JPH04102078A - Wiring board inspection device - Google Patents

Wiring board inspection device

Info

Publication number
JPH04102078A
JPH04102078A JP2220252A JP22025290A JPH04102078A JP H04102078 A JPH04102078 A JP H04102078A JP 2220252 A JP2220252 A JP 2220252A JP 22025290 A JP22025290 A JP 22025290A JP H04102078 A JPH04102078 A JP H04102078A
Authority
JP
Japan
Prior art keywords
inspection
wiring board
probe
deviation
inspection position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2220252A
Other languages
Japanese (ja)
Inventor
Tatsuo Matsushita
松下 達男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2220252A priority Critical patent/JPH04102078A/en
Publication of JPH04102078A publication Critical patent/JPH04102078A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent re-inspection, inability of inspection, or damage to a wiring board by measuring deviation between a probe and an inspection position using a photo sensor and compensating for deviation with an inspection position. CONSTITUTION:A wiring board 1 is set to an inspection table 3 and a ground pattern 12 and a control part 62 of a control device 6 are connected. One inspection data is transferred from the inspection data storage part 61 to this control part 62 and a table 3 is transferred to coordinates of this inspection data. Then, a photo sensor 5 measures deviation between an inspection position 2 and a probe 4, compensates for coordinates of the inspection data if there is deviation and moves the table 3, and performs the same processing as in measurement of deviation. If there is no deviation, a control part 65 inspects a floating capacity CS between a wiring pattern 11 and a grounding pattern 12, indicates an error if it does not agree with the floating capacity of the inspection data, and then prints it out 63. Therefore, since the probe always comes into contact with inspection position, re-inspection and inspection inability are not required and there is no counter to areas other than the inspection position, thus preventing a wiring board from being damaged.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、配線基板上に形成された配線パターンの良否
判定を行う配線基板検査装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring board inspection device that determines the quality of wiring patterns formed on a wiring board.

〔従来の技術〕[Conventional technology]

配線基板上に形成された導体配線パターンの良否判定を
行う手段として、導体浮遊容量を検査する方法がある。
2. Description of the Related Art As a means for determining the quality of a conductor wiring pattern formed on a wiring board, there is a method of inspecting conductor stray capacitance.

従来のこの種の配線基板検査装置は、配線パターンのア
ースパターンとの浮遊容量を検査するために、プローブ
の位置を固定しておき、配線基板をあらかしめ指定され
た位置に移動させてから、プローブを配線基板の検査位
置に接触させている。
Conventional wiring board inspection equipment of this type fixes the position of the probe, moves the wiring board to a specified position, and then tests the stray capacitance between the wiring pattern and the ground pattern. The probe is brought into contact with the inspection position of the wiring board.

[発明が解決しようとする課頭〕 上述した従来の配線基板検査装置は、配線基板製造上の
精度や位置合せ精度、配線基板の移動精度の問題により
、プローブが検査位置に接触しない場合がある。その場
合は再度検査をやり直す必要があり、場合によっては検
査不能となることがある。
[Problem to be solved by the invention] In the above-mentioned conventional wiring board inspection apparatus, the probe may not come into contact with the inspection position due to problems with wiring board manufacturing accuracy, alignment accuracy, and wiring board movement accuracy. . In that case, it is necessary to perform the test again, and in some cases, the test may not be possible.

