JPH0397928U - - Google Patents
Info
- Publication number
- JPH0397928U JPH0397928U JP1990005832U JP583290U JPH0397928U JP H0397928 U JPH0397928 U JP H0397928U JP 1990005832 U JP1990005832 U JP 1990005832U JP 583290 U JP583290 U JP 583290U JP H0397928 U JPH0397928 U JP H0397928U
- Authority
- JP
- Japan
- Prior art keywords
- connecting electrode
- protruding shape
- gold
- registration request
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す正面図
及び底面図、第２図は同上の高周波部品を基板上
に実装した状態を示す一部破断した正面図、第３
図は従来の高周波部品を基板上に実装した状態を
示す一部破断した正面図である。 １……パツケージ、２……接続用電極。
及び底面図、第２図は同上の高周波部品を基板上
に実装した状態を示す一部破断した正面図、第３
図は従来の高周波部品を基板上に実装した状態を
示す一部破断した正面図である。 １……パツケージ、２……接続用電極。
Claims (1)
- 高周波素子を内蔵したパツケージの実装面に突
起状もしくは一部が突起状となつた接続用電極を
設け、この接続用電極の突起部分の少なくとも表
面層を金によつて形成したことを特徴とする高周
波部品。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990005832U JPH0397928U (ja) | 1990-01-25 | 1990-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990005832U JPH0397928U (ja) | 1990-01-25 | 1990-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397928U true JPH0397928U (ja) | 1991-10-09 |
Family
ID=31509523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990005832U Pending JPH0397928U (ja) | 1990-01-25 | 1990-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397928U (ja) |
-
1990
- 1990-01-25 JP JP1990005832U patent/JPH0397928U/ja active Pending