JPH038424U - - Google Patents
Info
- Publication number
- JPH038424U JPH038424U JP1989067814U JP6781489U JPH038424U JP H038424 U JPH038424 U JP H038424U JP 1989067814 U JP1989067814 U JP 1989067814U JP 6781489 U JP6781489 U JP 6781489U JP H038424 U JPH038424 U JP H038424U
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- heat
- section
- treatment section
- buffer storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989067814U JPH0536269Y2 (cg-RX-API-DMAC7.html) | 1989-06-09 | 1989-06-09 | |
| KR1019900008438A KR930010971B1 (ko) | 1989-06-09 | 1990-06-08 | 기판을 열처리하기 위한 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989067814U JPH0536269Y2 (cg-RX-API-DMAC7.html) | 1989-06-09 | 1989-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH038424U true JPH038424U (cg-RX-API-DMAC7.html) | 1991-01-28 |
| JPH0536269Y2 JPH0536269Y2 (cg-RX-API-DMAC7.html) | 1993-09-14 |
Family
ID=13355791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989067814U Expired - Lifetime JPH0536269Y2 (cg-RX-API-DMAC7.html) | 1989-06-09 | 1989-06-09 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0536269Y2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR930010971B1 (cg-RX-API-DMAC7.html) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59211243A (ja) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | 半導体基板処理装置 |
-
1989
- 1989-06-09 JP JP1989067814U patent/JPH0536269Y2/ja not_active Expired - Lifetime
-
1990
- 1990-06-08 KR KR1019900008438A patent/KR930010971B1/ko not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59211243A (ja) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | 半導体基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR910001897A (ko) | 1991-01-31 |
| KR930010971B1 (ko) | 1993-11-18 |
| JPH0536269Y2 (cg-RX-API-DMAC7.html) | 1993-09-14 |