JPH0397975U - - Google Patents
Info
- Publication number
- JPH0397975U JPH0397975U JP592090U JP592090U JPH0397975U JP H0397975 U JPH0397975 U JP H0397975U JP 592090 U JP592090 U JP 592090U JP 592090 U JP592090 U JP 592090U JP H0397975 U JPH0397975 U JP H0397975U
- Authority
- JP
- Japan
- Prior art keywords
- wirings
- insulating layer
- land
- layers
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Alarm Systems (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP592090U JPH0397975U (sv) | 1990-01-24 | 1990-01-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP592090U JPH0397975U (sv) | 1990-01-24 | 1990-01-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0397975U true JPH0397975U (sv) | 1991-10-09 |
Family
ID=31509607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP592090U Pending JPH0397975U (sv) | 1990-01-24 | 1990-01-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0397975U (sv) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0946015A (ja) * | 1995-07-28 | 1997-02-14 | Hewlett Packard Co <Hp> | プリント回路基板 |
JP2005244010A (ja) * | 2004-02-27 | 2005-09-08 | Toppan Printing Co Ltd | 回路基板の実装構造 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5392470A (en) * | 1977-01-24 | 1978-08-14 | Hitachi Ltd | Method of producing printed circuit board |
JPS5878498A (ja) * | 1981-11-04 | 1983-05-12 | 日本電気株式会社 | 多層プリント配線基板 |
JPS61290794A (ja) * | 1985-06-19 | 1986-12-20 | 株式会社日立製作所 | 配線基板 |
JPS6214806B2 (sv) * | 1978-12-01 | 1987-04-03 | Sony Corp |
-
1990
- 1990-01-24 JP JP592090U patent/JPH0397975U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5392470A (en) * | 1977-01-24 | 1978-08-14 | Hitachi Ltd | Method of producing printed circuit board |
JPS6214806B2 (sv) * | 1978-12-01 | 1987-04-03 | Sony Corp | |
JPS5878498A (ja) * | 1981-11-04 | 1983-05-12 | 日本電気株式会社 | 多層プリント配線基板 |
JPS61290794A (ja) * | 1985-06-19 | 1986-12-20 | 株式会社日立製作所 | 配線基板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0946015A (ja) * | 1995-07-28 | 1997-02-14 | Hewlett Packard Co <Hp> | プリント回路基板 |
JP2005244010A (ja) * | 2004-02-27 | 2005-09-08 | Toppan Printing Co Ltd | 回路基板の実装構造 |
JP4543699B2 (ja) * | 2004-02-27 | 2010-09-15 | 凸版印刷株式会社 | 回路基板の実装構造 |