JPH0395661U - - Google Patents

Info

Publication number
JPH0395661U
JPH0395661U JP1990002096U JP209690U JPH0395661U JP H0395661 U JPH0395661 U JP H0395661U JP 1990002096 U JP1990002096 U JP 1990002096U JP 209690 U JP209690 U JP 209690U JP H0395661 U JPH0395661 U JP H0395661U
Authority
JP
Japan
Prior art keywords
slits
large number
lead frame
semiconductors
partitioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990002096U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002096U priority Critical patent/JPH0395661U/ja
Publication of JPH0395661U publication Critical patent/JPH0395661U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990002096U 1990-01-12 1990-01-12 Pending JPH0395661U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002096U JPH0395661U (de) 1990-01-12 1990-01-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002096U JPH0395661U (de) 1990-01-12 1990-01-12

Publications (1)

Publication Number Publication Date
JPH0395661U true JPH0395661U (de) 1991-09-30

Family

ID=31505977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002096U Pending JPH0395661U (de) 1990-01-12 1990-01-12

Country Status (1)

Country Link
JP (1) JPH0395661U (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117819A (ja) * 2007-10-16 2009-05-28 Toshiba Corp 半導体装置とそれに用いられるリードフレーム
JP2015070161A (ja) * 2013-09-30 2015-04-13 ローム株式会社 リードフレーム、半導体装置および半導体装置の製造方法
JP2019071488A (ja) * 2019-02-06 2019-05-09 ローム株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945192A (de) * 1972-09-06 1974-04-30
JPS61279160A (ja) * 1985-06-05 1986-12-09 Sumitomo Electric Ind Ltd リ−ドフレ−ム
JPH01161743A (ja) * 1987-12-17 1989-06-26 Toshiba Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945192A (de) * 1972-09-06 1974-04-30
JPS61279160A (ja) * 1985-06-05 1986-12-09 Sumitomo Electric Ind Ltd リ−ドフレ−ム
JPH01161743A (ja) * 1987-12-17 1989-06-26 Toshiba Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117819A (ja) * 2007-10-16 2009-05-28 Toshiba Corp 半導体装置とそれに用いられるリードフレーム
JP2015070161A (ja) * 2013-09-30 2015-04-13 ローム株式会社 リードフレーム、半導体装置および半導体装置の製造方法
JP2019071488A (ja) * 2019-02-06 2019-05-09 ローム株式会社 半導体装置

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