JPH038593A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH038593A JPH038593A JP1144447A JP14444789A JPH038593A JP H038593 A JPH038593 A JP H038593A JP 1144447 A JP1144447 A JP 1144447A JP 14444789 A JP14444789 A JP 14444789A JP H038593 A JPH038593 A JP H038593A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- gas
- processing machine
- laser processing
- mixed gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims abstract description 23
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract description 39
- 239000011325 microbead Substances 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 208000034656 Contusions Diseases 0.000 abstract 1
- 208000034526 bruise Diseases 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 239000002360 explosive Substances 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はノズル部よりレーザ光をワークの表面に照射し
、前記ワークを加工するレーザ加工機に関し、特にワー
クへのレーザエネルギーの注入効率を向上させたレーザ
加工機に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a laser processing machine that processes a workpiece by irradiating a laser beam onto the surface of the workpiece from a nozzle portion, and particularly relates to a laser processing machine that processes the workpiece by irradiating a laser beam from a nozzle portion onto the surface of the workpiece. Regarding an improved laser processing machine.
レーザ加工機はレーザ光を集光レンズ等によって集光し
てワークの一点に照射し、照射した部分を蒸発させてピ
アシングや切断加工を行う。一方、この蒸発によってワ
ーク表面からプラズマ状ガスが発生し、レーザ光の照射
を妨げるので、照射部分にアシストガスを噴出してプラ
ズマ状ガスを除去している。アシストガスには空気、酸
素ガス、窒素ガス等が使用され、ワークの材質に応じて
最適なものが選択される。A laser processing machine focuses laser light using a condensing lens or the like, irradiates it onto a single point on a workpiece, and evaporates the irradiated area to perform piercing or cutting. On the other hand, this evaporation generates plasma-like gas from the surface of the workpiece, which interferes with laser beam irradiation, so assist gas is ejected to the irradiated area to remove the plasma-like gas. Air, oxygen gas, nitrogen gas, etc. are used as the assist gas, and the optimal one is selected depending on the material of the workpiece.
しかし、アルミニウム等のようにレーザ光に対する反射
率が高いワークは、照射部分を蒸発させる以前の溶融段
階でレーザエネルギーの吸収に時間がかかり、切断速度
が制限されている。However, for workpieces such as aluminum that have a high reflectance to the laser beam, it takes time to absorb the laser energy in the melting stage before the irradiated portion is evaporated, which limits the cutting speed.
また、アシストガスの流量はノズルあるいは配管の圧力
構造に制限されて無闇に多くすることはできない。この
ため、従来のレーザ加工機ではプラズマ状ガスが完全に
除去できないことにより、レーザエネルギーの注入が効
率良く行えず、あまり厚いワークは切断できなかった。Further, the flow rate of the assist gas cannot be increased arbitrarily because it is limited by the pressure structure of the nozzle or piping. For this reason, conventional laser processing machines cannot completely remove the plasma-like gas, so laser energy cannot be injected efficiently, and very thick workpieces cannot be cut.
本発明はこのような点に鑑みてなされたものであり、反
射率の高いワークの切断性能を向上させるレーザ加工機
を提供することを目的とする。The present invention has been made in view of these points, and it is an object of the present invention to provide a laser processing machine that improves the cutting performance of workpieces with high reflectance.
また、厚いワークの切断を可能にするレーザ加工機を提
供することを目的とする。Another object of the present invention is to provide a laser processing machine that enables cutting of thick workpieces.
本発明では上記課題を解決するために、レーザ光をワー
クの表面に照射し、前記ワークを加工するレーザ加工機
において、前記ワークの硬度以上の所定の硬度の微細粉
体と所定の圧力の気体との混合気体を前記照射部に噴出
する噴出手段を有することを特徴とするレーザ加工機が
提供され、
また、
レーザ光をワークの表面に照射し、前記ワークを加工す
るレーザ加工機において、前記照射部より発生するプラ
ズマ状ガスによって酸化反応を起こす粉体と所定の圧力
の気体との混合気体を前記照射部に噴出する噴出手段を
有することを特徴とするレーザ加工機が提供される。In order to solve the above problems, the present invention provides a laser processing machine that processes the workpiece by irradiating the surface of the workpiece with a laser beam. There is provided a laser processing machine characterized by having a jetting means for spouting a gas mixture of There is provided a laser processing machine characterized by having a jetting means for spouting a gas mixture of powder that undergoes an oxidation reaction with a plasma-like gas generated from the irradiation part and gas at a predetermined pressure to the irradiation part.
