JPH0398303A - Hybrid crystal oscillator - Google Patents

Abstract

PURPOSE:To obtain a crystal oscillator with high accuracy through the use of an existing crystal resonator by arranging a crystal resonator and a semiconductor element connected with each other electrically onto a thin film printed circuit board having a capacitor comprising a thin film circuit and varying the capacitance of the capacitor while vibrating the crystal resonator so as to adjust the frequency. CONSTITUTION:A crystal resonator 4 and a semiconductor element 5 connected with each other electrically are arranged onto a thin film printed circuit board 3 having a capacitor 2 comprising a thin film circuit and the capacitance of the capacitor 2 is varied while vibrating the crystal resonator 4 via the semiconductor element 5 so as to adjust the frequency, then a metallic lead terminal and the thin film circuit board 3 are connected electrically and the entire components are enclosed in a package. When the correction of the oscillated frequency is required, a laser beam L irradiates to the capacitor 2 to decrease the area shown in hatched lines thereby varying the capacitance of the capacitor 2 and varying the oscillating frequency. Thus, the existing crystal resonator is employed to obtain a hybrid crystal oscillator with high accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a crystal oscillator, and particularly to a high-precision hybrid crystal oscillator whose frequency is adjusted during the manufacturing process.

[Conventional technology]

Conventional crystal oscillators consist of a metallic cylinder-type crystal oscillator whose frequency cannot be adjusted once it is sealed in a package.
It was composed of a combination of semiconductor elements.

In this way, once the frequency of the crystal resonator itself is adjusted, it becomes fixed. Furthermore, since the capacitance of the semiconductor element has large variations, the frequency of the oscillator also has large variations, making it difficult to obtain a highly accurate oscillator.

As a conventional technique to solve this problem,
There are those described in the specification and drawings of No. 3-81411.

In other words, a crystal oscillator is constructed using a crystal resonator made by enclosing a crystal piece with a weight attached inside a square case with a glass surface, and the resonator causes oscillation during the manufacturing process of the oscillation device. However, the frequency of the crystal oscillator is adjusted by partially removing the weight of the crystal piece inside the glass case using a laser beam and changing the frequency of the vibrator, and then the crystal piece is sealed in a package.

[Problem to be solved by the invention]

In conventional technology, the frequency of the crystal resonator itself is fixed once it is adjusted. Furthermore, since the capacitance of semiconductor elements is large, the frequency of the oscillator also has large variations, making it difficult to obtain a highly accurate oscillator.

Furthermore, the crystal oscillator described in the specification and drawings of Utility Model Application No. 63-81411 uses a crystal oscillator made by enclosing a crystal piece with a weight attached inside a square case with a glass surface. Because it was realized by using a special crystal resonator, it could not be applied to ordinary crystal resonators and required new crystal resonator manufacturing technology.

An object of the present invention is to solve the problems of these conventional techniques and provide a highly accurate hybrid crystal oscillator using an existing crystal resonator.

[Means to solve the problem]

=3 In order to achieve the above object, the hybrid crystal oscillator of the present invention includes a crystal resonator, a semiconductor element for vibrating the crystal resonator, and a part of the metal lead terminal of this semiconductor element, and is molded with resin. In the hybrid crystal oscillator, the crystal oscillator is placed on a thin film circuit board with a thin film circuit capacitor, with the crystal resonator and semiconductor element electrically connected. It is characterized by adjusting the frequency by changing the capacitance of the capacitor while vibrating it through the element, and then electrically connecting the metal lead terminal and the thin film circuit board and packaging.

[Effect]

In the present invention, the crystal oscillator vibrates the crystal resonator via the semiconductor element in a manufacturing process before packaging.

The vibration of the crystal resonator and the semiconductor element produce oscillation as a crystal oscillator, and the frequency of this oscillation is measured. If the frequency deviates from the specified frequency, the capacitor formed by the thin film circuit on the substrate is processed, for example, by removing it with a laser beam, to change its capacitance.

This capacitor is connected to the crystal, so
The frequencies of the vibration of the crystal resonator and the oscillation of the semiconductor element are
Change.

Once the specified frequency is obtained, the metal lead terminals that will serve as connection terminals when molded are electrically connected to the thin film circuit board on which the crystal oscillator is provided, and packaged.

In this way, the oscillation frequency of the crystal oscillator can be easily adjusted during the manufacturing process.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a plan view showing the internal structure of a crystal oscillator according to the present invention.

A capacitor 2 made of a thin film circuit in which a conductor, a dielectric, and a conductor are laminated in this order, and an electrode pattern 1 formed of the conductor.
A crystal resonator 4 is mounted on a ceramic substrate 3 having
and a semiconductor element 5 are provided.

The crystal resonator 4 and the semiconductor element 5 are electrically connected by wires 6 through the electrode pattern 1 on the ceramic substrate 3.

Furthermore, the ceramic substrate 3 has power supply terminals 11 and 12 and output terminals 10a and 10b for applying electrical energy to the semiconductor element 5 from an external power supply 8 and causing the crystal resonator 4 to oscillate.

