JPH0385652U - - Google Patents
Info
- Publication number
- JPH0385652U JPH0385652U JP1989147035U JP14703589U JPH0385652U JP H0385652 U JPH0385652 U JP H0385652U JP 1989147035 U JP1989147035 U JP 1989147035U JP 14703589 U JP14703589 U JP 14703589U JP H0385652 U JPH0385652 U JP H0385652U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat dissipation
- shaft
- cooling structure
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147035U JPH0648863Y2 (ja) | 1989-12-22 | 1989-12-22 | 集積回路の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147035U JPH0648863Y2 (ja) | 1989-12-22 | 1989-12-22 | 集積回路の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0385652U true JPH0385652U (sl) | 1991-08-29 |
| JPH0648863Y2 JPH0648863Y2 (ja) | 1994-12-12 |
Family
ID=31693568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147035U Expired - Lifetime JPH0648863Y2 (ja) | 1989-12-22 | 1989-12-22 | 集積回路の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648863Y2 (sl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004093187A1 (ja) * | 2003-04-16 | 2004-10-28 | Fujitsu Limited | 電子部品パッケージ、電子部品パッケージ組立体およびプリント基板ユニット |
| JP2009048783A (ja) * | 2007-08-13 | 2009-03-05 | Sobo Yu | スイッチの自動切断構造 |
-
1989
- 1989-12-22 JP JP1989147035U patent/JPH0648863Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004093187A1 (ja) * | 2003-04-16 | 2004-10-28 | Fujitsu Limited | 電子部品パッケージ、電子部品パッケージ組立体およびプリント基板ユニット |
| JP2009048783A (ja) * | 2007-08-13 | 2009-03-05 | Sobo Yu | スイッチの自動切断構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648863Y2 (ja) | 1994-12-12 |
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