JPH0382004A - Laminated capacitor and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain a laminated capacitor, size of which can be made smaller than and capacitance of which can be made larger than conventional devices, a capacitance value of which is hardly dispersed and which can be manufactured through a comparatively simple process, by forming a side margin region by etching or physically removing the side edge section of an internal electrode exposed to the side face of a dielectric. CONSTITUTION:In a laminated capacitor, which has a laminated dielectric, in which a plurality of dielectric layers are laminated while interposing internal electrodes 13, 14 on the inside, and in which the layers of the internal electrodes 13, 14 are made narrower than said dielectric layers and side margin regions 34, 35 are shaped onto the sides of the internal electrodes 13, 14 by the narrowing of the layers of the internal electrodes, the side margin regions 34, 35 are formed by etching or physically removing the side edge sections exposed of the internal electrodes 13, 14 on the side face of the laminated type dielectric from which the side edges of the internal electrodes 13, 14 having the same width as that of said dielectric layers are exposed. The first and second side faces of a sintered body 25 are covered with resist materials 26a, 26b, and third and fourth side faces 25c, 25d are etched, thus forming the side margin regions 34, 35.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a multilayer capacitor and a method for manufacturing the same, and more particularly, the present invention relates to a multilayer capacitor and a method for manufacturing the same, and more particularly, the present invention relates to an improved process for forming a side margin region between an internal electrode and a dielectric side surface. The present invention relates to a multilayer capacitor and a method for manufacturing the same.

[Conventional technology]

Multilayer capacitors are widely used to make capacitors smaller and larger in capacity. For example, as shown in FIGS. 2(a) and 2(b), a multilayer capacitor includes an internal electrode material 1 made of conductive paste. A plurality of ceramic green sheets 3.4 coated with the internal electrode materials 1. This is obtained by forming an external electrode on the side surface of the drawn sintered body of No. 2.

By the way, the internal electrode material 1.2 formed on the ceramic green sheets 3.4 extends from the first edge 3a, 4a to the second edge 3b of each ceramic green sheet 3.4.
, and are formed to extend toward the 4b side. In addition, each internal electrode material l.

2 is the side edge 3c of the ceramic green sheet 3.4;
The width is such that a side margin region 5 of width X is left between 3d, 4c, and 4d.

The side margin region 5 is provided by the internal electrode material 1
．． This is to improve the adhesion between the ceramic green sheets located above and below 2 and to prevent the internal electrode material 1.2 from being exposed on the side surface of the sintered body after sintering. Therefore, conventionally, in multilayer capacitors, internal electrode material 1
．． It was essential to form a side margin region 5 having a width of X on the sides of 2.

[Technical problem to be solved by the invention] However,
When the width X of the side margin region 5 is wide, the width of the internal electrode material 1.degree.2 is naturally pinched, which impedes an increase in capacity.

Therefore, in order to achieve smaller size and larger capacity, it is preferable that the width X of the side margin region 5 is narrower.

On the other hand, when mass-producing multilayer capacitors, Fig. 3(a)
, as shown in (b), a relatively large matrix ceramic green sheet 6.7 is prepared, and a plurality of matrix internal electrode materials 8.9 formed on one main surface are alternately laminated. - Dot-dashed line A.

Individual laminates are obtained by cutting the laminate along line B, and individual laminate capacitors are manufactured by firing the individual laminates.

However, when laminating the mother ceramic green sheets 6.7 on which a plurality of mother internal electrode materials 8.9 are formed, some lamination misalignment inevitably occurs, and as a result, after cutting, the individual laminated There is a possibility that the internal electrode material may be exposed on the side surface of the laminate inside the body. If the internal electrode materials are exposed on the side surfaces of the laminate, voltage resistance failure or short circuits between the internal electrode materials occur.

In addition, if the internal electrode material reaches near the side surface of the sintered body, even if it is not exposed, that is, Fig. 2 (a), (b)
), the adhesion strength between the upper and lower ceramic layers is not sufficient, causing layer peeling after sintering.

Furthermore, if a lamination misalignment occurs, the overlapping area of the internal electrode materials will also become smaller, and there is a risk that the capacitance value will be lower than the designed capacitance.

For the above-mentioned reasons, although it is preferable for the width X of the side margin region 5 to be narrow, it is necessary to make the width X larger than necessary, which hinders miniaturization and increase in capacity. In addition, variations in capacitance value and delamination due to lamination misalignment tended to occur.