また、配線基板において、プローブが検査位置以外に接
触した場合、配線基板を傷つけることがある。
Furthermore, if the probe comes into contact with a location other than the inspection position on the wiring board, the wiring board may be damaged.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の配線基板検査装置は、配線基板上に形成された
配線パターンの良否判定を行う配線基板検査装置におい
て、前記配線パターンに接触し電気的接続を得るプロー
ブと、前記プローブが指定された検査位置の配線パター
ンに近接するように前記配線基板の概略的位置決めを行
う配線基板移動手段と、フォト・センサにより前記プロ
ーブと前記検査位置との位置ずれを測定する位置ずれ測
定手段と、前記位置ずれ測定手段の出力により前記位置
ずれを補正し前記プローブを前記検査位置に確実に接触
させる位置ずれ補正手段と、前記プローブを介して前記
指定された検査位置の配線パターンのアースパターンに
対する浮遊容量を測定し所定の値であるかどうかを確認
することにより前記配線パターンの良否判定を行う判定
手段とを有している。
A wiring board inspection device of the present invention is a wiring board inspection device that determines the quality of a wiring pattern formed on a wiring board, and includes a probe that contacts the wiring pattern to establish an electrical connection, and a probe to which the probe is designated for inspection. wiring board moving means for roughly positioning the wiring board so as to be close to the wiring pattern at the position; positional deviation measuring means for measuring the positional deviation between the probe and the inspection position using a photo sensor; positional deviation correction means for correcting the positional deviation by the output of the measuring means to ensure that the probe comes into contact with the testing position; and measuring the stray capacitance of the wiring pattern at the designated testing position with respect to the ground pattern through the probe. and determining means for determining the quality of the wiring pattern by checking whether the wiring pattern is a predetermined value.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例を示す斜視図、第2図はその
ブロック図である1本実施例の配線基板検査装置は、検
査テーブル3と、プローブ4と、る。制御装置6は検査
データ保存部61と、制御部62と、印字部63とによ
り構成されている。
FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a block diagram thereof. The wiring board inspection apparatus of this embodiment includes an inspection table 3 and a probe 4. As shown in FIG. The control device 6 includes an inspection data storage section 61, a control section 62, and a printing section 63.

検査テーブル3の上には配線基板1がセットされており
、プローブ4を配線基板1の検査位置2に接触させて検
査を行う。
A wiring board 1 is set on an inspection table 3, and a probe 4 is brought into contact with an inspection position 2 of the wiring board 1 to perform an inspection.

第3図は本発明の一実施例の動作を示すフローチャート
である。第1図〜第3図を用いて動作について説明する
FIG. 3 is a flowchart showing the operation of one embodiment of the present invention. The operation will be explained using FIGS. 1 to 3.

検査テーブル3に配線基板1をセットし、そのアースパ
ターン12と制御装置6の制御部62と接続する(ステ
ップ21)。
The wiring board 1 is set on the inspection table 3, and its ground pattern 12 is connected to the control section 62 of the control device 6 (step 21).

次に、検査テータ保存部61から制御部62へ検査デー
タを1件転送する(ステップ22)。
Next, one piece of test data is transferred from the test data storage section 61 to the control section 62 (step 22).

次に、検査データの座標へ検査テーブル3を移動する(
ステップ23)。
Next, move the inspection table 3 to the coordinates of the inspection data (
Step 23).

次に、フォト・センサ5により検査位置2(配線パター
ン11のパッド中心部)とプローブ4とのずれを測定す
る(ステップ24)。
Next, the photo sensor 5 measures the deviation between the inspection position 2 (the center of the pad of the wiring pattern 11) and the probe 4 (step 24).

次に、ずれがあるかないかの判定を行う(ステップ25
)。もしずれがある場合には検査データの座標を補正し
くステップ26)、検査テーブル3を移動しくステップ
23)、同様にステップ24以降の処理を行う。ずれが
ない場合にはプローブ4を介して制御部62により配線
パターン11とアースパターン12間の浮遊容量(C3
)の検査を行い(ステップ27)、検査データの浮遊容
量をと一致しなければエラーヒし、印字部63にて検査
データの印字を行う(ステップ28)。
Next, it is determined whether or not there is any deviation (step 25).
). If there is a deviation, the coordinates of the inspection data are corrected in step 26), the inspection table 3 is moved in step 23), and the processes from step 24 onwards are similarly performed. If there is no deviation, the stray capacitance (C3
) is performed (step 27), and if the stray capacitance of the test data does not match, an error occurs and the test data is printed in the printing section 63 (step 28).

次に、検査が終了したがしないかの判定を行う(ステッ
プ2つ)。もし検査が終了していなければ検査データ保
存部61より制御部62に次の検査データを1件転送し
くステップ22)、同様にステップ23以降の処理を行
う。検査が終了した場合は、終わりとする。
Next, it is determined whether the inspection has been completed or not (two steps). If the examination has not been completed, the next piece of examination data is transferred from the examination data storage section 61 to the control section 62 (step 22), and the processes from step 23 onwards are similarly performed. When the inspection is completed, it is considered as the end.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、フォト・センサによりプ
ローブと検査位置とのずれを測定し検査位置とのずれを
補正することにより、次のような効果がある。
As explained above, the present invention has the following effects by measuring the deviation between the probe and the inspection position using a photo sensor and correcting the deviation from the inspection position.

