JPH0389590A - Manufacture of circuit substrate fitted with thick film resistor - Google Patents
Manufacture of circuit substrate fitted with thick film resistorInfo
- Publication number
- JPH0389590A JPH0389590A JP22646489A JP22646489A JPH0389590A JP H0389590 A JPH0389590 A JP H0389590A JP 22646489 A JP22646489 A JP 22646489A JP 22646489 A JP22646489 A JP 22646489A JP H0389590 A JPH0389590 A JP H0389590A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- conductor
- thick film
- conductors
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 title abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 10
- 238000010304 firing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 abstract description 5
- 230000002706 hydrostatic effect Effects 0.000 abstract description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 abstract 2
- 229910025794 LaB6 Inorganic materials 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 230000008602 contraction Effects 0.000 abstract 1
- 238000009499 grossing Methods 0.000 description 3
- 239000011195 cermet Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えばハイブリッドＩＣ等として用いられ
る厚膜抵抗体付回路基板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a circuit board with a thick film resistor used as, for example, a hybrid IC or the like.
この種の厚膜抵抗体付回路基板は、従来は一般的に、例
えば第２図に示すように、焼成済のアルミナ基板２の表
面にＡｇ−ＰｄまたはＣｕ等を主成分とするペースト状
の導体４を印刷した後それを焼成し、その後Ｒｕ Ｏｚ
系またはＬａＢｈ系等の抵抗体（サーメット抵抗体）６
を印刷し焼成するという工程で製造していた。Conventionally, this type of circuit board with a thick film resistor is generally made of a paste-like material mainly composed of Ag-Pd or Cu, etc., on the surface of a fired alumina substrate 2, as shown in FIG. After printing the conductor 4, it is fired and then Ru Oz
Resistor (cermet resistor) such as type or LaBh type 6
It was manufactured using a process of printing and firing.
ところが、アルごす基板２上に予め形成する導体４は通
常ｌＯ〜１５μｍ程度の膜厚を有しており、この厚みが
段となるため、抵抗体６の大きさが小型に（例えば０．
５ｍｍ０程度以下に）なって行くと、導体４の上からス
クリーン印刷で形成する抵抗体６の印刷性（即ち抵抗体
６が精度良く印刷されるか否かということ）に大きな障
害になるという問題がある。However, the conductor 4 formed in advance on the aluminum substrate 2 usually has a film thickness of about 10 to 15 μm, and this thickness becomes a step, so that the size of the resistor 6 can be reduced (for example, 0.5 μm).
5 mm or less), it becomes a major problem in the printability of the resistor 6 formed by screen printing on the conductor 4 (that is, whether the resistor 6 can be printed with good accuracy). There is.
そこでこの発明は、抵抗体が小型の場合でもそれを印刷
性良く形成することができる厚膜抵抗体付回路基板の製
造方法を提供することを主たる目的とする。Therefore, the main object of the present invention is to provide a method for manufacturing a circuit board with a thick film resistor, which allows the resistor to be formed with good printability even when the resistor is small.
上記目的を達成するため、この発明の製造方法は、セラ
ミックグリーンシートを用意してその表面に導体を印刷
する工程と、この工程で得られたものをプレスして導体
印刷面を平滑化する工程と、この工程で得られたものの
セラミックグリーンシートと導体とを同時焼成する工程
と、この工程で得られたものの表面に、導体間にまたが
るように、抵抗体を印刷する工程と、その後この抵抗体
を焼成する工程とを備えることを特徴とする。In order to achieve the above object, the manufacturing method of the present invention includes a step of preparing a ceramic green sheet and printing a conductor on its surface, and a step of pressing the material obtained in this step to smooth the printed surface of the conductor. , a step of co-firing the ceramic green sheet and the conductor obtained in this step, a step of printing a resistor on the surface of the material obtained in this step so as to span between the conductors, and then a step of printing the resistor. The method is characterized by comprising a step of firing the body.
上記製造方法によれば、導体印刷面を平滑化した後にそ
の表面に抵抗体を印刷するので、従来例のような導体に
よる段差がなく、従って抵抗体が小型の場合でもそれの
印刷性は従来例の場合よりも格段に良くなる。According to the above manufacturing method, since the resistor is printed on the printed surface of the conductor after smoothing it, there is no difference in level caused by the conductor as in the conventional example. It's much better than the example case.
第１図は、この発明に係る厚膜抵抗体付回路基板の製造
方法の一例を示す工程図である。FIG. 1 is a process diagram showing an example of a method for manufacturing a circuit board with a thick film resistor according to the present invention.
