JPH0381653U - - Google Patents
Info
- Publication number
- JPH0381653U JPH0381653U JP1989142391U JP14239189U JPH0381653U JP H0381653 U JPH0381653 U JP H0381653U JP 1989142391 U JP1989142391 U JP 1989142391U JP 14239189 U JP14239189 U JP 14239189U JP H0381653 U JPH0381653 U JP H0381653U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- layer
- diode chip
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142391U JPH0381653U (US06346242-20020212-C00066.png) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142391U JPH0381653U (US06346242-20020212-C00066.png) | 1989-12-08 | 1989-12-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0381653U true JPH0381653U (US06346242-20020212-C00066.png) | 1991-08-21 |
Family
ID=31689221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989142391U Pending JPH0381653U (US06346242-20020212-C00066.png) | 1989-12-08 | 1989-12-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0381653U (US06346242-20020212-C00066.png) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09116194A (ja) * | 1995-10-17 | 1997-05-02 | Alps Electric Co Ltd | 発光ダイオード装置 |
JP2000058925A (ja) * | 1998-08-12 | 2000-02-25 | Stanley Electric Co Ltd | Ledランプ |
JP2000068562A (ja) * | 1998-08-21 | 2000-03-03 | Stanley Electric Co Ltd | Ledランプ |
JP2002221658A (ja) * | 2001-01-26 | 2002-08-09 | Rabo Sufia Kk | バルク型レンズ、発光体、受光体、照明器具、光情報通信システム及びバルク型レンズの製造方法 |
JP2002223636A (ja) * | 2001-01-29 | 2002-08-13 | Rabo Sufia Kk | バルク型レンズを用いた植物栽培装置 |
JP2003069081A (ja) * | 2001-08-22 | 2003-03-07 | Okaya Electric Ind Co Ltd | 発光素子及びその製造方法 |
WO2007080742A1 (ja) * | 2006-01-16 | 2007-07-19 | Towa Corporation | 光素子の樹脂封止成形方法 |
JP2007310419A (ja) * | 2007-08-06 | 2007-11-29 | Rabo Sufia Kk | バルク型レンズ、発光体、受光体、照明器具及びバルク型レンズの製造方法 |
JP2009117375A (ja) * | 2009-01-13 | 2009-05-28 | Rabo Sufia Kk | 室内照明装置 |
-
1989
- 1989-12-08 JP JP1989142391U patent/JPH0381653U/ja active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09116194A (ja) * | 1995-10-17 | 1997-05-02 | Alps Electric Co Ltd | 発光ダイオード装置 |
JP2000058925A (ja) * | 1998-08-12 | 2000-02-25 | Stanley Electric Co Ltd | Ledランプ |
JP2000068562A (ja) * | 1998-08-21 | 2000-03-03 | Stanley Electric Co Ltd | Ledランプ |
JP2002221658A (ja) * | 2001-01-26 | 2002-08-09 | Rabo Sufia Kk | バルク型レンズ、発光体、受光体、照明器具、光情報通信システム及びバルク型レンズの製造方法 |
JP2002223636A (ja) * | 2001-01-29 | 2002-08-13 | Rabo Sufia Kk | バルク型レンズを用いた植物栽培装置 |
JP2003069081A (ja) * | 2001-08-22 | 2003-03-07 | Okaya Electric Ind Co Ltd | 発光素子及びその製造方法 |
WO2007080742A1 (ja) * | 2006-01-16 | 2007-07-19 | Towa Corporation | 光素子の樹脂封止成形方法 |
JP2007189116A (ja) * | 2006-01-16 | 2007-07-26 | Towa Corp | 光素子の樹脂封止成形方法 |
JP2007310419A (ja) * | 2007-08-06 | 2007-11-29 | Rabo Sufia Kk | バルク型レンズ、発光体、受光体、照明器具及びバルク型レンズの製造方法 |
JP2009117375A (ja) * | 2009-01-13 | 2009-05-28 | Rabo Sufia Kk | 室内照明装置 |