JPH0397279A - Board for electronic component and manufacture of the component having the board - Google Patents
Board for electronic component and manufacture of the component having the boardInfo
- Publication number
- JPH0397279A JPH0397279A JP1234043A JP23404389A JPH0397279A JP H0397279 A JPH0397279 A JP H0397279A JP 1234043 A JP1234043 A JP 1234043A JP 23404389 A JP23404389 A JP 23404389A JP H0397279 A JPH0397279 A JP H0397279A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- substrate
- filter
- external
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 230000002093 peripheral effect Effects 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 39
- 238000000605 extraction Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 abstract description 15
- 238000007747 plating Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、複数個の外部引出し電極を有する電子部品、
例えば発振子、フィルタ等の基板及びその基板を備えた
電子部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component having a plurality of external extraction electrodes;
For example, the present invention relates to a method of manufacturing a substrate such as an oscillator or a filter, and an electronic component including the substrate.
裟迷ｃｌＥ＋もと課題
従来、電子部品の基板としては、例えば、第６図に示す
２段結合フィルタに使用される圧電体基板４１が知られ
ている。圧電体基板４１は２個の多重モード・フィルタ
部Ｆｌ ， Ｆ２と１個のコンデンサ部Ｃ１を有してい
る。入出力引出し電極４２． ４３が基板４１上面の左
右端に形成され、共通引出し電極４４が基板４１下面の
下辺中央部に形成されている。Conventionally, as a substrate for electronic components, for example, a piezoelectric substrate 41 used in a two-stage coupling filter shown in FIG. 6 has been known. The piezoelectric substrate 41 has two multimode filter sections Fl and F2 and one capacitor section C1. Input/output extraction electrode 42. 43 are formed at the left and right ends of the upper surface of the substrate 41, and a common extraction electrode 44 is formed at the center of the lower side of the lower surface of the substrate 41.
フィルタ部Ｆ１は基板４１の左側上面に形成されている
二つの入出力振動電極４５ａ， ４５ｂとこれらニ対置
して基板４１の下面に形成されている一つの共通振動電
極４６から構成されている。同様に、フィルタ部Ｆ２は
基板４１の右側上面の二つの入出力振動１Ｅ極４８ａ．
４８ｂとこれらに対置する一つの共通振動電極４９か
ら構成されている。The filter section F1 is composed of two input/output vibrating electrodes 45a and 45b formed on the upper left surface of the substrate 41, and one common vibrating electrode 46 formed on the lower surface of the substrate 41 opposite to these electrodes. Similarly, the filter section F2 has two input/output vibration 1E poles 48a.
48b and one common vibrating electrode 49 placed opposite these.
コンデンサ部Ｃ１はフィルタ部Ｆ１とＦ２の間に位置し
、基板４１の上下面に対向して形成されている容量電極
４７ａ． ４７ｂから構成されている。The capacitor section C1 is located between the filter sections F1 and F2, and includes capacitor electrodes 47a. 47b.
これらフィルタ部Ｆｌ ， Ｆ２及びコンデンサ部Ｃ１
は、導体線路によって電気的に接続されている。These filter sections Fl, F2 and capacitor section C1
are electrically connected by conductor lines.
基板４１は保護基板５１．５１と共に接着剤によって互
いに直接接触しないように距離を保って固着され、密閉
された振動空間を形成する。The substrate 41 and the protective substrates 51 and 51 are fixed together with an adhesive at a distance so as not to come into direct contact with each other, thereby forming a sealed vibration space.
第７図にフィルタ５０の外観を示す。フィルタ５０の左
右の端部及び中央部にそれぞれ外部入出力端子（Ａ），
（Ｂ）並びに外部共通端子（Ｃ）が形成されている。入
出力端子（Ａ）には入出力引出し電極４２が接続され、
他方の入出力端子（Ｂ）には入出力引出し電極４３が接
続されている。共通端子（Ｃ）には４４が接続されてい
る。FIG. 7 shows the appearance of the filter 50. External input/output terminals (A) are provided at the left and right ends and the center of the filter 50, respectively.
(B) and an external common terminal (C) are formed. An input/output extraction electrode 42 is connected to the input/output terminal (A),
An input/output extraction electrode 43 is connected to the other input/output terminal (B). 44 is connected to the common terminal (C).