まず、後述する導体４と同時焼成可能な低温焼結セラミ
ックスから戒るセラミックグリーンシート１２ｇを用意
する（第１図（Ａ））。この低温焼結セラミックスは、
より具体的には、導体４に後述するようにＡｇ−Ｐｄま
たはＣｕを用いる場合は、１０００″Ｃ以下で焼結可能
なものとする。First, 12g of ceramic green sheets made of low-temperature sintered ceramics that can be co-fired with the conductor 4, which will be described later, are prepared (FIG. 1(A)). This low temperature sintered ceramic is
More specifically, when Ag--Pd or Cu is used for the conductor 4 as described later, it can be sintered at 1000''C or less.
そのようなものの−例に、Ｓｉｎｇ ＢａＯＡＱ ２
０３系セラξツクスがある。An example of such is Sing BaOAQ 2
There is 03 series SeraTux.
そしてこのセラミックグリーンシート１２ｇの表面に、
例えばスクリーン印刷法で、焼成後のセラミック基板の
収縮を加味したパターンで、Ａｇ−ＰｄまたはＣｕ等を
主成分とするペースト状の導体４を印刷する（同図（Ｂ
））。And on the surface of this 12g ceramic green sheet,
For example, by screen printing, a paste-like conductor 4 whose main component is Ag-Pd or Cu is printed in a pattern that takes into account the shrinkage of the ceramic substrate after firing (see Fig.
)).
その後、上記工程で得られたものに剛体プレスまたは静
水圧プレス等で均一に圧力をかけてプレスして導体印刷
面を平滑化する（同図（Ｃ））。Thereafter, the material obtained in the above step is pressed by uniformly applying pressure using a rigid press, a hydrostatic press, etc. to smooth the printed surface of the conductor (FIG. 4(C)).
その後、上記工程で得られたもののセラミックグリーン
シート１２ｇと導体４とを同時焼成すると、表面に導体
４が埋め込まれたセラミック基板１２ができあがる（同
図（Ｄ））。Thereafter, the ceramic green sheet 12g obtained in the above process and the conductor 4 are co-fired to complete a ceramic substrate 12 with the conductor 4 embedded in the surface (FIG. 4(D)).
その後、上記工程で得られたセラミック基板１２の表面
に、導体４．４間にまたがるように、例えばスクリーン
印刷法で、Ｒｕ Ｏを系またはＬａＢ。Thereafter, RuO or LaB is coated on the surface of the ceramic substrate 12 obtained in the above process by, for example, screen printing, so as to span between the conductors 4.4.
系等の抵抗体（サーメット抵抗体）６を所定パターンで
印刷しく同図（Ｅ）） 、その後この抵抗体６を焼成す
る。これによって、厚膜抵抗体付回路基板が得られる。A resistor (cermet resistor) 6 is printed in a predetermined pattern (FIG. 1(E)), and then this resistor 6 is fired. As a result, a circuit board with a thick film resistor is obtained.
上記製造方法によれば、セラミック基板１２の導体印刷
面を平滑化した後にその表面に抵抗体６を印刷するので
、従来例のような導体４による段差がなく、従って抵抗
体６が小型（例えば０．５ｍｍｃｊ程度以下）の場合で
もそれの印刷性は従来例の場合よりも格段に良くなる。According to the above manufacturing method, since the resistor 6 is printed on the printed conductor surface of the ceramic substrate 12 after smoothing it, there is no step difference caused by the conductor 4 as in the conventional example, and therefore the resistor 6 is small (e.g. 0.5 mmcj or less), its printability is much better than that of the conventional example.
その結果例えば、規格外の抵抗体６が形成される割合が
減るので、抵抗形成の歩留まりが向上する。As a result, for example, the rate at which non-standard resistors 6 are formed is reduced, so the yield of resistor formation is improved.
しかも、上記製造方法ではセラミック基板１２と導体４
とを同時焼成するので、従来例に比べて焼成工程が一つ
減り、そのぶんコストダウンを図ることができる。Moreover, in the above manufacturing method, the ceramic substrate 12 and the conductor 4
Since these are fired at the same time, the number of firing steps is reduced by one compared to the conventional example, and costs can be reduced accordingly.
なお、上記例ではセラミックグリーンシート１２ｇある
いはセラミック基板１２は単板のものを図示したが、そ
れらの構成は多層板であっても良い。In the above example, the ceramic green sheet 12g or the ceramic substrate 12 is shown as a single plate, but they may have a multilayer structure.
