JPS61146427A - Fluid jet machining system - Google Patents

Abstract

PURPOSE:To improve the machining speed thus to achieve highly efficient machining by providing a system for projecting laser beam in pulse while focusing to the fluid in a nozzle. CONSTITUTION:A jet nozzle 1 has squeezed tip section 1a for injecting a jet 2. An irradiation window 1e for projecting laser beam is made through the sidewall of chamber 1c where a light collection lens 3 is provided to collect the laser beam 5 produced from a laser oscillator 4 into the chamber 1c. A chopper 6 will chop the laser 5 and irradiate a pulse. A work 7 is arranged on a table 8 in machining tank 9. Motors 11, 12 will drive a machining table 8 in the direction of X-Y axis while perform positional control through NC controller 13. A pump 14 will feed working fluid to a nozzle 1 and the fluid injected through the tip 1a of nozzle is collected through a tank 9 into a storage tank 15 then fed again through a pump 14.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an improvement of a fluid jet machining device that performs machining such as drilling, cutting, and contour cutting using a fluid jet.

(Prior art) In jet machining, for example, when water is used as a medium, ice particles collide with the surface of the workpiece at a velocity V to generate a proportional pressure P, and this pressure acts on the workpiece to process it. However, there is a limit to simply using the kinetic energy of the water flow supplied from a pump, etc., and it has not been possible to further improve the processing speed.

(Means for solving the WJ problem) The present invention was invented to increase the processing speed, and is equipped with an irradiation device that focuses laser, microwave, or other electromagnetic waves on the fluid inside the nozzle that is jetted from the tip. It is characterized by:

〔Example〕

The present invention will be explained below with reference to an embodiment of the drawings.

A jet nozzle 1 has a narrowed tip 1a and emits a jet 2. 1b is a chamber to which pressurized fluid is supplied from a fluid supply device such as a pump, 1C is a laser implantation chamber formed in front of the fluid ejection tip 1a of the nozzle, and both chambers 1b inside the nozzle.
, 1c is provided with a constricted portion 1d that narrows the flow path to prevent shock waves from flowing back. 1e is room 1
A condensing lens 3 is provided at the irradiation window for laser beam injection provided on the side wall of C, and the laser beam 5 oscillated by the laser oscillator 4 is condensed into the chamber 1C. A chopper 6 chops the oscillation laser 5 and irradiates it with pulses.

Reference numeral 7 denotes a workpiece, which is installed on a table 8 in a processing tank 9. Reference numerals 11 and 12 refer to a motor that drives the processing table 8 in the X-Y axis directions, and 13 refers to its NG control device, which enables position control based on a program. Reference numeral 14 denotes a pump that supplies working fluid to the nozzle 1. The fluid injected from the nozzle tip 1a is collected in a storage tank 15 by a tank 9, and then pumped again to the pump 14.
It is recycled and used as supplied by

Machining using a jet flow is performed by colliding a fluid jet 2 ejected from a nozzle 1 with a focused ultra-high pressure fluid jet 2 against the machining portion of the opposing workpiece 7, and causing a peeling effect or the like due to the pressure at the time of collision. Jet fluid, for example water, is supplied under pressure by a pump 14, and is supplied to each AC passage 1b in the nozzle 1,
1d, it passes through the IC and is narrowed down by the narrowed tip jet port 1a, and is ejected as a beam-shaped jet stream 2. However, when the flowing water in the nozzle passes through the chamber 1C, a laser beam is struck. That is, a laser beam 5 outputted from an oscillator 4 is pulsed intermittently by a chopper 6, and is focused by a condensing lens 3 onto the center of the chamber 1c. As a result, the water in the chamber 1C is impulsively heated and expanded, partially vaporized, and an impact pressure is applied to the surroundings, so that the water flowing in the chamber 1C is jetted from the nozzle tip 1a under a significantly increased pressure. Since the flow water is provided with a constriction part 1d on the front supply side of this laser shock chamber 1C, the shock pressure is directed toward the tip nozzle 1a and is efficiently ejected as a jet stream 2 and collides with the workpiece 1. , erosion action, strong cavitation, and peeling action work, and these mutual effects result in highly efficient machining action.