An object of the present invention is to provide an inexpensive capacitor that can be made smaller and larger in capacitance than conventional multilayer capacitors, has less variation in capacitance value, and can be manufactured in a relatively simple process. An object of the present invention is to provide a multilayer capacitor and a method for manufacturing the same.

[Means for solving technical problems]

The present invention has a laminated dielectric in which a plurality of dielectric layers are laminated with internal electrodes interposed therebetween, and the width of the internal electrodes is narrower than that of the dielectric layers. In a multilayer capacitor in which a side margin region is provided on the side, the side margin region is exposed on the side surface of the dielectric where the side edge of the internal electrode with the same width as the dielectric layer is exposed. It is characterized in that it is formed by etching or physically removing the side edge portions of the electrodes.

Further, the manufacturing method of the present invention provides a laminated dielectric material in which a plurality of dielectric layers are laminated with internal electrodes interposed therebetween, and the internal electrodes have the same width as the dielectric layers. A side margin is formed on the side of the internal electrode by etching or physically removing the side edge portion of the internal electrode on the side surface of the laminated dielectric where the side edge of the internal electrode is exposed. The method is characterized by a step of forming a region.

In addition, as the above-mentioned physical removal method, there is a reverse sputtering method in which the internal electrode material is scattered by sputtering, and a method in which the internal electrode material is moved to the row section by electrophoresis.

Furthermore, in the method for manufacturing a multilayer capacitor of the present invention,
A plurality of internal base electrodes are formed on one principal surface of a rectangular thick electrical sheet so as to extend between opposing edges of the thick electrical sheet, and a thick electrical body on which internal internal electrodes are formed is formed. The laminated individual dielectric described above may be obtained by laminating sheets and cutting the laminated base dielectric in the lamination direction.

[Effect]

In the present invention, the side margin regions are formed by etching or physical removal after obtaining the laminated dielectric. Therefore, by accurately forming the width of the side margin region, it is possible to accurately control the overlapping area of the internal electrodes, and in turn, it is possible to reduce variations in capacitance.

In addition, since the internal electrodes of the dielectric Nt with the same width are stacked and the side margin regions are formed by etching or physical removal after stacking, the width of the side margin regions must be adjusted in consideration of stacking misalignment. Therefore, it is possible to obtain a smaller and larger capacity multilayer capacitor.

Moreover, since it uses a laminated body in which internal electrodes with the same width as the dielectric layer convergence are laminated, there is a high tolerance for lamination misalignment, making lamination work easy. It is possible to obtain a multilayer capacitor having a side margin region of .

[Explanation of Examples]

A manufacturing method according to an embodiment of the present invention will be described with reference to FIGS. 4 to 10. This example is applied to a method of manufacturing a multilayer capacitor using dielectric ceramics.

FIG. 4 is a perspective view for explaining a ceramic green sheet as a dielectric layer used in the manufacture of this example and an internal electrode material formed thereon. Internal electrode materials 13 and 14 are formed in the form of a film on the upper surfaces of the rectangular ceramic green sheets 11 and 12, respectively.

The ceramic green sheets 11 and 12 are obtained by molding a ceramic slurry mainly made of dielectric ceramic into the shape shown in the figure.

The internal electrode materials 13 and 14 are constructed by applying a conductive paste mainly composed of a conductive material such as Ni or Cu. The materials that make up the internal electrode material are:
In addition to Ni and Cu, various metal materials such as Ag or Ag-Pd can be used. However, it is necessary to use a material that can be etched with an appropriate etchant during etching, which will be described later.

The internal electrode material 13 is a rectangular ceramic green sheet 1
It is formed so as to extend from one end edge 11a of 1 toward the opposite @ edge 11b side, but not to reach the end edge 11b. Further, the width of the internal polar phase 13 is the same as the width of the ceramic green sheet 11. That is, the side edges lic, l of the ceramic green sheet 11
A western electrode material 13 is formed in the convergence that spans the entire width between the id's.

The internal electrode material 14 is also configured in the same manner as the internal electrode material 13. However, ceramic green sheet 11.
When stacking 12, internal electrode materials 13,! : One edge 12a of the ceramic green sheet 12 from which the internal electrode material 14 is drawn out is connected to the one edge 11a of the ceramic green sheet 11 so that the internal electrode material 14 is drawn out to the opposite side surface of the laminate. The fourth person is located on the opposite side.
By alternately laminating a plurality of ceramic green sheets 11 and 12 shown in the figure, a laminate 1 shown in FIG.
You can get 5. In the laminate 15, the first. The second ceramic green sea) 11 and 12 are stacked alternately in three sheets, and on the top (or the bottom if necessary) there is a ceramic ivy green sea) 16 that is not provided with internal electrode material. An appropriate number of layers are stacked.