従って、このフィルタ５０が構或する電気回路は第８図
に示す回路となる。フィルタ部Ｆ１とＦ２がコンデンサ
部Ｃ１を間において入出力信号線路と共通信号線路との
間に並列に挿入されている。Therefore, the electric circuit constituted by this filter 50 becomes the circuit shown in FIG. Filter sections F1 and F2 are inserted in parallel between the input/output signal line and the common signal line with the capacitor section C1 therebetween.
ところで、フィルタ５０の外部端子（Ａ），（Ｂ），（
Ｃ）の表面には半田付け性を良くするために一般に電解
めっき膜が形成される。この電解めっき膜を例えばバレ
ルめっき法により形成すると、外部端子（Ａ），（Ｂ）
，（Ｃ）の表面積が必ずしも等しくないため端子間で電
位差が発生し、外部端子（Ａ），（Ｂ），（Ｃ）に形成
されるめっき膜の厚さがそれぞれ異なる場合がある。そ
して、端子に形成されるめっき膜が極めて薄くなると、
部品をプリント配線板等に半田付けした際、半田くわれ
等の問題が発生する。By the way, the external terminals (A), (B), (
Generally, an electroplated film is formed on the surface of C) to improve solderability. When this electrolytic plated film is formed by, for example, barrel plating, external terminals (A) and (B)
, (C) are not necessarily equal, a potential difference occurs between the terminals, and the thicknesses of the plating films formed on the external terminals (A), (B), and (C) may differ. When the plating film formed on the terminal becomes extremely thin,
When components are soldered to a printed wiring board, etc., problems such as solder cracks occur.
そこで、本発明の課題は、製造工程の途中で所定の外部
端子を同一電位に保つことで、主として外部端子のめっ
き膜の厚さが均一な電子部品を提供することにある。Therefore, an object of the present invention is to provide an electronic component in which the thickness of the plating film on the external terminals is uniform by keeping predetermined external terminals at the same potential during the manufacturing process.
課 を解決するための手段
以上の課題を解決するため、本発明に係る電子部品の基
板は、表面に機能素子部が設けられ、外周縁部に複数個
の外部引出し電極と少なくとも前記外部引出し電極を２
個以上電気的に接続している補助共通導体路とが形成さ
れていることを特徴とする．
さらに、本発明に係る電子部品の製造方法は、（ａ）複
数個の外部端子を前記基板の各外部引出し電極に接続す
る工程と、
（ｂ）前記補助共通導体路を切断して前記外部端子を電
気的に相互に分離する工程と、
を備えたことを特徴とする。In order to solve the above problems, the substrate of the electronic component according to the present invention is provided with a functional element section on the surface, a plurality of external extraction electrodes on the outer periphery, and at least the external extraction electrodes. 2
It is characterized by the formation of an auxiliary common conductor path that is electrically connected to more than one person. Furthermore, the method for manufacturing an electronic component according to the present invention includes the steps of: (a) connecting a plurality of external terminals to each external lead electrode of the substrate; (b) cutting the auxiliary common conductor path to connect the external terminals to each external lead electrode of the substrate; The method is characterized by comprising a step of electrically separating the two from each other.
作用
以上の構成において、外部引出し電極が補助共通導体路
を介して電気的に接続されているので、この外部引出し
電極に外部端子を接続する工程後は、外部端子相互が同
電位になり、均一な電解めっきや効率が良い電気特性の
チェックを行なうことが可能となる。この状態は補助共
通導体路を切断して、外部端子を電気的に相互に分離す
る工程前まで維持される。外部端子を電気的に相互に分
離する工程後は、各機能素子部は正規の電気回路を構成
する。Function In the above configuration, the external lead electrodes are electrically connected via the auxiliary common conductor path, so after the process of connecting the external terminals to the external lead electrodes, the external terminals are at the same potential and are uniformly connected. This makes it possible to perform electrolytic plating and check electrical properties with high efficiency. This state is maintained until the step of cutting the auxiliary common conductor path and electrically isolating the external terminals from each other. After the step of electrically separating the external terminals from each other, each functional element portion constitutes a regular electrical circuit.
実施例
以下、本発明に係る電子部品の基板及びその基板を備え
た電子部品の製造方法の一実施例を説明する。EXAMPLE Hereinafter, an example of a substrate for an electronic component according to the present invention and a method for manufacturing an electronic component equipped with the substrate will be described.
第１図にエネルギー閉じ込め形の２段結合フィルタに使
用される圧電体基板１の平面図を示す。FIG. 1 shows a plan view of a piezoelectric substrate 1 used in an energy trap type two-stage coupling filter.