The jet stream impinging on the workpiece 7 can be easily increased by laser beam irradiation, and the pump supply pressure can be reduced to perform high-pressure jet injection. For example, IKW's motor pump pumps water 21/2
Ugly in 1300kt/cm” and supplied with 0.12e-
When jetting from a φ nozzle and pulse-irradiating a 10"W/cm2 C02 laser to the flowing water inside the nozzle, the jetting pressure was approximately 2.000kt/cm2. Also, this jet stream contained water vapor. When cutting 855C material containing about 18% of cavitation and having a thickness of 55 am, the cutting result was 1.500 ui2.7, which is about twice that of the conventional material.
A processing speed of w1n was obtained. Furthermore, when 45% compressed air is mixed into the water supplied from the pump, the laser irradiation energy is 10'W/CI2 and the processing speed is 1,800++e.
2/sin. Also, when 15% of graphite grains with a diameter of 5μφ or less and 10% of 11 grains with an average diameter of 3μφ are mixed, the laser energy of 10'W/cw2 is about 2. OOOam
A machining speed of 2/sin was obtained, and in addition, air was
When 5% was mixed, a processing speed of about 4.0001-2/inch was obtained. The Ti and C react to laser irradiation and turn into Ti0 grains, which collide with each other at an accelerated rate due to the jet flow, thereby improving cavitation, erosion, peeling, etc. of the processed portion of the workpiece.

In addition, compared to the conventional 8KW pump processing, the present invention
Total 3.5K with IKW pump and 2.5KW laser
It can be processed with W, and when the laser is pulsed, the conventional 16
The present invention was able to realize the case of 3.7KW.

For cutting by jet flow, contour cutting, etc., the machining shape to be machined is programmed in advance, and a signal is applied from the NG control device 13 to the drive motors 11 and 12 to give the required machining shape feed to the workpiece 7. , and the nozzle 1 while being moved relative to each other.

Of course, relative movement feeding may be provided by providing a drive device in the nozzle 1. Further, the gap between the nozzle 1 and the workpiece 7 facing each other is controlled by giving two-axis feed to the nozzle 1.

In order to perform deep hole machining, the nozzle spacing is controlled in accordance with the progress of machining so that the maximum energy of the jet flow is always applied to the machining portion of the workpiece. Further, when changing the feed rate at a corner or the like during shape machining, or when moving at a constant speed, high precision machining can be performed by controlling the laser oscillation 4 and the speed of the #JllL chopper 6. Further, it is possible to perform a tapered cut by tilting the facing direction of the nozzle 1.

Further, as the laser oscillator, a YAG laser, an Ar laser, an excimer laser, or the like can be used. A semiconductor laser is easy to control, and pulse output can be easily controlled. Alternatively, microwave or other electromagnetic wave energy may be used.

Further, as the medium for the jet flow, a mixture of a surfactant, a reducing agent, an electrolyte, and other hard powder particles, mainly water, can be used. To obtain hard particles in water by laser irradiation
i+8→Ti 82, Si +C-+Si C, Ti
+B+C-+Ti CB2 There are other combinations, such as 11 grains, 81 grains, 0 grains, etc., and nitrogen gas, boron gas, etc. The cavitation effect can be enhanced by mixing gas and pressurized air.

〔effect〕

As described above, the present invention focuses the fluid supplied into the jet nozzle and irradiates it with laser, microwave, or other electromagnetic waves, so that jet injection with a significantly increased pressure can be achieved with a small pump pressure. It is possible to increase the machining speed and perform highly efficient machining. It is highly effective in processing ceramics, plastics, metals, semiconductors, and other composite materials.

[Brief explanation of drawings]

The drawing is a configuration diagram of an apparatus according to an embodiment of the present invention. １・・・・・・・・・Nozzle 2・・・・・・・・・Jet 3・・・・・・・・・Lens ４・・・・・・・・・Laser oscillator 5... Laser beam 6...Choppa 7・・・・・・・・・Workpiece 14・・・・・・・・・Pump Patent applicant Inoue Japax Laboratory Co., Ltd. Representative Kiyoshi Inoue

Claims (3)

[Claims] (1) In a fluid jet machining device that processes fluid by injecting it from a nozzle, an irradiation device that focuses the fluid in the nozzle and irradiates it with laser, microwave, or other electromagnetic waves is provided. Characteristic fluid jet processing equipment. (2) The fluid jet machining apparatus according to claim 1, further comprising a nozzle in which a constricted part with a narrowed flow path is formed on the fluid supply side from the electromagnetic wave irradiation part in the nozzle. (3) The fluid jet processing apparatus according to claim 1, further comprising an irradiation device that emits electromagnetic waves in a pulsed manner.