5.

The contact operation by the contact probe pin having the above structure is shown in FIGS. 2(a) to 2(c). In FIG. 2, 22 is a substrate body, 23 is a conductor pattern, 24 is a chip component, and 25 is an impurity insulating layer.

First, as shown in FIG. 2(a), the contact probe pin 1 and the substrate to be inspected 17 are brought close together,
As shown in FIG. 2(b), when the contact probe pin 1 and the substrate to be inspected 17 come into contact, the contact pin 2 is then pushed into the bearing 5 as shown in FIG. 2(c), and the stroke guides the contact pin 2. As the pin 4 moves along the guide groove 6 of the bearing 5, a rotational force is applied, causing the entire contact pin 2 to rotate, and this rotation causes the drill-shaped tip 3 to touch the impurity insulating layer 25 on the substrate 17 to be inspected. Scrape to ensure contact with the conductive pattern 23.

Further, after the inspection, the contact pin 2 is pushed back to its original position by the spring 7.

<Effect of the idea>
As explained above, if the contact probe pin according to the present invention is used, even if an impurity insulating layer exists on the board to be tested, the impurity insulating layer is reliably scraped off at the tip of the contact probe pin, and the conductor can be easily formed. Contact with the pattern can be ensured. Therefore, the contact reliability is improved, the inspection accuracy and operating efficiency of the board inspection device are improved, and the conventional product cleaning work can be eliminated.

[Brief explanation of the drawing]

FIG. 1 is an external view of a contact probe pin according to an embodiment of the present invention, FIGS. 2 a to c are diagrams showing the contact operation of the contact probe pin according to the same embodiment, and FIG. 3 is a diagram showing a conventional contact probe pin. FIG. 4 is an external view of a contact probe pin according to a conventional example, and FIGS. 5 a to 5 c are diagrams showing the contact operation of a contact probe pin according to a conventional example. DESCRIPTION OF SYMBOLS 1... Contact probe pin, 2... Contact pin, 3... Tip, 4... Guide pin, 5... Bearing, 6... Guide groove, 7... Spring.

Claims (1)

[Scope of Claim for Utility Model Registration] A contact probe pin that is brought into contact with a conductor pattern of the circuit board during an operation test of the circuit board, comprising: a contact pin whose tip portion directly contacts the conductor pattern; and a bearing that accommodates the contact pin. , a spring housed between the bottom of the contact pin and a bearing; the tip of the contact pin is formed into a drill shape, and a guide pin that protrudes outward is provided on a side surface of the contact pin; A contact probe pin characterized in that a guide groove is formed in the bearing obliquely with respect to the longitudinal direction of the bearing, corresponding to the guide pin.