このＥＥ′ｇＬ体基板１は２個の多重モード・フイルタ
部Ｆｌ，Ｆ２と１個のコンデンサ部Ｃ１を備えている。This EE'gL body board 1 includes two multimode filter sections Fl and F2 and one capacitor section C1.
基板１は、Ｐｂ（ＺｒＴｉ）Ｏｎ ， ＢａＴｉＯ＝の
圧電セラミックス基板等が使用される。入出力引出し電
極２，３が基板１上面の左右端に形成され、共通引出し
電極４が基板１下面の下辺中央部に形成されている。As the substrate 1, a Pb(ZrTi)On, BaTiO= piezoelectric ceramic substrate or the like is used. Input/output extraction electrodes 2 and 3 are formed at the left and right ends of the upper surface of the substrate 1, and a common extraction electrode 4 is formed at the center of the lower side of the lower surface of the substrate 1.
フィルタ部Ｆ１は基板１の左側上面に形成されている二
つの入出力振動電極５ａ， ５ｂとこれらに対置して基
板１の下面に形成されている一つの共通振動電極６から
構成されている。同様に、フィルタ部Ｆ２は基板１の右
側上面の二つの入出力振動電極８ａ． ８ｂとこれらに
対置する一つの共通振動電極９から構成されている。The filter section F1 is composed of two input/output vibrating electrodes 5a and 5b formed on the upper left surface of the substrate 1, and one common vibrating electrode 6 formed on the lower surface of the substrate 1 in opposition to these electrodes. Similarly, the filter section F2 includes two input/output vibrating electrodes 8a. 8b and one common vibrating electrode 9 placed opposite to these.
コンデンサ部Ｃ１はフィルタ部Ｆ１とＦ２の間に位置し
、基板１の上下面に対向して形成されている容量電極７
ａ，７ｂから構成されている。The capacitor portion C1 is located between the filter portions F1 and F2, and has capacitor electrodes 7 formed facing the upper and lower surfaces of the substrate 1.
It is composed of a and 7b.
これらフィルタ部Ｆｌ，Ｆ２及びコンデンサ部Ｃ１は、
導体線路によって電気的に接続されている。さらに、入
出力引出し電極２，３は基板１の下端に形成されている
補助共通導体路１０によって接続されている。These filter sections Fl, F2 and capacitor section C1 are as follows:
electrically connected by conductor lines. Further, the input/output extraction electrodes 2 and 3 are connected by an auxiliary common conductor path 10 formed at the lower end of the substrate 1.
なお、基板１は、実際の量産工程では広面積のものを用
い、接着後に所定寸法にカットする。In the actual mass production process, a wide-area substrate 1 is used, and after bonding, it is cut into a predetermined size.
こうして準備された基板１は保護基板１１． １１と共
に接着剤によって互いに直接接触しないように距離を保
って固着され、密閉された振動空間を形成する。この後
、基板１は所定寸法にカットされ、個々のフィルタに分
割される。The substrate 1 thus prepared is the protective substrate 11. 11 and are fixed with adhesive at a distance so as not to come into direct contact with each other, forming a sealed vibration space. After this, the substrate 1 is cut to a predetermined size and divided into individual filters.
第２図にフィルタ１４の外観を示す。フィルタ１４の左
右の端部及び中央部にそれぞれ外部入出力端子（Ａ），
（Ｂ）並びに外部共通端子（Ｃ）が形成されている。端
子（Ａ）．（Ｂ），（Ｃ）はＡｇ等の導電性材料が使用
され、蒸着、スバッタ、めっき、導電性ペーストの焼付
等の手段にて形成される。入出力端子（Ａ）には入出力
引出し電極２が接続され、他方の入出力端子（Ｂ）には
入出力引出し電極３が接続されている．共通端子（Ｃ）
には共通引出し電極４と補助共通導体路１０が接続され
ている。FIG. 2 shows the appearance of the filter 14. External input/output terminals (A) are provided at the left and right ends and the center of the filter 14, respectively.
(B) and an external common terminal (C) are formed. Terminal (A). (B) and (C) are made of a conductive material such as Ag, and are formed by means such as vapor deposition, sputtering, plating, and baking of conductive paste. An input/output extraction electrode 2 is connected to the input/output terminal (A), and an input/output extraction electrode 3 is connected to the other input/output terminal (B). Common terminal (C)
A common lead electrode 4 and an auxiliary common conductor path 10 are connected to the common lead electrode 4 and the auxiliary common conductor path 10.