Here, one of the three internal electrodes 13a=13C is placed on the first side surface 15a of the laminate 15, and the other internal electrode material 14
axl 4c is drawn out to the second side 15b.

Further, each of the internal electrode materials 13a to 13c and 14ax14c are located at the 3rd and 4th side surfaces 15c and 15d of the laminate 15.
It is also exposed.

In order to obtain the laminate 15, in the actual mass production process, it is preferable to use the mother ceramic green sheet shown in FIG. Thick internal electrode material 18 extending from one end edge 17a to the other end edge 17b across
a, 18b are formed. Similarly, the thick internal electrode material 2 is also placed on the ceramic green sheet 19 as the thick electric sheet.
0a and 20b are formed from one edge 19a of the ceramic green sheet 19 to the other edge 19b.

Then, a plurality of ceramic green sheets 17 and 19 are alternately stacked in the direction shown in the figure, and cut at a portion corresponding to the section along the dashed-dotted lines A and B, resulting in a structure similar to the laminate 15 shown in FIG. A large number of structures can be obtained.

In this way, by using the mother ceramic ξtsk green sheets 17 and 19, the laminate 15 shown in FIG. 5 can be efficiently mass-produced. Moreover, the laminate 1 in FIG.
5, each internal electrode material 13a to 13c + 14
a to 14c are the 3rd. It is formed in such a width that it is also exposed to the fourth side surfaces 15c and 15d.

Therefore, the ceramic green sheet 17°19 in Fig. 6
Even if some misalignment occurs in the direction of arrow C in FIG. 6 when laminating the internal electrode materials, there will be no overlapping misalignment of the internal electrode materials in the direction of arrow C in the obtained laminated dielectric 15. Even if some unavoidable lamination misalignment occurs when laminating the ceramic green sheets 17 and 19, it is possible to stably obtain a laminated body 15 with little variation in electrode chamber or area.

Furthermore, if a laminate is obtained by cutting along the dashed-dotted lines A and B in FIG. 6, there is a risk that the internal electrode material may sag on the side surface of the laminate. However, such sagging of the internal electrode material can be reliably removed by the etching agent described later.

In addition, in the conventional example shown in FIG. 2, when a conductive paste for configuring the internal electrode material l is applied, the surface tension of the paste causes the internal electrode material l to A raised portion 21a is provided on the side edge.

21b was formed. Therefore, when a plurality of ceramic green sheets are laminated, the thickness of the internal electrode material is not uniform, which is one of the reasons why the layers tend to peel off after sintering.

On the other hand, in this embodiment, as shown in a corresponding cross-sectional view in FIG.

Since the internal electrode material 13 is formed to span the entire width between the lids, the thickness of the internal electrode material 13 is uniform in the width direction. Therefore,
The occurrence of delamination due to non-uniform thickness of the internal electrode material can be effectively prevented.

Returning to FIG. 5, prior to firing, the laminate 15 is pressed in the thickness direction to bring the ceramic green sheets 1 into close contact with each other. In this case, in the laminate 15 of this example,
Internal electrode materials 13a to 13c.

14 aAl 4 C is the third. Fourth side 15c, 15
The thickness is uniform in the Y direction of Fig. 5, as shown in the schematic cross-sectional view of Fig. 8(b) along the line ■-■ of Fig. 5. It can be crimped so that

On the other hand, in the conventional example using the ceramic green sheet shown in FIG. 2, since the side margin region 5 is formed in advance, the The thickness becomes thinner in the portion 2 where the margin area is formed, and the thickness of the stack at the part where the internal electrode material 1.2 is formed and the thickness of the side part Z where the 9-id margin area is formed. Due to the difference, delamination tends to occur on the side surfaces of the obtained sintered body.

Therefore, in the laminate of this example, the occurrence of delamination due to such reasons can be effectively prevented.

Next, the laminated body 15 shown in FIG. 5 which has been pressed in the lamination direction is fired to obtain a sintered body as a laminated dielectric. Furthermore, as shown in FIG. 9, the first . The second side surface is a resist material 26a.