微細粉体をアシストガスと共に噴出することにより、ワ
ーク表面に傷をつけてレーザ光の吸収率を高める。また
、急激に酸化反応を起こす粉体をアシストガスと共に噴
出することにより、粉体がプラズマ状ガスによって酸化
反応した時の爆発力でプラズマ状ガスを高速に除去して
レーザ光の貫通力を助長させる。By ejecting fine powder together with assist gas, it scratches the work surface and increases the absorption rate of laser light. In addition, by ejecting powder that rapidly undergoes an oxidation reaction together with assist gas, the explosive force generated when the powder undergoes an oxidation reaction with the plasma gas quickly removes the plasma gas and increases the penetration power of the laser beam. let
以下、本発明の一実施例を図面に基づいて説明する。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
第1図は本発明の第1の実施例のレーザ加工機の構成図
である。図において、レーザ発振器1には例えばレーザ
出力2〜3に’vVの炭酸ガスレーザ発振器が使用され
る。レーザ発振機1から出力されたレーザ光2は折り返
し鏡3で方向を変え、ノズル4内に設けられた集光レン
ズ5で集光されて、例えばアルミニウムのワーク6の切
断箇所6aに照射される。FIG. 1 is a configuration diagram of a laser processing machine according to a first embodiment of the present invention. In the figure, the laser oscillator 1 is, for example, a carbon dioxide laser oscillator with 'vV' for laser outputs 2 and 3. A laser beam 2 output from a laser oscillator 1 changes direction with a folding mirror 3, is focused by a condensing lens 5 provided in a nozzle 4, and is irradiated onto a cutting location 6a of a workpiece 6 made of aluminum, for example. .
ワーク6は移動加工テーブル7上に固定されている。移
動加工テーブル7は図示されていない数値制御装置によ
り制御されており、加工台8上のX軸方向及び紙面に垂
直なY軸方向の任意の位置に移動可能である。A workpiece 6 is fixed on a movable processing table 7. The movable processing table 7 is controlled by a numerical control device (not shown), and can be moved to any position on the processing table 8 in the X-axis direction and in the Y-axis direction perpendicular to the paper surface.
一方、混合気体供給装置10には表面に多数の凹凸を設
けた直径1〜2μmのセラミックス製のマイクロビーズ
と高圧力の窒素ガスとの混合気体11が封入されている
。また、混合気体供給装置10には図示されていない弁
があり、これがレーザ光2の照射に同期して開き、混合
気体11がノズル4の出射口12の近傍に設けられた噴
出口13より切断箇所6aに向けて噴出される。混合気
体11中のマイクロビーズ14は切断箇所6aに高速度
で衝突し、切断箇所6aには無数の細かい傷がつく。こ
の結果、切断箇所6aのレーザ光2に対する反射率が低
下して、レーザエネルギーが効率良く注入され、所要の
切断を行うことができる。On the other hand, the mixed gas supply device 10 is filled with a mixed gas 11 of ceramic microbeads having a diameter of 1 to 2 μm and having many irregularities on the surface and high-pressure nitrogen gas. The mixed gas supply device 10 has a valve (not shown) that opens in synchronization with the irradiation of the laser beam 2, and the mixed gas 11 is cut off from the jet port 13 provided near the exit port 12 of the nozzle 4. It is ejected towards the location 6a. The microbeads 14 in the gas mixture 11 collide with the cut portion 6a at high speed, resulting in countless fine scratches on the cut portion 6a. As a result, the reflectance of the cutting portion 6a with respect to the laser beam 2 is reduced, laser energy is efficiently injected, and the desired cutting can be performed.
第2図は本発明の第2の実施例のレーザ加工機の構成図
である。図において、第1図と同じ番号を付したものは
同じ機能を有するものであり、説明を省略する。FIG. 2 is a configuration diagram of a laser processing machine according to a second embodiment of the present invention. In the figure, components given the same numbers as in FIG. 1 have the same functions, and their explanation will be omitted.