従って、フィルタ１４が構成する電気回路は第３図に示
す回路となる。フィルタ部Ｆ１とＦ２がコンデンサ部Ｃ
１を間に置いて入出力信号線路と共通信号線路との間に
並列に挿入されている。また、端子（Ａ），（Ｂ），（
Ｃ）は補助共通導体路１０によって接続されている。Therefore, the electric circuit constituted by the filter 14 becomes the circuit shown in FIG. Filter parts F1 and F2 are capacitor part C
1 is inserted in parallel between the input/output signal line and the common signal line. Also, terminals (A), (B), (
C) are connected by an auxiliary common conductor path 10.
こうして得られたフィルタ１４の端子（Ａ），（Ｂ），
（Ｃ）の表面上に半田付け性を良くするために、さらに
Ｎｉを下地とずるＳｎの電解めっき膜を形成する。Terminals (A), (B) of the filter 14 obtained in this way,
In order to improve solderability on the surface of (C), an electrolytic plating film of Sn with Ni as a base is further formed.
この電解めっき膜を例えばバレルめっき法により形成す
る。バレルめっき法とは球の形状をしためっき材料とフ
ィルタ１４とを導電性金属でできためっき容器に混在さ
せて投入し、このめっき容器をめっき浴槽に浸漬した状
態で容器に電流を流してフィルタ１４の端子（Ａ），（
Ｂ冫，（Ｃ）表面にめっき膜を形成する方法である。こ
のとき、端子（Ａ），（Ｂ），（Ｃ）は補助共通導体路
１０によって同電位にされるので、端子（Ａ），（Ｂ）
，（Ｃ）に形或されるめっき膜の厚さは均一となる。This electroplated film is formed by, for example, barrel plating. In the barrel plating method, a ball-shaped plating material and a filter 14 are mixed and put into a plating container made of conductive metal, and the plating container is immersed in a plating bath while an electric current is passed through the container to remove the filter. 14 terminals (A), (
(C) A method of forming a plating film on the surface. At this time, since the terminals (A), (B), and (C) are brought to the same potential by the auxiliary common conductor path 10, the terminals (A), (B), and
, (C) have a uniform thickness.
次に、電解めっき膜が形成されたフィルタ１４は、第４
図に示すように、手前側端面の一部がカッター等によっ
て切除され、切欠き１２．１２が形成される。これによ
って、補助共通導体路１０は端子（Ａ）−（Ｃ）間及び
（Ｂ）−（Ｃ）間が切断される．このとき、フィルタ１
４が構成する電気回路は第８図に示す回路と同じものと
なる。即ち、フィルタ部Ｆ１とＦ２がコンデンサ部Ｃ１
を間において入出力信号線路と共通信号線路との間に並
列に挿入されている。Next, the filter 14 on which the electrolytic plated film is formed is transferred to the fourth filter 14.
As shown in the figure, a part of the front end surface is cut off with a cutter or the like to form a notch 12.12. As a result, the auxiliary common conductor path 10 is disconnected between terminals (A) and (C) and between terminals (B) and (C). At this time, filter 1
The electric circuit constituted by 4 is the same as the circuit shown in FIG. That is, the filter parts F1 and F2 are the capacitor part C1.
are inserted in parallel between the input/output signal line and the common signal line.
こうして、フィルタ１４の完成品が得られる。In this way, a finished product of the filter 14 is obtained.
なお、本発明に係る電子部品の基板及びその基板を備え
た電子部品の製造方法は前記実施例に限定するものでは
なく、その要旨の範囲内で種々に変形することができる
。Note that the electronic component substrate and the method of manufacturing an electronic component equipped with the substrate according to the present invention are not limited to the above embodiments, and can be variously modified within the scope of the invention.
機能素子部が設けられた基板は生産性、歩留からすると
１枚で構成するのが最も好ましいが、場合によっては多
層にしてもよい。From the viewpoint of productivity and yield, it is most preferable that the substrate on which the functional element portion is provided be composed of one substrate, but it may be composed of multiple layers depending on the case.
また、補助共通導体路の切断は研磨、エッチング、溶断
等の手段を採用してもよい。又、切断は、補助共通導体
路の一部を削除するのでもよいし、全部を削除するので
もよい。Further, the auxiliary common conductor path may be cut by means such as polishing, etching, fusing, or the like. Further, the cutting may be done by removing a part or all of the auxiliary common conductor path.
