JPH0380858B2 - - Google Patents

Info

Publication number
JPH0380858B2
JPH0380858B2 JP62035325A JP3532587A JPH0380858B2 JP H0380858 B2 JPH0380858 B2 JP H0380858B2 JP 62035325 A JP62035325 A JP 62035325A JP 3532587 A JP3532587 A JP 3532587A JP H0380858 B2 JPH0380858 B2 JP H0380858B2
Authority
JP
Japan
Prior art keywords
alloy
relay
content
conductivity
thermal creep
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62035325A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63203738A (ja
Inventor
Takeshi Suzuki
Rensei Futatsuka
Seiji Kumagai
Manpei Kuwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP62035325A priority Critical patent/JPS63203738A/ja
Publication of JPS63203738A publication Critical patent/JPS63203738A/ja
Publication of JPH0380858B2 publication Critical patent/JPH0380858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Contacts (AREA)
  • Conductive Materials (AREA)
JP62035325A 1987-02-18 1987-02-18 Ｃｕ合金製電気機器用リレー材 Granted JPS63203738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62035325A JPS63203738A (ja) 1987-02-18 1987-02-18 Ｃｕ合金製電気機器用リレー材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62035325A JPS63203738A (ja) 1987-02-18 1987-02-18 Ｃｕ合金製電気機器用リレー材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3197088A Division JPH05247564A (ja) 1991-07-11 1991-07-11 Ｃｕ合金製電気機器用スイッチ材

Publications (2)

Publication Number Publication Date
JPS63203738A JPS63203738A (ja) 1988-08-23
JPH0380858B2 true JPH0380858B2 (enrdf_load_stackoverflow) 1991-12-26

Family

ID=12438665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62035325A Granted JPS63203738A (ja) 1987-02-18 1987-02-18 Ｃｕ合金製電気機器用リレー材

Country Status (1)

Country Link
JP (1) JPS63203738A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9587299B2 (en) 2011-10-28 2017-03-07 Mitsubishi Materials Corporation Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US10032536B2 (en) 2010-05-14 2018-07-24 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US10153063B2 (en) 2011-11-07 2018-12-11 Mitsubishi Materials Corporation Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
US10458003B2 (en) 2011-11-14 2019-10-29 Mitsubishi Materials Corporation Copper alloy and copper alloy forming material

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6452034A (en) * 1987-08-19 1989-02-28 Mitsubishi Electric Corp Copper alloy for terminal and connector
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP4563508B1 (ja) * 2010-02-24 2010-10-13 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP5054160B2 (ja) * 2010-06-28 2012-10-24 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324917B2 (enrdf_load_stackoverflow) * 1972-05-31 1978-07-24

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10032536B2 (en) 2010-05-14 2018-07-24 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US10056165B2 (en) 2010-05-14 2018-08-21 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US9587299B2 (en) 2011-10-28 2017-03-07 Mitsubishi Materials Corporation Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US10153063B2 (en) 2011-11-07 2018-12-11 Mitsubishi Materials Corporation Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
US10458003B2 (en) 2011-11-14 2019-10-29 Mitsubishi Materials Corporation Copper alloy and copper alloy forming material

Also Published As

Publication number Publication date
JPS63203738A (ja) 1988-08-23

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