JPH0393289A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0393289A JPH0393289A JP23096889A JP23096889A JPH0393289A JP H0393289 A JPH0393289 A JP H0393289A JP 23096889 A JP23096889 A JP 23096889A JP 23096889 A JP23096889 A JP 23096889A JP H0393289 A JPH0393289 A JP H0393289A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed wiring
- rosin
- soldering
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims abstract 6
- 239000011241 protective layer Substances 0.000 claims abstract 3
- -1 aromatic amine hydrochloride Chemical class 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 11
- 238000005476 soldering Methods 0.000 abstract description 11
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 4
- 150000004982 aromatic amines Chemical class 0.000 abstract 2
- 238000007605 air drying Methods 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器の組立時に使用するプリント配線板
に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board used when assembling electronic equipment.
従来の技術
従来、プリント配線板には、銅系の導体を、前記配線板
の片面，両面およびスルーホールとして形成している。2. Description of the Related Art Conventionally, copper-based conductors have been formed on one side, both sides of the wiring board, and as through holes in printed wiring boards.
この導体は、通常放置状態でも、発銹し易く、被はんだ
付け性を急速に失なう。その解決策として、鉛一鉛はん
だの共晶合金またはそれに近い組成比のものを、はんだ
ディップ，はんだディップとオイルフユージング，！気
めっきなどの方法で，約１５ミクロンの厚さのはんだめ
っき層を形成している。This conductor is susceptible to rusting even when left unused, and rapidly loses its solderability. As a solution, use a lead-lead solder eutectic alloy or one with a composition ratio close to it, using solder dip, solder dip, and oil fusing! A solder plating layer approximately 15 microns thick is formed using a method such as air plating.
発明が解決しようとする課題
しかしながら、はんだ付けの加熱直前での予備加熱を、
大気中で行なうに際し、このはんだ面が酸化され、錫の
酸化物を生じる。この酸化物層は表面に存在し易く、又
溶融温度が高目にシフトしているので後続するはんだ付
け加熱によっても融けに＜＜、大きな部品実装上の障碍
となっている。後続する２６０℃のディップソルダリン
グや、加熱温度の低い２１５℃のりフロウソルダリング
ではこれらの障碍は一段と大きくなる。Problems to be Solved by the Invention However, it is difficult to perform preheating immediately before heating for soldering.
When carried out in the atmosphere, this solder surface is oxidized, producing tin oxide. This oxide layer tends to exist on the surface, and since the melting temperature has shifted to a higher level, it does not melt even during the subsequent soldering heat, creating a major obstacle in mounting components. These obstacles become even greater in the subsequent dip soldering at 260°C and glue flow soldering at 215°C at a lower heating temperature.
課題を解決するための手段
本発明は、前記の障碍の原因を除去するものであって、
具体的には、はんだめっき層はそのままで，樹脂コーテ
ィングを重ねて付着したものであって、樹脂コーティン
グの種類は、ロジンまたは合成口ジンと重量比０．００
０５〜０．０１％の芳香族アミンの塩酸塩を含むものに
する。このコーティングは、前記はんだめっき層の大気
への鰐出を防ぐものである。Means for Solving the Problems The present invention eliminates the causes of the above-mentioned obstacles,
Specifically, the solder plating layer is left as it is, and a resin coating is layered and adhered, and the type of resin coating is rosin or synthetic resin at a weight ratio of 0.00.
0.05 to 0.01% of aromatic amine hydrochloride. This coating prevents the solder plating layer from leaking into the atmosphere.
作用
この発明によると、リフロウソルダリングによる部品の
はんだ付け工程において、予熱，主加髪を経る事による
、はんだめっき層の酸化を防ぐと共にはんだ付け温度に
おいて可熔する樹脂であって、かつはんだ付けを促進す
る。According to the present invention, in the soldering process of parts by reflow soldering, the resin prevents oxidation of the solder plating layer through preheating and main haircutting, and is meltable at the soldering temperature, and is promote attachment.