以上のようにこの発明によれば、セラミック基板の導体
印刷面を平滑化した後にその表面に抵抗体を印刷するよ
うにしたので、従来例のような導体による段差がなく、
従って抵抗体が小型の場合でもそれの印刷性は従来例の
場合よりも格段に良くなる。As described above, according to the present invention, the resistor is printed on the surface of the ceramic substrate after smoothing it, so there is no difference in level caused by the conductor as in the conventional example.
Therefore, even if the resistor is small, its printability is much better than in the prior art.
しかも、セラミック基板と抵抗体とを同時焼成するので
、従来例に比べて焼成工程が一つ減り、そのぶんコスト
ダウンを図ることができる。Moreover, since the ceramic substrate and the resistor are fired at the same time, the number of firing steps is reduced by one compared to the conventional example, and costs can be reduced accordingly.
第１図は、この発明に係る厚膜抵抗体付回路基板の製造
方法の一例を示す工程図である。第２図は、従来の製造
方法による厚膜抵抗体付回路基板の一例を部分的に示す
断面図である。
４・・・導体、６・・・抵抗体、１２ｇ・・・セラミッ
クグリーンシート、１２・・・セラミック基板。FIG. 1 is a process diagram showing an example of a method for manufacturing a circuit board with a thick film resistor according to the present invention. FIG. 2 is a sectional view partially showing an example of a circuit board with a thick film resistor manufactured by a conventional manufacturing method. 4...Conductor, 6...Resistor, 12g...Ceramic green sheet, 12...Ceramic substrate.
Claims (1)
導体を印刷する工程と、この工程で得られたものをプレ
スして導体印刷面を平滑化する工程と、この工程で得ら
れたもののセラミックグリーンシートと導体とを同時焼
成する工程と、この工程で得られたものの表面に、導体
間にまたがるように、抵抗体を印刷する工程と、その後
この抵抗体を焼成する工程とを備えることを特徴とする
厚膜抵抗体付回路基板の製造方法。(1) The process of preparing a ceramic green sheet and printing a conductor on its surface, the process of pressing the material obtained in this process to smooth the conductor printed surface, and the ceramic green of the material obtained in this process. It is characterized by comprising the steps of simultaneously firing the sheet and the conductor, printing a resistor on the surface of the sheet obtained in this step so as to span between the conductors, and then firing the resistor. A method for manufacturing a circuit board with a thick film resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226464A JPH0834341B2 (en) | 1989-08-31 | 1989-08-31 | Method of manufacturing circuit board with thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226464A JPH0834341B2 (en) | 1989-08-31 | 1989-08-31 | Method of manufacturing circuit board with thick film resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0389590A true JPH0389590A (en) | 1991-04-15 |
| JPH0834341B2 JPH0834341B2 (en) | 1996-03-29 |
Family
ID=16845510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1226464A Expired - Lifetime JPH0834341B2 (en) | 1989-08-31 | 1989-08-31 | Method of manufacturing circuit board with thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0834341B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994016300A1 (en) * | 1993-01-15 | 1994-07-21 | Lucas Industries Public Limited Company | Force sensor |
| JP2006093352A (en) * | 2004-09-22 | 2006-04-06 | Toppan Printing Co Ltd | Printed wiring board and its manufacturing method |
| KR100897316B1 (en) * | 2007-10-26 | 2009-05-14 | 삼성전기주식회사 | Manufacturing method of PCB |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100789529B1 (en) * | 2006-11-13 | 2007-12-28 | 삼성전기주식회사 | Printed circuit board having embedded resistor and method of manufacturing the same |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4935864A (en) * | 1972-08-04 | 1974-04-03 | ||
| JPS56146202A (en) * | 1980-04-14 | 1981-11-13 | Matsushita Electric Ind Co Ltd | Glazed resistor forming porcelain substrate |
| JPS59167274A (en) * | 1983-03-14 | 1984-09-20 | Hitachi Ltd | Structure of thermal head |
| JPS61114567A (en) * | 1984-11-09 | 1986-06-02 | Nec Corp | Construction of thick film resistance and electrodes in hybrid integrated circuit |
| JPS61224390A (en) * | 1985-03-28 | 1986-10-06 | 三菱電機株式会社 | Thick film circuit board |
| JPS62219688A (en) * | 1986-03-20 | 1987-09-26 | 富士通株式会社 | Method for applying thick printed conductor |