さらに、前記実施例は、本発明を外部端子の電解めっき
工程を改善するために適用した例を示したが、この他に
製造工程の中間に入れられる電気特性のチェック工程を
改善するために適用してもよい。第５図に示すコイル部
し、コンデンサ部Ｃ、抵抗部Ｒの３個の機能素子部を備
えた複合電子部品の場合を説明する。基板１５には外部
引出し電極１６ａ， １６ｂ． １６ｃ， １７ａ，
１７ｂ． １７ｃが上下端に対置して形成されている。Furthermore, although the above-mentioned embodiment shows an example in which the present invention is applied to improve the electrolytic plating process for external terminals, the present invention can also be applied to improve the electrical property checking process that is inserted in the middle of the manufacturing process. You may. The case of a composite electronic component including three functional element parts, a coil part, a capacitor part C, and a resistor part R, shown in FIG. 5 will be described. The substrate 15 has external extraction electrodes 16a, 16b. 16c, 17a,
17b. 17c are formed opposite to each other at the upper and lower ends.
補助共通導体路１８ａ， １８ｂは基板１５の下端に形
成され、引出しｔ極ｉ ７ａ−１ ７ｂ間及び１７ｂ−
１７Ｃ間を接続している。この基板１５に備えられた３
個の機能素子部の電気特性をチェックする場合、従来は
共通導体路１８ａ． Ｌ８ｂが形成されていなかったの
で、外部引出し電極１６ａ〜１７ｃの合計６箇所にそれ
ぞれチェック端子を配置して検査しなければならなかっ
た。しかし、本発明を適用すれば、補助共通導体路１
８ａ． １８ｂによって同一電位化された引出レ電極１
７ａ． １７ｂ， １７ｃのいずれか１箇所と各機能素
子部の引出し電極１６ａ． １６ｂ． １６ｃにそれぞ
れ１箇所の合計４箇所にチェック端子を配置して検査す
ればよく、チェック端子の数が少なくてすみ、効率の良
い検査ができる。The auxiliary common conductor paths 18a, 18b are formed at the lower end of the substrate 15, and are connected between the lead-out t-poles i 7a-1 7b and 17b-
Connects between 17C. 3 provided on this board 15
Conventionally, when checking the electrical characteristics of the functional element portions of the common conductor paths 18a. Since L8b was not formed, check terminals had to be placed at each of six locations on the external lead electrodes 16a to 17c for inspection. However, if the present invention is applied, the auxiliary common conductor path 1
8a. Lead-out electrode 1 brought to the same potential by 18b
7a. 17b, 17c and the extraction electrode 16a of each functional element section. 16b. It is sufficient to arrange check terminals at a total of four locations, one on each of the terminals 16c, for inspection, which simplifies the number of check terminals and enables efficient inspection.
こうして電気特性がチェックされた基板１５は製品とし
て完成する直前に、補助共通導体路１８ａ，１８ｂが切
断され、相互に独立した単一機能素子部を有する電子都
品となる。Immediately before the board 15 whose electrical characteristics have been checked in this manner is completed as a product, the auxiliary common conductor paths 18a and 18b are cut off, and the board 15 becomes an electronic product having mutually independent single functional element sections.
発明の効果
本発明によれば、補助共通導体路を介して外部端子相互
間が同電位となり、しかもこの状態は外部端子のめっき
が完了し、補助導体路が切断される前まで維持されるの
で外部端子のめっき膜の厚さが均一な電子部品が得られ
る。Effects of the Invention According to the present invention, the external terminals are at the same potential through the auxiliary common conductor path, and this state is maintained until the plating of the external terminals is completed and before the auxiliary conductor path is cut. An electronic component with a uniform thickness of the plating film on the external terminal can be obtained.
また、第５図に示すような回路構成にすれば、製造工程
の中間に行なわれる電気特性のチェックを効率良く行な
うことができる。Furthermore, if the circuit configuration is as shown in FIG. 5, the electrical characteristics can be efficiently checked during the manufacturing process.
