JPH0387209U - - Google Patents

Info

Publication number
JPH0387209U
JPH0387209U JP14779389U JP14779389U JPH0387209U JP H0387209 U JPH0387209 U JP H0387209U JP 14779389 U JP14779389 U JP 14779389U JP 14779389 U JP14779389 U JP 14779389U JP H0387209 U JPH0387209 U JP H0387209U
Authority
JP
Japan
Prior art keywords
cutting
semiconductor wafer
suction cup
holding mechanism
moves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14779389U
Other languages
English (en)
Japanese (ja)
Other versions
JPH079611Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989147793U priority Critical patent/JPH079611Y2/ja
Publication of JPH0387209U publication Critical patent/JPH0387209U/ja
Application granted granted Critical
Publication of JPH079611Y2 publication Critical patent/JPH079611Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP1989147793U 1989-12-21 1989-12-21 半導体ウエハの切断保持機構 Expired - Lifetime JPH079611Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147793U JPH079611Y2 (ja) 1989-12-21 1989-12-21 半導体ウエハの切断保持機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147793U JPH079611Y2 (ja) 1989-12-21 1989-12-21 半導体ウエハの切断保持機構

Publications (2)

Publication Number Publication Date
JPH0387209U true JPH0387209U (enrdf_load_stackoverflow) 1991-09-04
JPH079611Y2 JPH079611Y2 (ja) 1995-03-08

Family

ID=31694291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147793U Expired - Lifetime JPH079611Y2 (ja) 1989-12-21 1989-12-21 半導体ウエハの切断保持機構

Country Status (1)

Country Link
JP (1) JPH079611Y2 (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013112A (enrdf_load_stackoverflow) * 1973-01-30 1975-02-12
JPS639965A (ja) * 1986-06-30 1988-01-16 Nec Corp 半導体記憶装置の製造方法
JPS63318128A (ja) * 1987-06-19 1988-12-27 Sumitomo Electric Ind Ltd 半導体単結晶インゴツトの角度調整法と装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013112A (enrdf_load_stackoverflow) * 1973-01-30 1975-02-12
JPS639965A (ja) * 1986-06-30 1988-01-16 Nec Corp 半導体記憶装置の製造方法
JPS63318128A (ja) * 1987-06-19 1988-12-27 Sumitomo Electric Ind Ltd 半導体単結晶インゴツトの角度調整法と装置

Also Published As

Publication number Publication date
JPH079611Y2 (ja) 1995-03-08

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term