26b. These resist materials 26a and 26b are
It is made of a material that is not attacked by the etchant used in the etching described below, and for example, synthetic resin such as epoxy resin can be used.

The internal electrode material 13 is baked into the sintered body 25 when the ceramic is fired.
a to 13e and 14a to 14c are formed. It should be noted that the reference numbers of the internal electrodes will be explained using the same reference numbers as those of the internal electrode materials described above.

Each internal electrode 13a=13c, 14a to 14c is connected to the third electrode of the sintered body 25 except for the portion covered with the resist material 26a, 26b. It is exposed on the fourth side surfaces 25e and 25d.

Next, the third. Fourth side 25C, 25
d is etched using an etchant capable of etching the material forming the bottom of the internal electrodes 13a-13c, 14a-14c. As an etchant, for example, a strong acid such as nitric acid can be used, but as an internal electrode material, Cu
When a gold layer material other than Ni is used, an appropriate etchant capable of etching such a metal material is used.

The state after etching is shown in a plan sectional view in FIG. 1O. As is clear from FIG. 1O, inside the sintered body 25,
The two sides 32 and 33 adjacent to the edge 31 from which the internal electrode 13a is drawn out to the first side surface 25a of the sintered body 25 are
Side margin area 34.35 3rd degree fourth side 25
c, 25d, the third. It is retreated inward from the fourth side surface 25C925d. This means that both side edge portions of the internal electrode 13a are etched by etching, thereby forming side margin regions 34 and 35.

Side margin regions are similarly formed in the other internal electrodes 13b, 13c, and 14a-14c.

Furthermore, as is clear from FIG. 11, the area where the side margin area is formed has 3 vacancies due to etching.
After etching has been performed once 4a and 35a have been formed, the sintered body 25 is washed with water or the like to remove the etchant. However, washing with water alone will remove residual etchant, especially the voids 3.
It may be difficult to completely remove the etchant remaining in 4a, 35a. Therefore, in this embodiment, the sintered body 25 is then placed in a heated atmosphere to scatter and remove the residual etchant.

Note that the above-mentioned heating may utilize the heat given in the step of baking the external electrodes, which will be described later. In that case, the removal of the residual etchant and the baking of the external electrodes can be performed in the same step.

Further, the purpose of removing the residual etchant is to prevent corrosion of the internal electrodes due to the residual etchant. Therefore, a method other than heating may be used as long as it is possible to remove the etching effect.For example, if the etchant is a strong acid, the remaining etchant may be neutralized by immersion in an alkaline solution.

Following the removal of the residual etchant, the resist material 26
a, 26b are removed. The resist materials 26a and 26b can be removed by mechanical polishing, a method using chemicals, or the like.

In this embodiment, the side margin regions 34 and 35 are formed by etching, so the third side margin regions 34 and 35 of the sintered body 25 are formed by etching. Fourth
A side margin region with an accurate width can be formed inward from the side surfaces 25c and 25d. Moreover, since the side margin regions 34 and 35 are formed after the ceramic green sheets and internal electrode materials are laminated to obtain a laminate, an extra width is required to take into consideration lamination misalignment, etc. There is no need to form a side margin region, that is, the side margin region 34.3 has a narrower width than the conventional example.
5 can be formed. Therefore, it can be seen that a small-sized, large-capacity multilayer capacitor can be realized.

Furthermore, since the internal electrode portion exposed on the side surface is removed by etching, even if the internal electrode material is dripping from the exposed portion on the side surface of the laminate 15, such dripping is reliably removed. Ru.

Finally, a conductive paste containing, for example, Ag is applied to the surface from which the resist materials 26a and 26b have been removed and is baked, thereby forming a pair of external electrodes 36 and 37, as shown in FIGS. 1 and 12. form. The external electrode 36 is connected to the internal electrodes 13a to 13c, and the external electrode 37 is connected to the internal mold 114a.
It is electrically connected to x14c.

Preferably, after forming the external electrodes 36 and 37, the third. The fourth side surfaces 25c and 25d may be subjected to oxidation treatment. In this embodiment, the oxidation treatment is achieved, for example, by heating the multilayer capacitor shown in FIG. 12 for a predetermined time in an oxidizing atmosphere. The third part of the sintered body 25. At the fourth side surfaces 25c and 25d, the internal electrode 13
Because the side edges of a to 13c and 14ax and 14c are arranged, and because the side margin region is formed by etching, the side edges of the internal electrodes are easily oxidized by the oxidizing atmosphere, and as a result, the internal electrodes An oxide film is formed on the side edges. The formation of this oxide film effectively increases the adhesion strength between the internal electrodes and the ceramic. This is because a chemical bond is formed between the dielectric ceramic and the internal electrode when it is oxidized.