In the manufacturing process of the crystal oscillator having such a configuration, the following processing is performed.

First, by applying a voltage through the power supply terminals 11 and 12, the crystal resonator 4 is caused to oscillate. It should be noted that this oscillation method is generally known, so a description thereof will be omitted.

Probes 7a and 7b are set up at output terminals 10a and 10b, and counter 9 is connected to read the oscillation frequency.

If it is necessary to modify this oscillation frequency, in this state, irradiate the capacitor 2 with laser light (L),
Reduce the area (shaded area). In this way, by changing the capacitance of the capacitor 2, the oscillation frequency is changed and adjusted to a specified value.

FIG. 2 is a plan view showing the structure of the ceramic substrate 3 in FIG. 1.

Applying layered patterning technology, ceramic substrate 3
A capacitor 2 is formed thereon. Furthermore, an electrode pattern l formed of a conductor is provided. It should be noted that the method for forming the capacitor 2 is already well known, so a description thereof will be omitted.

On the ceramic substrate 3 configured in this way, the first
Each component shown in the figure is provided and has the function of a crystal oscillator.

FIG. 3 is a sectional view of the internal structure of the crystal oscillator in FIG. 1.

A capacitor 2 and a crystal resonator 4 are mounted on the ceramic substrate 3.
, and a semiconductor element 5 electrically connected to the crystal resonator 4 through the wire 6 and the electrode pattern 1. A portion of the capacitor 7-2 (hatched portion) is shown to have disappeared due to the laser beam (L) irradiation.

FIG. 4 is a plan view showing a completed state in which the crystal oscillator in FIG. 1 is molded with resin.

In order to electrically connect the completed crystal oscillator 13 to other circuits, a lead frame 14, an electrode pattern 1 of the ceramic substrate 3, and a wire 15 are provided.

By molding the crystal oscillator in this way, a hybrid crystal oscillator that can be easily connected to other circuits and has high reliability can be obtained.

Incidentally, until the lead frame 14 is molded, it is connected in a series by tie bars (not shown), so that each lead frame 14 does not fall off.

Then, for the first time after molding, on the outside of the resin,
The lead frame l4 is cut using a mold or the like, and each crystal oscillator becomes a single product. Since this molding technique is already known, detailed explanation will be omitted.

As described above, in the crystal oscillator of this embodiment, the capacitor 2 and the electrode pattern 1 are formed on the ceramic substrate 3 by applying the laminated patterning technology (thin film circuit technology), and the crystal oscillator 4 and the semiconductor element are formed on the ceramic substrate 3. 5 and set up. The crystal resonator 4 and the semiconductor element 5 are electrically connected on the ceramic substrate 3 by a wire 6, and electrical energy is applied from the outside via the ceramic substrate 3 to cause the crystal oscillator to oscillate. During the oscillation, the ceramic substrate 3
The upper capacitor 2 is trimmed to adjust the oscillation frequency, and then packaged.

As described above, according to the crystal oscillator of this embodiment, the frequency of the crystal oscillator 4 can be adjusted by oscillation within the same package using a normal crystal oscillator, so that it is possible to easily achieve high precision and reliability in the manufacturing process. It is possible to obtain a hybrid crystal oscillator with high performance, and it is possible to manufacture a crystal oscillator with high tuning accuracy at a high yield and at low cost.

Furthermore, since it is molded with resin, it maintains high reliability, and in particular, since there is no need to take out the terminals of the crystal resonator to the outside, there is no problem of oscillation stopping due to short circuit between the terminals due to humidity.

〔Effect of the invention〕

According to the present invention, it is possible to easily realize a highly accurate hybrid crystal oscillator using an existing crystal resonator.

[Brief explanation of drawings]

The drawings show embodiments of the present invention; FIG. 1 is a plan view showing the internal structure of a crystal oscillator to which the invention is applied; FIG. 2 is a plan view showing the structure of the ceramic substrate in FIG. 1; FIG. FIG. 1 is a sectional view of the internal structure of the crystal oscillator, and FIG. 4 is a plan view showing the crystal oscillator in FIG. 1 in a molded and completed state. 1: Electrode pattern, 2: Capacitor, 3: Ceramic substrate, 4: Crystal resonator, 5: Semiconductor element, 6: Wire, 7
: Probe, 8: External power supply, 9 Counter, 10: Output terminal, 11.12・Power supply terminal, 13: Crystal oscillator, 14・
Lead frame, 15: wire.

Claims (1)

[Claims] (1) In a crystal oscillator that is resin-molded and includes a crystal resonator, a semiconductor element that vibrates the crystal resonator, and a part of a metal lead terminal from the semiconductor element, the crystal oscillator is connected to a capacitor using a thin film circuit. In a manufacturing process in which the crystal resonator and the semiconductor element are arranged in an electrically connected state on a thin film circuit board having a A hybrid crystal oscillator characterized in that the frequency is adjusted by changing the frequency, and then the metal lead terminal and the thin film circuit board are electrically connected and packaged.