| JPS63182887A (en) * | 1987-01-26 | 1988-07-28 | 松下電工株式会社 | Manufacture of ceramic wiring circuit board |
| JPH01140699A (en) * | 1987-11-26 | 1989-06-01 | Matsushita Electric Ind Co Ltd | Ceramic substrate and manufacture thereof |
| JPH01175293A (en) * | 1987-12-28 | 1989-07-11 | Canon Inc | Printed resistor board and manufacture thereof |
-
1989
- 1989-08-31 JP JP1226464A patent/JPH0834341B2/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4935864A (en) * | 1972-08-04 | 1974-04-03 | ||
| JPS56146202A (en) * | 1980-04-14 | 1981-11-13 | Matsushita Electric Ind Co Ltd | Glazed resistor forming porcelain substrate |
| JPS59167274A (en) * | 1983-03-14 | 1984-09-20 | Hitachi Ltd | Structure of thermal head |
| JPS61114567A (en) * | 1984-11-09 | 1986-06-02 | Nec Corp | Construction of thick film resistance and electrodes in hybrid integrated circuit |
| JPS61224390A (en) * | 1985-03-28 | 1986-10-06 | 三菱電機株式会社 | Thick film circuit board |
| JPS62219688A (en) * | 1986-03-20 | 1987-09-26 | 富士通株式会社 | Method for applying thick printed conductor |
| JPS63182887A (en) * | 1987-01-26 | 1988-07-28 | 松下電工株式会社 | Manufacture of ceramic wiring circuit board |
| JPH01140699A (en) * | 1987-11-26 | 1989-06-01 | Matsushita Electric Ind Co Ltd | Ceramic substrate and manufacture thereof |
| JPH01175293A (en) * | 1987-12-28 | 1989-07-11 | Canon Inc | Printed resistor board and manufacture thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994016300A1 (en) * | 1993-01-15 | 1994-07-21 | Lucas Industries Public Limited Company | Force sensor |
| AU687030B2 (en) * | 1993-01-15 | 1998-02-19 | Lucas Industries Public Limited Company | Force sensor |
| JP2006093352A (en) * | 2004-09-22 | 2006-04-06 | Toppan Printing Co Ltd | Printed wiring board and its manufacturing method |
| JP4529614B2 (en) * | 2004-09-22 | 2010-08-25 | 凸版印刷株式会社 | Method for manufacturing printed wiring board |
| KR100897316B1 (en) * | 2007-10-26 | 2009-05-14 | 삼성전기주식회사 | Manufacturing method of PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0834341B2 (en) | 1996-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0307878A2 (en) | Method for fabricating multilayer circuits | |
| JPH08139230A (en) | Ceramic circuit board and its manufacture | |
| JPH0389590A (en) | Manufacture of circuit substrate fitted with thick film resistor | |
| JP2556065B2 (en) | Manufacturing method of electronic component with built-in resistor | |
| EP0398572A1 (en) | Method of manufacturing a thick film resistor element | |
| JPH0396207A (en) | Manufacture of laminated ceramic electronic part | |
| JPH0697661A (en) | Manufacture of ceramics multi-layer substrate | |
| JPH0232595A (en) | Manufacture of ceramic multilayer interconnection board | |
| JPH1084184A (en) | Manufacturing method of ceramic multilayer board | |
| JP2822793B2 (en) | Magnetoresistive element and method of manufacturing the same | |
| JPH05267854A (en) | Ceramic multilayer circuit board and manufacture thereof | |
| JPH1065341A (en) | Manufacturing method of multilayer ceramic board | |
| JPS6045095A (en) | Method of producing thick film multilayer board | |
| JPH0497590A (en) | Multilayer ceramic circuit board and manufacture thereof | |
| JPH07202428A (en) | Production of multilayer circuit board | |
| JPH0786747A (en) | Manufacture of ceramic multilayer board | |
| JPH01166414A (en) | Manufacture of chip-form jumper element | |
| JP2005101471A (en) | Manufacturing method of laminated ceramic electronic component | |
| JPH02154496A (en) | Manufacture of circuit board | |
| JP2001267742A (en) | Method of manufacturing ceramic multilayer board, and conductor paste used for the same | |
| JPS61230391A (en) | Manufacture of multilayer circuit board | |
| JPS60102763A (en) | Multilayer thick film hybrid integrated circuit substrate | |
| JPH0786708A (en) | Method of manufacturing ceramic circuit board | |
| JPH05144660A (en) | Manufacture of electronic component | |
| JPH04145692A (en) | Green sheet formation for multilayer wiring ceramic board |