JPH0381149B2 - - Google Patents

Info

Publication number
JPH0381149B2
JPH0381149B2 JP61112735A JP11273586A JPH0381149B2 JP H0381149 B2 JPH0381149 B2 JP H0381149B2 JP 61112735 A JP61112735 A JP 61112735A JP 11273586 A JP11273586 A JP 11273586A JP H0381149 B2 JPH0381149 B2 JP H0381149B2
Authority
JP
Japan
Prior art keywords
base material
metal thin
thin film
led chip
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61112735A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62269984A (ja
Inventor
Fumio Morikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIMURA ELECTRIC
Original Assignee
KIMURA ELECTRIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIMURA ELECTRIC filed Critical KIMURA ELECTRIC
Priority to JP61112735A priority Critical patent/JPS62269984A/ja
Publication of JPS62269984A publication Critical patent/JPS62269984A/ja
Publication of JPH0381149B2 publication Critical patent/JPH0381149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
JP61112735A 1986-05-19 1986-05-19 薄形平面表示装置 Granted JPS62269984A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61112735A JPS62269984A (ja) 1986-05-19 1986-05-19 薄形平面表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61112735A JPS62269984A (ja) 1986-05-19 1986-05-19 薄形平面表示装置

Publications (2)

Publication Number Publication Date
JPS62269984A JPS62269984A (ja) 1987-11-24
JPH0381149B2 true JPH0381149B2 (enrdf_load_stackoverflow) 1991-12-27

Family

ID=14594234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61112735A Granted JPS62269984A (ja) 1986-05-19 1986-05-19 薄形平面表示装置

Country Status (1)

Country Link
JP (1) JPS62269984A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113771U (enrdf_load_stackoverflow) * 1989-02-28 1990-09-12
JP2629985B2 (ja) * 1989-11-30 1997-07-16 岩崎電気株式会社 発光ダイオード
JP3185977B2 (ja) 1998-08-12 2001-07-11 スタンレー電気株式会社 Ｌｅｄランプ
JP2000068562A (ja) * 1998-08-21 2000-03-03 Stanley Electric Co Ltd Ｌｅｄランプ
JP2005142174A (ja) 2002-04-25 2005-06-02 Opto Device Kenkyusho:Kk 発光ダイオード及びその製造方法
WO2005020336A1 (ja) * 2003-08-25 2005-03-03 Tabuchi Electric Co., Ltd. 発光ダイオードの製造方法
CN101652601A (zh) * 2007-04-03 2010-02-17 皇家飞利浦电子股份有限公司 光输出设备

Also Published As

Publication number Publication date
JPS62269984A (ja) 1987-11-24

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