JPH0396075U - - Google Patents
Info
- Publication number
- JPH0396075U JPH0396075U JP470190U JP470190U JPH0396075U JP H0396075 U JPH0396075 U JP H0396075U JP 470190 U JP470190 U JP 470190U JP 470190 U JP470190 U JP 470190U JP H0396075 U JPH0396075 U JP H0396075U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- surface pattern
- multilayer printed
- back surface
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP470190U JPH0396075U (US07943777-20110517-C00090.png) | 1990-01-22 | 1990-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP470190U JPH0396075U (US07943777-20110517-C00090.png) | 1990-01-22 | 1990-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396075U true JPH0396075U (US07943777-20110517-C00090.png) | 1991-10-01 |
Family
ID=31508435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP470190U Pending JPH0396075U (US07943777-20110517-C00090.png) | 1990-01-22 | 1990-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396075U (US07943777-20110517-C00090.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994023556A1 (en) * | 1993-03-31 | 1994-10-13 | Fanuc Ltd | Multilayer printed board |
| JPH08148839A (ja) * | 1994-11-21 | 1996-06-07 | Nippondenso Co Ltd | 混成集積回路装置 |
| JP2007036050A (ja) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | 積層回路基板の製造方法 |
| JP2013518443A (ja) * | 2010-01-26 | 2013-05-20 | クアルコム，インコーポレイテッド | 熱管理のための微細加工されたピラーフィン |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158297A (ja) * | 1984-08-29 | 1986-03-25 | 沖電気工業株式会社 | 多層印刷配線板 |
| JPS63314858A (ja) * | 1987-06-18 | 1988-12-22 | Ibiden Co Ltd | 表面実装部品用パッケ−ジ |
-
1990
- 1990-01-22 JP JP470190U patent/JPH0396075U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158297A (ja) * | 1984-08-29 | 1986-03-25 | 沖電気工業株式会社 | 多層印刷配線板 |
| JPS63314858A (ja) * | 1987-06-18 | 1988-12-22 | Ibiden Co Ltd | 表面実装部品用パッケ−ジ |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994023556A1 (en) * | 1993-03-31 | 1994-10-13 | Fanuc Ltd | Multilayer printed board |
| JPH08148839A (ja) * | 1994-11-21 | 1996-06-07 | Nippondenso Co Ltd | 混成集積回路装置 |
| JP2007036050A (ja) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | 積層回路基板の製造方法 |
| JP2013518443A (ja) * | 2010-01-26 | 2013-05-20 | クアルコム，インコーポレイテッド | 熱管理のための微細加工されたピラーフィン |
| US8877563B2 (en) | 2010-01-26 | 2014-11-04 | Qualcomm Incorporated | Microfabricated pillar fins for thermal management |
