JPH0381694U - - Google Patents
Info
- Publication number
- JPH0381694U JPH0381694U JP14234889U JP14234889U JPH0381694U JP H0381694 U JPH0381694 U JP H0381694U JP 14234889 U JP14234889 U JP 14234889U JP 14234889 U JP14234889 U JP 14234889U JP H0381694 U JPH0381694 U JP H0381694U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- board
- power
- supported
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14234889U JPH0381694U (hr) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14234889U JPH0381694U (hr) | 1989-12-08 | 1989-12-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0381694U true JPH0381694U (hr) | 1991-08-21 |
Family
ID=31689180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14234889U Pending JPH0381694U (hr) | 1989-12-08 | 1989-12-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0381694U (hr) |
-
1989
- 1989-12-08 JP JP14234889U patent/JPH0381694U/ja active Pending
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