JPH0381677U - - Google Patents
Info
- Publication number
- JPH0381677U JPH0381677U JP14391189U JP14391189U JPH0381677U JP H0381677 U JPH0381677 U JP H0381677U JP 14391189 U JP14391189 U JP 14391189U JP 14391189 U JP14391189 U JP 14391189U JP H0381677 U JPH0381677 U JP H0381677U
- Authority
- JP
- Japan
- Prior art keywords
- board
- land
- center
- insertion hole
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Housings And Mounting Of Transformers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す基板の底面図
、第２図はトランスを組付けた側面図、第３図は
基板の裏面側斜視図、第４図は第１図の切断面線
−から見た断面図、第５図〜第８図は従来技
術を示し、第５図は基板の底面図、第６図はトラ
ンスを組付けた側面図、第７図は基板の裏面側斜
視図、第８図は第５図の切断面線−から見た
断面図、第９図はトランスを組付けた第２従来技
術の側面図である。
１……導体、２……挿通孔、３……ランド、４
……半田、５……ソルダレジスト、１０……配線
基板、１１……菊花形空間部、１４……突出部。
Fig. 1 is a bottom view of a board showing an embodiment of the present invention, Fig. 2 is a side view with a transformer assembled, Fig. 3 is a perspective view of the back side of the board, and Fig. 4 is a cross section of Fig. 1. 5 to 8 show the prior art, FIG. 5 is a bottom view of the board, FIG. 6 is a side view with the transformer assembled, and FIG. 7 is the back side of the board. A perspective view, FIG. 8 is a sectional view taken along the cutting plane line - in FIG. 5, and FIG. 9 is a side view of the second prior art in which a transformer is assembled. 1...Conductor, 2...Through hole, 3...Land, 4
...Solder, 5...Solder resist, 10...Wiring board, 11...Chrysanthemum-shaped space, 14...Protrusion.
Claims (1)
して取付けられるよう挿通孔が形成され、この基
板の一方面には、前記挿通孔に対応する基体のラ
ンド中心部に向けて突出する導体の複数の突出部
が、前記ランド中心部に対し、周方向へ間隔をあ
けて形成されていることを特徴とする配線基板の
ランドの構造。 An insertion hole is formed in the electrically insulating board so that the lead wire of the electronic component can be inserted and attached to the board, and one side of the board has a conductor that protrudes toward the center of the land of the base corresponding to the insertion hole. A structure of a land of a wiring board, characterized in that a plurality of protrusions are formed at intervals in the circumferential direction with respect to the center of the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14391189U JPH0381677U (en) | 1989-12-12 | 1989-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14391189U JPH0381677U (en) | 1989-12-12 | 1989-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381677U true JPH0381677U (en) | 1991-08-21 |
Family
ID=31690661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14391189U Pending JPH0381677U (en) | 1989-12-12 | 1989-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381677U (en) |
-
1989
- 1989-12-12 JP JP14391189U patent/JPH0381677U/ja active Pending
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