JPH0395999A - Semiconductor device - Google Patents

Abstract

PURPOSE:To mount a semiconductor chip with extremely simple alignment by forming a conductor circuit pattern, using a laminate of two-layer structure obtained by forming metallic film layer at the surface of a transparent insulating film, and applying transparent insulating resin on the metallic foil and drying it. CONSTITUTION:A tape carrier is prepared, wherein plating 4 is applied on the surface of the conductor pattern of a flexible substrate consisting of a transparent insulator 1 and a conductor 2. This tape carrier is placed, with the conductor pattern down, on a semiconductor chip 5 where bumps reformed on the topside, and the positions of the bumps 6 on the chip and the tips of the inner leads 3 of the conductor patterns are aligned. Successively, a bonding tool 7 is applied from the side of the insulator 1, and is heated and pressed so as to connect the semiconductor chip 5 to the conductor pattern. By using a transparent insulator for a tape carrier this way, the alignment becomes easy as the semiconductor chip and the conductor pattern are visible through the insulator, and it becomes possible to mount the semiconductor chip 5 extremely accurately.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a tape carrier with a semiconductor chip mounted thereon.
Concerning tape carrier type semiconductor devices. [Prior art] In recent years, tape carrier type devices have been seen as promising for devices using semiconductors such as displays and electronic computers due to their miniaturization, thinness, and high density. However, conventional tape carriers have the drawbacks of complicated manufacturing processes as it is necessary to form inner leads that protrude into device holes, poor yields due to unstable lead deformation, and extremely high costs. there were. In order to solve these problems, the present inventors have previously invented and disclosed a method for mounting a semiconductor chip without restricting the leads that protrude into the device hole. As shown in Figure 1, first, a semiconductor chip (5) with bumps (6) formed on the top surface is attached to a conductor pattern formed on a flexible substrate consisting of an insulator (1) and a conductor (2). Align the position down. Thereafter, the bonding tool (7) is brought into contact with the insulator from the side of the insulator, and the tips of the inner leads (3) of the conductor pattern and the bumps (6) on the semiconductor chip are heated and pressurized through the insulator (1). A semiconductor chip (5) is mounted and a tape carrier type semiconductor device is completed.

With this method, there is no need to form device holes;
However, since it requires fewer steps and does not cause defects such as deformation of the conductor leads protruding into the device hole, the yield is high, the cost is low, and the reliability of the connection part is high. The insulator that makes up this tape carrier is often made of a dark polyimide resin with high heat resistance. Accurately aligning the semiconductor chip and the conductor pattern through this insulator is essential for the semiconductor chip. This is extremely difficult because it is difficult to see the connection between the conductor pattern and the conductor pattern, which has the disadvantage of causing misalignment. [Problems to be Solved by the Invention] The present invention has been made as a result of various studies in view of these drawbacks of the prior art, and its purpose is to provide a high-yield and highly reliable An object of the present invention is to provide a tape carrier type semiconductor device.

[Means to solve the problem]

That is, the present invention aligns a semiconductor chip face-down to a conductor pattern formed on a flexible substrate made of a flexible insulator and a conductor, and abuts a bonding tool from the insulator side. In a tape carrier type semiconductor device equipped with a semiconductor chip, the tape carrier is made of transparent insulator by heating and pressurizing the tip of the inner lead of the conductor pattern and the connection part of the semiconductor chip through an insulator. A thin metal film layer is formed on the surface of the conductive film by physical or chemical methods, and the tape carrier is a conductive material using a two-layered laminate obtained by coating and drying a transparent insulating resin. This article relates to a tape carrier type semiconductor device characterized by a circuit pattern that is well-defined. The present invention will be explained in detail below with reference to the drawings. Figure 1 shows
1 is a cross-sectional view of a main part showing a method for manufacturing a semiconductor device according to the present invention. A tape carrier is prepared on a flexible substrate consisting of a transparent insulator (1) and a conductor (2), with the surface of a conductor bag formed by a method such as photo-etching and plated (4). With the conductor pattern of this tape carrier facing down, place it on top of the semiconductor chip (5) with bumps (6) formed on the top side, and connect the bumps (6) on the chip and the inner leads of the conductor pattern. Align the position with the tip of (3). Next, a bonding tool (7) is applied from the insulator (1) side, and the semiconductor chip (5) is connected to the conductive pattern by applying heat and pressure. In this way, by using a transparent insulator for the tape carrier, the semiconductor chip and conductor pattern can be seen through the insulator, making alignment easier and making it possible to mount the semiconductor chip (5) with extremely high precision. becomes.
It would also be more effective to provide alignment marks on the semiconductor chip or tape carrier. The transparent insulator (1) used in the present invention includes:
Because heat and pressure are applied through this, it is desirable to use a film or resin with high heat resistance, such as Sumiresin Excel C.
RC-6 0 6 2 (LS manufactured by Sumitomo Beikkulite Co., Ltd.)
IXEF-33/44 (manufactured by Hoechst Celanese), Sewarako Fine SP-910 (manufactured by Toray Industries), Pyralin P
I-2566 (manufactured by DuPont), PIX-1200 (
(manufactured by Nitto Denko Corporation), Sunever 100 (manufactured by Nissan Chemical Co., Ltd.), etc. can be used, and it is preferable that it be as thin as possible.