(1)検査前の位置合わせは、さほど正確に行う必要は
ない。
(1) Positioning before inspection does not need to be performed very accurately.

(2)配線基板製造の精度や位置合わせ精度、配線基板
の移動精度の間顕があっても検査位置にプローブが必ず
接触するので、再検査を行ったり検査不能となることは
ない。
(2) Even if the wiring board manufacturing accuracy, positioning accuracy, and wiring board movement accuracy are compromised, the probe always comes into contact with the inspection position, so there is no possibility of re-inspection or failure of inspection.

(3)配線基板において、プローブは検査位置以外に接
触しないため、誤って配線基板を傷つけるようなことは
ない。
(3) Since the probe does not come into contact with anything other than the inspection position on the wiring board, there is no chance of accidentally damaging the wiring board.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の斜視図、第2図は第1図の
実施例のブロック図、第3図は本発明の一実施例の動作
を示すフローチャートである。 1・・・配線基板、2・・・検査位置、3・・・検査テ
ーブル、4・・・プローブ、5・・・フォト・センサ、
6・・・制御装置、11・・配線パターン、12・・・
アースパターン、61・・・検査データ保存部、62・
・・制御部、63・・・印字部。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a block diagram of the embodiment of FIG. 1, and FIG. 3 is a flowchart showing the operation of the embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Wiring board, 2... Inspection position, 3... Inspection table, 4... Probe, 5... Photo sensor,
6...Control device, 11...Wiring pattern, 12...
Earth pattern, 61... Inspection data storage section, 62.
...control section, 63...printing section.

Claims (1)

【特許請求の範囲】[Claims]  配線基板上に形成された配線パターンの良否判定を行
う配線基板検査装置において、前記配線パターンに接触
し電気的接続を得るプローブと、前記プローブが指定さ
れた検査位置の配線パターンに近接するように前記配線
基板の概略的位置決めを行う配線基板移動手段と、フォ
ト・センサにより前記プローブと前記検査位置との位置
ずれを測定する位置ずれ測定手段と、前記位置ずれ測定
手段の出力により前記位置ずれを補正し前記プローブを
前記検査位置に確実に接触させる位置ずれ補正手段と、
前記プローブを介して前記指定された検査位置の配線パ
ターンのアースパターンに対する浮遊容量を測定し所定
の値であるかどうかを確認することにより前記配線パタ
ーンの良否判定を行う判定手段とを有することを特徴と
する配線基板検査装置。
A wiring board inspection device that determines the quality of a wiring pattern formed on a wiring board includes a probe that contacts the wiring pattern to establish an electrical connection, and a probe that is placed close to the wiring pattern at a designated inspection position. a wiring board moving means for roughly positioning the wiring board; a positional deviation measuring means for measuring the positional deviation between the probe and the inspection position using a photo sensor; positional deviation correction means for correcting and ensuring that the probe comes into contact with the inspection position;
and determining means for determining the quality of the wiring pattern by measuring the stray capacitance of the wiring pattern at the designated inspection position with respect to the earth pattern through the probe and checking whether it is a predetermined value. Characteristic wiring board inspection equipment.
JP2220252A 1990-08-22 1990-08-22 Wiring board inspection device Pending JPH04102078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2220252A JPH04102078A (en) 1990-08-22 1990-08-22 Wiring board inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2220252A JPH04102078A (en) 1990-08-22 1990-08-22 Wiring board inspection device

Publications (1)

Publication Number Publication Date
JPH04102078A true JPH04102078A (en) 1992-04-03

Family

ID=16748275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2220252A Pending JPH04102078A (en) 1990-08-22 1990-08-22 Wiring board inspection device

Country Status (1)

Country Link
JP (1) JPH04102078A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10970387B2 (en) 2015-05-22 2021-04-06 Power Fingerprinting Inc. Systems, methods, and apparatuses for intrusion detection and analytics using power characteristics such as side-channel information collection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10970387B2 (en) 2015-05-22 2021-04-06 Power Fingerprinting Inc. Systems, methods, and apparatuses for intrusion detection and analytics using power characteristics such as side-channel information collection
US11809552B2 (en) 2015-05-22 2023-11-07 Power Fingerprinting Inc. Systems, methods, and apparatuses for intrusion detection and analytics using power characteristics such as side-channel information collection

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