Therefore, by performing the oxidation treatment as described above, it is possible to further improve the adhesion between the internal electrodes 13a-13c, 14a-14c and the dielectric ceramic.

Note that the above oxidation treatment may be performed at any stage after the side margin regions 34.35 are formed by etching, that is, the oxidation treatment may be performed prior to the formation of the external electrodes 36.37. .

Preferably, in the gaps 34a and 35a in FIG.
As shown in FIG. 13, synthetic resin 39 such as epoxy resin
By injecting under pressure, the side surface 25c of the sintered body 25,
25d can be sealed. Note that as the sealing material, in addition to synthetic resin, any material such as rubber can be used.

The above-mentioned sealing treatment may also be performed after the formation of the external electrodes, or may be performed prior to the formation of the external electrodes.

Further, in the above embodiment, the pair of external electrodes 36 and 37 are formed after etching, but the external electrodes may be formed prior to etching.

In the above embodiment, the internal electrodes 13a to 13c, 14a to 1
Since 4c is constructed using inexpensive Ni or Cu, the electrode cost can be reduced. Further, since the base ceramic green sheets can be stacked without worrying too much about stacking misalignment, the manufacturing process is simplified and the mass production cost of multilayer capacitors can be effectively reduced.

Preferably, the side surfaces of the sintered body on which the external electrodes 36 and 37 are formed are coated with a conductive paste mainly composed of Ni, and then the external electrodes 36 and 37 are formed, so that the internal electrodes and the external The reliability of electrical connection with the electrode can be increased.

Further, in place of N1, another conductive material layer is applied to the first layer of the sintered body 25. It may be applied to the second side surfaces 25a, 25b. In that case, if a material that is not etched by the etchant is used, it can also have the function of the resist materials 26a, 26b. That is, the resist materials 26a and 26b can be used as base electrodes for forming external electrodes. In this case, removal of the resist material is not necessary.

In the embodiments described above, the side edges of the internal electrodes were etched using a chemical agent such as nitric acid as an etchant.
Actual etching can be performed by immersing the sintered body in an etchant, or by storing the etchant in a rotating barrel, placing the sintered body into the barrel, and rotating the barrel.

In addition, as shown in the cross-sectional view in FIG.
Enching may be performed by immersing only the third or fourth side surface 25c or 25d of the sintered body 25 into the tank 42 in which the sintered body 1 is stored. In this case, the third. By sequentially immersing the fourth side surfaces 25c and 25d in the etchant, etching can be performed while preventing the etchant from adhering to other outer surface portions of the sintered body. Therefore, the use of the resist materials 26a and 26b as described above can be omitted.

In the embodiments described above, a ceramic green sheet was used as the dielectric sheet, but the present invention is limited to a multilayer ceramic capacitor formed by laminating a plurality of ceramic green sheets and firing them together with the internal electrode material. It's not a thing. That is, a dielectric resin film can be used as the dielectric sheet, and the present invention can also be applied to a so-called multilayer film capacitor.

Furthermore, the present invention can also be applied to a wound type capacitor formed by winding a long ceramic green sheet or resin film together with an internal electrode formed on its main surface. It should be pointed out that wound type capacitors are also included in the multilayer capacitors referred to in the present invention.

〔Effect of the invention〕

As described above, in the manufacturing method of the present invention, the side margin region on the side of the internal electrode is formed by etching or physically removing the two sides of the internal electrode adjacent to the extended edge of the internal electrode. be done. That is, since the side margin region is formed by etching or physical removal after lamination, it is possible to accurately form the side margin region with the minimum necessary width without considering lamination misalignment or the like. Therefore, it is possible to obtain a multilayer capacitor that is small in size, has a large capacity, and has less variation in capacitance value.

In addition, since the side margin regions are formed by etching or physical removal after lamination, it is possible not only to obtain a small and large-capacity multilayer capacitor as described above, but also to maintain the positioning tolerance when laminating dielectric sheets. Since it spreads out, the lamination work can be done relatively easily. Furthermore, since the electrode pattern for forming internal electrodes is formed to have the same width as the dielectric layer, the number of types of electrode patterns can be reduced. Therefore, by simplifying the work process, it is possible to reduce the cost of the multilayer capacitor.

