JPH0392768U - - Google Patents
Info
- Publication number
- JPH0392768U JPH0392768U JP15215789U JP15215789U JPH0392768U JP H0392768 U JPH0392768 U JP H0392768U JP 15215789 U JP15215789 U JP 15215789U JP 15215789 U JP15215789 U JP 15215789U JP H0392768 U JPH0392768 U JP H0392768U
- Authority
- JP
- Japan
- Prior art keywords
- target
- substrate holder
- parallel
- holding surface
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第１図は本考案の実施例を示す要部の部分断面
を含む正面図、第２図は本考案における基板ホル
ダーの変更例を示す部分断面を含む正面図である
。第３図は従来のスパツタリング装置の要部の部
分断面を含む正面図、第４図は第３図における基
板ホルダーの下面図である。
１……ターゲツト、６……ワーク、８，８′…
…基板ホルダー、９，１１……ワーク保持面。
FIG. 1 is a front view including a partial cross section of a main part showing an embodiment of the present invention, and FIG. 2 is a front view including a partial cross section showing a modification of the substrate holder in the present invention. FIG. 3 is a front view including a partial cross section of the main parts of a conventional sputtering apparatus, and FIG. 4 is a bottom view of the substrate holder in FIG. 3. 1...Target, 6...Work, 8, 8'...
...Substrate holder, 9, 11... Work holding surface.
Claims (1)
された材料が付着するワークを保持する基板ホル
ダーを平行に対向させたものにおいて、 基板ホルダーの中央部より周辺部がターゲツト
に近付くように、基板ホルダーのワーク保持面を
ターゲツトに対して傾斜させたことを特徴とする
平行平板型スパツタリング装置。[Scope of Claim for Utility Model Registration] In a device in which a target and a substrate holder that holds a workpiece to which material sputtered from the target is attached are opposed in parallel, the peripheral portion of the substrate holder is closer to the target than the central portion, A parallel plate sputtering device characterized in that a work holding surface of a substrate holder is inclined with respect to a target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15215789U JPH0392768U (en) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15215789U JPH0392768U (en) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392768U true JPH0392768U (en) | 1991-09-20 |
Family
ID=31698432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15215789U Pending JPH0392768U (en) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392768U (en) |
-
1989
- 1989-12-28 JP JP15215789U patent/JPH0392768U/ja active Pending