JPH0395661U - - Google Patents

Info

Publication number
JPH0395661U
JPH0395661U JP1990002096U JP209690U JPH0395661U JP H0395661 U JPH0395661 U JP H0395661U JP 1990002096 U JP1990002096 U JP 1990002096U JP 209690 U JP209690 U JP 209690U JP H0395661 U JPH0395661 U JP H0395661U
Authority
JP
Japan
Prior art keywords
slits
large number
lead frame
semiconductors
partitioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990002096U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002096U priority Critical patent/JPH0395661U/ja
Publication of JPH0395661U publication Critical patent/JPH0395661U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例に係るリードフレー
ムの斜視図、第２図は同じくリードフレームにお
けるペレツトの支持部付近の部分拡大平面図、第
３図は本考案の他の実施例に係るリードフレーム
におけるペレツトの支持部付近の部分拡大平面図
、第４図は従来のリードフレームの平面図である
。 ４……半導体ペレツト、６，１２……リードフ
レーム、９……インナーリード、９ａ……端部、
１０，１３……支持部。 Fig. 1 is a perspective view of a lead frame according to an embodiment of the present invention, Fig. 2 is a partially enlarged plan view of the vicinity of the pellet supporting portion in the lead frame, and Fig. 3 is a perspective view of a lead frame according to another embodiment of the present invention. FIG. 4 is a partially enlarged plan view of the vicinity of the pellet supporting portion in the lead frame, and is a plan view of a conventional lead frame. 4... Semiconductor pellet, 6, 12... Lead frame, 9... Inner lead, 9a... End part,
10, 13...Support part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属平板上の一点より多数のスリツトを放射状
に延在させかつこのスリツトの中間部ないし他端
部を互いに平行に延在させ、各スリツトによつて
区画された多数のリードの遊端部に半導体ペレツ
トをマウントする支持部を配置したことを特徴と
するリードフレーム。 A large number of slits are made to extend radially from one point on a flat metal plate, and the intermediate or other end portions of the slits are made to extend parallel to each other, and semiconductors are attached to the free ends of a large number of leads partitioned by each slit. A lead frame characterized by having a support section for mounting pellets.
JP1990002096U 1990-01-12 1990-01-12 Pending JPH0395661U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002096U JPH0395661U (en) 1990-01-12 1990-01-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002096U JPH0395661U (en) 1990-01-12 1990-01-12

Publications (1)

Publication Number Publication Date
JPH0395661U true JPH0395661U (en) 1991-09-30

Family

ID=31505977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002096U Pending JPH0395661U (en) 1990-01-12 1990-01-12

Country Status (1)

Country Link
JP (1) JPH0395661U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117819A (en) * 2007-10-16 2009-05-28 Toshiba Corp Semiconductor device and lead frame used for the same
JP2015070161A (en) * 2013-09-30 2015-04-13 ローム株式会社 Lead frame, semiconductor device, and method of manufacturing semiconductor device
JP2019071488A (en) * 2019-02-06 2019-05-09 ローム株式会社 Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945192A (en) * 1972-09-06 1974-04-30
JPS61279160A (en) * 1985-06-05 1986-12-09 Sumitomo Electric Ind Ltd Lead frame
JPH01161743A (en) * 1987-12-17 1989-06-26 Toshiba Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945192A (en) * 1972-09-06 1974-04-30
JPS61279160A (en) * 1985-06-05 1986-12-09 Sumitomo Electric Ind Ltd Lead frame
JPH01161743A (en) * 1987-12-17 1989-06-26 Toshiba Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117819A (en) * 2007-10-16 2009-05-28 Toshiba Corp Semiconductor device and lead frame used for the same
JP2015070161A (en) * 2013-09-30 2015-04-13 ローム株式会社 Lead frame, semiconductor device, and method of manufacturing semiconductor device
JP2019071488A (en) * 2019-02-06 2019-05-09 ローム株式会社 Semiconductor device

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