第１図は本発明の一実施例である電子部品の基板を示す
平面図、第２図は補助共通導体路切断前の電子部品の外
観を示す斜視図、第３図はその電気等価回路図、第４図
は補助共通導体路切断後の電子部品の外観を示す斜視図
である。第５図は本発明の他の実施例の説明図である．
第６図は従来の電子部品の基板を示す平面図、第７図は
従来の電子部品の外観を示す斜視図、第８図はその電気
等価回路図である。
１・・・基板（圧電体基板）、２．３・・・外部引出し
電極（入出力引出し電極）、４・・・外部引出し電極（
共通引出し電極）、１０・・・補助共通導体路、１４・
・・電子部品（フィルタ）、１５・・・基板、１６ａ，
１６ｂ． １６ｃ，１７ａ．１７ｂ．１７ｃ ・−外
部引出し電極、１８ａ，１８ｂ ＝補助共通導体路、（
Ａ），（Ｂ），（Ｃ）・・・外部端子、Ｌ・・・機能素
子部（コイル部）、Ｃ・・・機能素子部（コンデンサ部
）、Ｒ・・・機能素子部（抵抗部）、Ｆ１．Ｆ２・・・
機能素子部（フィルタ部）、Ｃ１・・・機能素子部（コ
ンデンサ部）。Fig. 1 is a plan view showing a board of an electronic component which is an embodiment of the present invention, Fig. 2 is a perspective view showing the external appearance of the electronic part before cutting the auxiliary common conductor path, and Fig. 3 is its electrical equivalent circuit diagram. , FIG. 4 is a perspective view showing the external appearance of the electronic component after cutting the auxiliary common conductor path. FIG. 5 is an explanatory diagram of another embodiment of the present invention.
FIG. 6 is a plan view showing a board of a conventional electronic component, FIG. 7 is a perspective view showing the external appearance of the conventional electronic component, and FIG. 8 is an electrical equivalent circuit diagram thereof. 1... Substrate (piezoelectric substrate), 2.3... External extraction electrode (input/output extraction electrode), 4... External extraction electrode (
common extraction electrode), 10... auxiliary common conductor path, 14.
...Electronic component (filter), 15... Board, 16a,
16b. 16c, 17a. 17b. 17c - external extraction electrode, 18a, 18b = auxiliary common conductor path, (
A), (B), (C)...External terminal, L...Functional element part (coil part), C...Functional element part (capacitor part), R...Functional element part (resistance part) ), F1. F2...
Functional element section (filter section), C1... Functional element section (capacitor section).
Claims (2)
外部引出し電極と少なくとも前記外部引出し電極を２個
以上電気的に接続している補助共通導体路とが形成され
ていることを特徴とする電子部品の基板。1. A functional element portion is provided on the surface, and a plurality of external extraction electrodes and an auxiliary common conductor path electrically connecting at least two or more of the external extraction electrodes are formed on the outer peripheral edge. Substrates for electronic components.
出し電極に接続する工程と、前記補助共通導体路を切断
して前記外部端子を電気的に相互に分離する工程と、を
備えたことを特徴とする電子部品の製造方法。2. The method further comprises the steps of: connecting a plurality of external terminals to each external extraction electrode of the substrate according to claim 1; and cutting the auxiliary common conductor path to electrically separate the external terminals from each other. A method of manufacturing an electronic component characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1234043A JPH0397279A (en) | 1989-09-09 | 1989-09-09 | Board for electronic component and manufacture of the component having the board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1234043A JPH0397279A (en) | 1989-09-09 | 1989-09-09 | Board for electronic component and manufacture of the component having the board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397279A true JPH0397279A (en) | 1991-04-23 |
Family
ID=16964676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1234043A Pending JPH0397279A (en) | 1989-09-09 | 1989-09-09 | Board for electronic component and manufacture of the component having the board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397279A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013005483A1 (en) * | 2011-07-07 | 2013-01-10 | 株式会社村田製作所 | Electronic component and method for producing same |
| JP2016149424A (en) * | 2015-02-12 | 2016-08-18 | Tdk株式会社 | Stack penetration capacitor |
| JP2016149426A (en) * | 2015-02-12 | 2016-08-18 | Tdk株式会社 | Stack penetration capacitor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148489A (en) * | 1979-05-08 | 1980-11-19 | Fujitsu Ltd | Method of fabricating printed circuit board |
-
1989
- 1989-09-09 JP JP1234043A patent/JPH0397279A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148489A (en) * | 1979-05-08 | 1980-11-19 | Fujitsu Ltd | Method of fabricating printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013005483A1 (en) * | 2011-07-07 | 2013-01-10 | 株式会社村田製作所 | Electronic component and method for producing same |
| JP2016149424A (en) * | 2015-02-12 | 2016-08-18 | Tdk株式会社 | Stack penetration capacitor |
| JP2016149426A (en) * | 2015-02-12 | 2016-08-18 | Tdk株式会社 | Stack penetration capacitor |
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