レーザ光2はノズル20の出射口21より、例えば厚さ
20mrn程度の鉄板のワーク60の切断箇所60aに
照射される。高圧気体供給装置22には高圧の酸素ガス
等のアシストガス23が、粉体供給装置24には、例え
ば鉄系の強力な酸化反応を起こす粉体25が封入されて
いる。また、高圧気体供給装置22には図示されていな
い弁があり、これがレーザ光2の照射に同期して開き、
アシストガス23がノズル20の内部を通って、粉体2
5と共に出射口21から切断箇所60aに向けて噴出さ
れる。The laser beam 2 is irradiated from the exit port 21 of the nozzle 20 onto a cutting location 60a of a workpiece 60 made of an iron plate having a thickness of about 20 mrn, for example. The high-pressure gas supply device 22 is filled with an assist gas 23 such as high-pressure oxygen gas, and the powder supply device 24 is filled with, for example, iron-based powder 25 that causes a strong oxidation reaction. Further, the high-pressure gas supply device 22 has a valve (not shown), which opens in synchronization with the irradiation of the laser beam 2.
The assist gas 23 passes through the nozzle 20 and the powder 2
5 is ejected from the outlet 21 toward the cutting location 60a.
第3図はノズル20の詳細図である。ノズル20にはア
シストガス23が導入される接続口26、粉体24が導
入される接続口27a及び27b1粉体24が充填され
る小室28a及び28bが設けられている。また、小室
28a及び28bは非常に幅の狭い間隙29a及び29
bによって、出射口21の直前のレーザ光2及びアシス
トガス23が通過する通路30に接続されている。FIG. 3 is a detailed view of the nozzle 20. The nozzle 20 is provided with a connection port 26 through which the assist gas 23 is introduced, connection ports 27a and 27b through which the powder 24 is introduced, and small chambers 28a and 28b filled with the powder 24. Further, the small chambers 28a and 28b have very narrow gaps 29a and 29
b is connected to a passage 30 through which the laser beam 2 and the assist gas 23 just in front of the emission port 21 pass.
アシストガス23が通路30を高速で通過すると、この
部分の圧力が低下して粉体24は間隙29a及び29b
から吸い出され、出射口21から噴出する。When the assist gas 23 passes through the passage 30 at high speed, the pressure in this area decreases, and the powder 24 closes in the gaps 29a and 29b.
and is ejected from the outlet 21.
噴出された粉体24は切断箇所60aの付近に発生して
いるプラズマ状ガス31に触れて急激に爆発的な酸化反
応を起こす。この爆発力によってプラズマ状ガス31が
周囲に除去され、切断箇所60aに効率良くレーザエネ
ルギーが注入されて切断が行われる。The ejected powder 24 comes into contact with the plasma gas 31 generated near the cutting location 60a and rapidly causes an explosive oxidation reaction. The plasma gas 31 is removed from the surrounding area by this explosive force, and laser energy is efficiently injected into the cutting location 60a to perform cutting.
第3図は本発明の第2の実施例のレーザ加工機のノズル
部分の詳細を示した断面図である。FIG. 3 is a sectional view showing details of a nozzle portion of a laser processing machine according to a second embodiment of the present invention.
以上説明したように本発明では、微細粉体をアシストガ
スと共に噴出することにより、ワーク表面に傷をつけて
レーザ光の吸収率を高めるので、反射率の高いワークの
切断速度を増すことができ、加工時間が短縮する。As explained above, in the present invention, by ejecting fine powder together with assist gas, the surface of the workpiece is scratched and the absorption rate of laser light is increased, so it is possible to increase the cutting speed of workpieces with high reflectivity. , machining time is reduced.
また、急激に酸化反応を起こす粉体をアシストガスと共
に噴出することにより、粉体がプラズマ状ガスによって
酸化反応した時の爆発力でプラズマガスを高速に除去し
てレーザ光の貫通力を助長させるので、厚いワークの切
断が可能になる。In addition, by ejecting powder that rapidly undergoes an oxidation reaction together with assist gas, the explosive force generated when the powder undergoes an oxidation reaction with plasma-like gas removes the plasma gas at high speed and enhances the penetration power of the laser beam. This makes it possible to cut thick workpieces.