実施例
第１図は本発明の実施例を、その製作工程順に示した各
断面図である。第１図に示すプリント翫線用基板１の導
体２、孔ランド３、スルーホーｊＬめっき孔４等に対し
て、それらの全面又は一部にはんだめっき層５を、オイ
ルフユージング法により、厚さ１０〜１５μに形成する
。つぎにロジンまたは合成ロジンおよび芳香族アミンの
塩酸塩を含む樹脂溶液（メチルエチルケトン４０、エダ
ノール６０体積パーセント）に、２〜３秒浸漬して引き
上げる。約７０〜７５℃の温度で風乾し、指触できる樹
脂コート層６を生成する。この時、厚さは、５〜６ミク
ロンである。Embodiment FIG. 1 is a cross-sectional view showing an embodiment of the present invention in the order of its manufacturing steps. A solder plating layer 5 is applied to the entire surface or part of the conductor 2, hole land 3, through-hole JL plating hole 4, etc. of the printed wire board 1 shown in FIG. 1 by oil fusing. Form to a thickness of 10 to 15 μm. Next, it is immersed in a resin solution (methyl ethyl ketone 40, edanol 60 volume percent) containing rosin or synthetic rosin and an aromatic amine hydrochloride for 2 to 3 seconds and then pulled up. It is air-dried at a temperature of about 70-75°C to produce a resin coat layer 6 that can be touched. At this time, the thickness is 5 to 6 microns.
はんだ付け性の判定基準として、拡がり率がある。ＪＩ
Ｓ規格による拡がり率試験法は、予熱１５０℃，５分、
リフロウ２１０℃，１０秒を２回繰り返したときの拡が
り率をパーセントで表わす。Spreading rate is a criterion for determining solderability. J.I.
The spreading rate test method according to the S standard is preheating at 150°C for 5 minutes.
The spreading rate when reflowing at 210° C. for 10 seconds is repeated twice is expressed as a percentage.
次に本願発明におけるハロゲン系添加剤の効果を調べて
、次表に示した。Next, the effects of the halogen additive in the present invention were investigated and are shown in the following table.
発明の効果
本発明によると、芳香族アミン塩酸塩は、加熱後もはん
だめっき層の被はんだ付け性を維持している。実用上拡
がり率８０％以上が使用可で、同９０％以上が良、およ
び同９５％以上は優良状態である。サーフェイスマウン
ト部品のはんだ付けをリフロウソルダリングの標準温度
２１５℃で、安定におこなうことができる。はんだペー
ストをリフロウ直前に追加使用した場合には、適合性は
様々であるが、市販品の多くは使用できる。但しはんだ
付け性の改良というより、部品端子側へのはんだ増量の
効果とみるべきである。Effects of the Invention According to the present invention, the aromatic amine hydrochloride maintains the solderability of the solder plating layer even after heating. In practical use, a spread rate of 80% or more is usable, a spread rate of 90% or more is good, and a spread rate of 95% or more is excellent. Surface mount parts can be soldered stably at the standard reflow soldering temperature of 215°C. When additional solder paste is used immediately before reflow, many commercially available products can be used, although compatibility varies. However, rather than improving solderability, this should be seen as an effect of increasing the amount of solder on the component terminal side.
第１図は本発明の実施例を詳しく示した製作工程順断面
図である。
１・・・・・・プリント配線板用基板、２・・・・・・
導体、３・・・・・・ランド、４・・・；・・スルーホ
ールめっき孔、５・・・・・・はんだめっき、６・・・
・・・スルーホールめっきなし孔、７・・・・・・樹脂
コート。FIG. 1 is a sectional view showing an example of the present invention in detail in the order of manufacturing steps. 1... Printed wiring board substrate, 2...
Conductor, 3...Land, 4...Through-hole plating hole, 5...Solder plating, 6...
...Through hole, unplated hole, 7...Resin coat.
Claims (1)
又は合成ロジン、および、重量比０．０００５〜０．０
１パーセントの芳香族アミンの塩酸塩を含む保護層を重
ねて形成したことを特徴とするプリント配線板。Rosin or synthetic rosin and a weight ratio of 0.0005 to 0.0 to the printed wiring board on which the solder layer is formed.
A printed wiring board characterized by forming protective layers containing 1% aromatic amine hydrochloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23096889A JPH0393289A (en) | 1989-09-06 | 1989-09-06 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23096889A JPH0393289A (en) | 1989-09-06 | 1989-09-06 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0393289A true JPH0393289A (en) | 1991-04-18 |
Family
ID=16916145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23096889A Pending JPH0393289A (en) | 1989-09-06 | 1989-09-06 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0393289A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231595A (en) * | 1984-04-28 | 1985-11-18 | Nippon Genma:Kk | Flux for soldering |
-
1989
- 1989-09-06 JP JP23096889A patent/JPH0393289A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231595A (en) * | 1984-04-28 | 1985-11-18 | Nippon Genma:Kk | Flux for soldering |
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