The conductor (2) used in the present invention is not particularly limited as long as it is normally used in flexible substrates, such as copper or aluminum. Furthermore, the material of the plating (4) applied on the surface of the conductor pattern is not particularly limited, but gold, tin, solder, etc. are preferable depending on the material of the bumps (6) on the semiconductor chip. .

The bonding tool (7) used in the present invention is not particularly limited as long as it is one that is normally used for mounting semiconductors.
A better effect can be obtained if heat and pressure can be applied to a lead load or higher and the parallelism with the semiconductor chip is 5 μm or less.

Thus, the present invention does not require a device hole.
It is possible to eliminate the drawback of new film carrier type semiconductor devices, such as difficulty in aligning the semiconductor chip and conductor pattern, and to obtain highly reliable film carrier type semiconductor devices with high yield. Examples of the present invention will be shown below.

〔Example〕

Transparent resin was applied to the electrolytic W4FI with a thickness of 35 μm.Resin Excel CRC-6062 (manufactured by Sumitomo Bakelite,
Transmittance: 70% at 500 nm, 20% at 400 nm
, when the thickness was 50 μm) was coated and dried to form an insulating layer with a thickness of 50 μm to obtain a laminate with a two-layer structure. Width 3
A 5III+1 tape was slit, a circuit pattern was formed by etching the copper foil surface, and the surface was plated with 0.5 μm of gold on a nickel base of 5.0 μm to obtain a tape carrier. Next, the connection gold bumps formed on the semiconductor chip and the tips of the inner leads of the circuit pattern of the tape carrier are aligned from the surface through the insulating resin layer, and a bonding tool is used to bond them through the insulating resin layer. , 430° C., 1 second, and 100 g/lead load.

When the obtained semiconductor device was inspected for misalignment between the inner leads and the bumps on the semiconductor chip, the misalignment between the inner leads and the bumps on the semiconductor chip was found to be about 8 μm at most, and there were no defects such as short circuits with adjacent electrodes.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to overcome the drawback of the conventional tape carrier type semiconductor device without device holes, which is that it is difficult to align the semiconductor chip and the tip of the inner lead. Semiconductor chips can be mounted with alignment, and as a result, it is possible to obtain a semiconductor device with high yield and high reliability.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part showing a method for manufacturing a semiconductor device according to the present invention. Figure l

Claims (1)

[Claims] (1) Align the semiconductor chip face-down to a conductor pattern formed on a flexible substrate made of a flexible insulator and conductor, and contact the bonding tool from the insulator side to insulate the In a tape carrier-type semiconductor device with a semiconductor chip mounted thereon, the tape carrier is made of a transparent insulating film by heating and pressurizing the tip of the inner lead of the conductor pattern and the connection part of the semiconductor chip through the body. A conductive circuit pattern is created by forming a metal thin film layer on the surface of the metal foil by a physical or chemical method, or by applying a transparent insulating resin on the metal foil and drying it. A tape carrier type semiconductor device, characterized in that it is formed of a tape carrier type semiconductor device.