Preferably, the above-described multilayer capacitors can be efficiently mass-produced by laminating thick electric sheets with the internal electrode material formed thereon and cutting them to form individual multilayer dielectrics. .

Furthermore, when ceramic is used as the dielectric and is sintered before etching or other processing, the internal electrodes exposed on the sides serve as a medium that promotes sintering inside the dielectric, resulting in quick and efficient sintering. can be done to

[Brief explanation of drawings]

Figure 1 is a cross-sectional plan view of a multilayer capacitor according to an embodiment of the present invention, and Figures 2 (a) and (b) are ceramic green sheets used to manufacture conventional multilayer capacitors and the ceramic green sheets formed thereon. Each plan view, FIG. 3(a) and (b) showing the shape of the internal electrode material shows the shape of the mother ceramic green sheet used in the mass production of conventional multilayer capacitors and the shape of the mother internal electrode material formed thereon. FIG. 4 is a plan view for explaining the shape of the internal electrode material formed on the Cerac 67 green sheet and the dielectric sheet used in manufacturing one embodiment of the present invention. FIG. 5 is a perspective view showing a laminate, FIG. 6 is a perspective view illustrating the process of laminating mother ceramic green sheets, and FIGS. 7(a) and (b) are conventional FIGS. 8(a) and 8(b) are cross-sectional views for explaining the shapes of side edges of internal electrode materials in examples and examples, and FIGS. FIG. 8(b) is a cross-sectional view of a portion along the line ■-■ in FIG. 5, and FIG. 9 is a schematic cross-sectional view for explaining the shape of the sintered body. FIG. 1O is a plan sectional view for explaining the shape of the internal electrode after etching, FIG. 11 is a schematic enlarged sectional view showing the voids created by etching, and FIG. FIG. 13 is a perspective view of a multilayer capacitor according to an embodiment, FIG. 13 is a cross-sectional view of a state in which a gap is filled with a sealing material, and FIG. 14 is a cross-sectional view for explaining an example of etching. In the figure, 11.12 Ceramic green sheets as mother dielectric layers, lla, llb, 12a, 12b are edges, llc, lid, 12c, 12d are side edges, 13.
13a to 13c, 14.14a to 14c are internal electrode materials,
17.19 is the mother ceramic green sheet, 18a, 1
8b, 20a. 20b is a thick internal electrode material, 25 is a sintered body, and 25a. 25b is the first. The second side surface, 25c and 25d are third and fourth side surfaces, 26a and 26b are resist materials, 34.35 is a side margin region, 34a and 35a are voids, and 36.degree. and 37 are external electrodes.

Claims (3)

[Claims] (1) It has a laminated dielectric in which a plurality of dielectric layers are laminated with internal electrodes interposed between them, and the width of the internal electrodes is narrower than that of the dielectric layers. In a multilayer capacitor in which a side margin region is provided on the side, the side margin region is on a side surface of a multilayer dielectric in which a side edge of an internal electrode having the same width as the dielectric layer is exposed, A multilayer capacitor characterized in that it is formed by etching or physically removing exposed side edge portions of internal electrodes. (2) A plurality of dielectric layers are stacked with internal electrodes interposed between them, and the width of the internal electrodes is narrower than that of the dielectric layers, thereby creating side margin regions on the sides of the internal electrodes. A method for manufacturing a multilayer capacitor provided with a multilayer capacitor, wherein a plurality of dielectric layers are stacked with internal electrodes interposed therebetween, and the width of the internal electrodes is the same as the width of the dielectric layers. and by etching or physically removing the exposed side edge portions of the internal electrodes on the side surfaces of the laminated dielectric where the side edges of the internal electrodes are exposed. , forming a side margin region on the side of the internal electrode,
Method of manufacturing multilayer capacitors. (3) a step of forming a plurality of internal electrode materials on one main surface of a rectangular parent dielectric sheet at predetermined distances so as to extend between opposing edges of the parent dielectric sheet; , the step of laminating the mother dielectric sheets on which the mother internal electrode material is formed to obtain a laminated mother dielectric, and cutting the laminated mother dielectric in the lamination direction, according to claim 2. characterized by comprising a step of obtaining a laminated dielectric material of
Method of manufacturing multilayer capacitors.