JPH0382129A - Semiconductor chip - Google Patents

Abstract

PURPOSE:To enable bumping pads or solder bumps on the bumping pads used for mounting-connection to be excluded from the objective pads whereinto the needles for probing test are stuck by a method wherein testing pads electrically connected to the bumping pads are provided close to the bumping pads. CONSTITUTION:Testing pads 4 comprising a wiring metal are arranged close to bumping pads 3 on the surface of a semiconductor chip 1 so as to be connected to the bumping pads 3 by wirings 5 taking a shape in about 80mum square while the surfaces of the testing pads 4 composed of the wiring metal as they are. Besides, the bumping pads 3 or the testing pads 4 close to a circuit pattern region 2 are connected to the circuit of the region 2 by wirings not shown in figure. On the other hand, the bumning pads 3, the testing pads 4 and the wirings 5 are formed of the same wiring layer as the wirings from the circuit pattern region 2. Since the probing test of this semiconductor chip 1 is performed by sticking needles into the testing parts 4, the scratching of bumping pads 3 and the deformation of solder bumps on the bumping pads 3 can be avoided.

Description

[Detailed Description of the Invention] [Summary] Regarding semiconductor chips mounted using the flip-chip method, the bump pads used for mounting connections or the solder bumps thereon are excluded as targets for setting a needle during a blowing test. For the purpose of achieving this, the test pad is configured to include a test pad electrically connected to the bump pad in the vicinity of the bump pad.

[Industrial application field]

The present invention relates to a semiconductor chip, and particularly to a semiconductor chip mounted using a flip-chip method.

As computers become faster, new mounting techniques for semiconductor devices are also required. Conventional packaging methods have reached their limits in terms of packaging density and high speed. Therefore, the flip-chip method, in which paired chips are directly mounted without using a package, is attracting attention.

The flip-chip method is a mounting method in which bump pads are provided on the surface of a semiconductor chip, solder bumps are formed thereon, and the semiconductor chip is directly soldered to a mounting board using the solder bumps. This method not only allows for high packaging density, but also has the advantage of less deterioration of electrical characteristics since no connection leads are required.

(Prior Art) FIG. 2 is a plan view of a conventional example of a semiconductor chip mounted by the flip-chip method.

In the figure, 11 is a semiconductor chip, 12 is a circuit pattern area, and 13 is a bump pad. The wiring between the circuit pattern area 12 and the bump pad 13 is omitted.

The bump pad 13 is made of a wiring metal, is placed on the surface of the semiconductor chip 11, and has a size of about 200 m φ, and a barrier metal film against the solder bump is provided on the surface of the wiring metal. Then, solder bumps are formed thereon and used for connection in flip-chip mounting.

The quality of this semiconductor chip is checked by a blowing test before it is mounted. There are two types of blobbing in this case: That is, (1) Place a needle on the bump pad 13 (on the barrier metal).

■ After forming the solder bump, place a needle on the solder bump.

[Problem to be solved by the invention]

However, in the case of (■) above, the barrier metal may be damaged and the solder bumps may react with the wiring metal, causing the wiring to break. In either case, there is a problem of lowering reliability because it causes instability.

Accordingly, the present invention provides a method for excluding bump pads used for mounting connections or solder bumps thereon as targets for setting up needles during a blowing test in a semiconductor chip mounted using the flip-chip method. purpose.

[Means to solve the problem]

The above object is achieved by the semiconductor chip of the present invention, which includes a test pad electrically connected to the bump pad in the vicinity of the bump pad used for mounting connection.

[For production]

Since the test pad is electrically connected to the bump pad, it is possible to perform a blobbing test similar to the conventional example by setting a needle on the test pad.

If you perform a blobbing test in this way, the bump pad or the solder bump on it will be excluded from the target, which will prevent the bump pad from being scratched or the solder bump on the bump pad from becoming deformed. This prevents deterioration in reliability due to scratches and deformation.

〔Example〕

Embodiments of the present invention will be described below in the first section which schematically shows them.
This will be explained using the schematic plan view shown in the figure.

In the figure, 1 is a semiconductor chip, 2 is a circuit pattern area, 3 is a bump pad, and 4 is a test pad.

The wiring between the circuit pattern area 2 and the bump pad 3 or test pad 4 is omitted.

Like the conventional bump pad 13, the bump pad 3 is made of wiring metal and is placed on the surface of the semiconductor chip 1, and has a size of about 200 μmφ, and has a barrier metal film for solder bumps on the surface of the wiring metal. This is provided.

Then, solder bumps are formed thereon and used for connection in flip-chip mounting.

The test pad 4 is made of wiring metal, is placed near the bump pad 3 on the surface of the semiconductor chip l, is connected to the bump pad 3 by a wiring 5, has a size of about 80 μm square, and has a surface made of wiring metal. It remains as it is.

Further, the bump pad 3 or the test pad 4 that is close to the circuit pattern area 2 is connected to the circuit in the circuit pattern area 2 by wiring (not shown).

Then, the bump band 3, the test pad 4 and the wiring 5
is formed of the same wiring layer as the wiring from the circuit pattern area 2.

The blobbing test of the semiconductor chip 1 is performed by setting a needle on the test pad 4, as described above. By doing so, it is possible to perform a blobbing test similar to the conventional example without damaging the bump pad 3 or deforming the solder bump on the bump pad 3.

Needless to say, the size and arrangement of the bump pads 3 and test pads 4 are not limited to the dimensions described in the embodiments or the arrangement shown in FIG.

〔Effect of the invention〕

As explained above, according to the tank bottom of the present invention, in a semiconductor chip mounted by a flip-chip method, the bump pad used for mounting connection or the solder bump thereon can be used as a target for setting a needle during a blowing test. This eliminates damage to the bump pad or deformation of the solder bump on the bump pad during a blobbing test, and reduces reliability due to scratches or deformation. It has the effect of preventing sexual decline.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view of the embodiment; Figure 2 is a schematic plan view of the conventional example. It is. In the figure, ■, 11 is a semiconductor chip, 2.12 is the circuit pattern area, 3.13 is a bump pad, 4 is a test pad, 5 is wiring, It is.

Claims (1)

[Claims] A semiconductor chip mounted using a flip-chip method,
A semiconductor chip comprising a test pad electrically connected to the bump pad in the vicinity of the bump pad used for mounting connection.