第1図は本発明の第1の実施例のレーザ加工機の構成図
、
第2図は本発明の第2の実施例のレーザ加工機の構成図
、
4.20
6.60
1
12.21
3
4
3
5
レーデ発振器
レーザ光
ノズル
ワーク
混合気体
出射口
噴出口
微細粉体
アシストガス
粉体Fig. 1 is a block diagram of a laser processing machine according to a first embodiment of the present invention, and Fig. 2 is a block diagram of a laser processing machine according to a second embodiment of the present invention. 4.20 6.60 1 12.21 3 4 3 5 Rede oscillator laser light nozzle work Mixed gas outlet outlet Fine powder Assist gas powder
Claims (7)
加工するレーザ加工機において、前記ワークの硬度以上
の所定の硬度の微細粉体と所定の圧力の気体との混合気
体を前記照射部に噴出する噴出手段を有することを特徴
とするレーザ加工機。(1) In a laser processing machine that processes the workpiece by irradiating the surface of the workpiece with a laser beam, a gas mixture of fine powder having a predetermined hardness greater than the hardness of the workpiece and gas having a predetermined pressure is applied to the irradiation section. A laser processing machine characterized by having a jetting means that jets a jet of water.
特徴とする特許請求の範囲第1項記載のレーザ加工機。(2) The laser processing machine according to claim 1, wherein the fine powder is made of ceramics.
を出射するノズル部の出射口の近傍に設けたことを特徴
とする特許請求の範囲第1項記載のレーザ加工機。(3) The laser processing machine according to claim 1, wherein the ejection port for ejecting the mixed gas is provided near the exit port of the nozzle section for emitting the laser beam.
加工するレーザ加工機において、前記照射部より発生す
るプラズマ状ガスによって酸化反応を起こす粉体と所定
の圧力の気体との混合気体を前記照射部に噴出する噴出
手段を有することを特徴とするレーザ加工機。(4) In a laser processing machine that processes the surface of a workpiece by irradiating the surface of the workpiece with laser light, a gas mixture of powder and gas at a predetermined pressure that causes an oxidation reaction by the plasma-like gas generated from the irradiation part is generated. A laser processing machine characterized by having a jetting means for jetting into the irradiation section.
とを特徴とする特許請求の範囲第4項記載のレーザ加工
機。(5) The laser processing machine according to claim 4, wherein the material constituting the powder contains at least iron.
記混合気体を噴出する噴出口を兼ねるように構成したこ
とを特徴とする特許請求の範囲第4項記載のレーザ加工
機。(6) The laser processing machine according to claim 4, wherein the exit port of the nozzle portion that emits the laser beam also serves as a jet port that jets out the mixed gas.
立して取り入れる第1の接続口及び第2の接続口と、前
記粉体と前記気体を混合して混合気体を生成する混合機
構と、前記噴出口を兼ねた出射口とを設けたことを特徴
とする特許請求の範囲第6項記載のレーザ加工機。(7) A first connection port and a second connection port that independently introduce the powder and the gas into the nozzle portion, and a mixing mechanism that mixes the powder and the gas to generate a mixed gas. 7. The laser processing machine according to claim 6, further comprising: an emitting port that also serves as the ejection port.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1144447A JPH038593A (en) | 1989-06-07 | 1989-06-07 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1144447A JPH038593A (en) | 1989-06-07 | 1989-06-07 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH038593A true JPH038593A (en) | 1991-01-16 |
Family
ID=15362445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1144447A Pending JPH038593A (en) | 1989-06-07 | 1989-06-07 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH038593A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861289A (en) * | 1990-03-16 | 1999-01-19 | Sigma-Tau Industrie Farmaceutiche Riunite S.P.A. | Heat-resistant β-galactosyltransferase, its production process and its use |
KR100351385B1 (en) * | 2000-01-07 | 2002-09-05 | 두산중공업 주식회사 | Laser cladding head |
JP2011156580A (en) * | 2010-02-03 | 2011-08-18 | Laserx:Kk | Laser beam cutting apparatus and method |
-
1989
- 1989-06-07 JP JP1144447A patent/JPH038593A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861289A (en) * | 1990-03-16 | 1999-01-19 | Sigma-Tau Industrie Farmaceutiche Riunite S.P.A. | Heat-resistant β-galactosyltransferase, its production process and its use |
KR100351385B1 (en) * | 2000-01-07 | 2002-09-05 | 두산중공업 주식회사 | Laser cladding head |
JP2011156580A (en) * | 2010-02-03 | 2011-08-18 | Laserx:Kk | Laser beam cutting apparatus and method |
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