JPH0380601A - Microwave converting circuit - Google Patents
Microwave converting circuitInfo
- Publication number
- JPH0380601A JPH0380601A JP1193269A JP19326989A JPH0380601A JP H0380601 A JPH0380601 A JP H0380601A JP 1193269 A JP1193269 A JP 1193269A JP 19326989 A JP19326989 A JP 19326989A JP H0380601 A JPH0380601 A JP H0380601A
- Authority
- JP
- Japan
- Prior art keywords
- line
- microstrip
- electric field
- ground conductor
- reflection characteristics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 abstract description 12
- 230000005684 electric field Effects 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 3
- 230000000644 propagated effect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 2
- 241000270295 Serpentes Species 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はマイクロ波用接続回路に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a microwave connection circuit.
従来、この種の回路としては第３図に示すものがあった
。同図において、１．２はマイクロ・ストリップ線路、
３−１．３−２は地導体、４−１４−２は誘電体基板、
５は接続ワイヤである。Conventionally, this type of circuit has been shown in FIG. In the same figure, 1.2 is a microstrip line,
3-1.3-2 is a ground conductor, 4-14-2 is a dielectric substrate,
5 is a connection wire.
次に動作について説明する。誘電体基板４−１上のマイ
クロ・ストリップ線路ｌから、基板厚みの違う誘電体基
板４−２上のマイクロ・ストリップ線路２へ高周波信号
を伝搬させる際、その接続にワイヤ５を使っている。こ
のワイヤ５のインダクタンスは２．５μｍφの金ワイヤ
の場合、約１ｎ）１７ ｍ ｍとなり、２本にしても約
０．５ｎＨ／ｍｍとなる。ワイヤのインピーダンスＺは
、ωを角周波数、ｆを周波数とすれば、
ｚ＝ｊωＬ＝ｊ２πｆＬ
となるため、高周波領域ではワイヤのインダクタンスは
無視できなくなっている。Next, the operation will be explained. When a high frequency signal is propagated from the microstrip line 1 on the dielectric substrate 4-1 to the microstrip line 2 on the dielectric substrate 4-2 having a different substrate thickness, the wire 5 is used for connection. The inductance of this wire 5 is approximately 1n) 17 mm in the case of a gold wire of 2.5 μmφ, and is approximately 0.5 nH/mm even if two wires are used. The impedance Z of the wire is as follows: z=jωL=j2πfL, where ω is the angular frequency and f is the frequency. Therefore, the inductance of the wire cannot be ignored in the high frequency region.
マイクロ・ストリップ線路１から高周波信号が入力した
場合、地導体３−１．３−２との間に電界が発生する。When a high frequency signal is input from the microstrip line 1, an electric field is generated between it and the ground conductor 3-1, 3-2.
このインピーダンスＺは５０Ωである。次に、Ｚ＝ｊ２
πｆＬなるインピーダンスを持ったワイヤを通過する際
、一部反射し、残りはマイクロ・ストリップ線路２に出
力される。This impedance Z is 50Ω. Next, Z=j2
When passing through a wire having an impedance of πfL, part of the light is reflected, and the rest is output to the microstrip line 2.
従来のマイクロ波変換回路は以上のように構成されてい
るので、高周波領域では接続部のインピーダンスが高く
なるので、インピーダンス整合のため、ワイヤの本数を
増やしたり、地導体を段違いにしたりする必要があった
。また、段違いにワイヤをボンディングする必要がある
などの問題があった。Conventional microwave conversion circuits are configured as described above, and as the impedance of the connection increases in the high frequency range, it is necessary to increase the number of wires or use different ground conductors for impedance matching. there were. Further, there were problems such as the need to bond wires at different levels.
本発明はこのような点に鑑みてなされたものであり、そ
の目的とするところは、接続点の反射特性が向上し、ワ
イヤボンディングの工程も減り、より高性能、高信頼性
のマイクロ波変換回路を得ることにある。The present invention was made in view of these points, and its purpose is to improve the reflection characteristics of the connection point, reduce the wire bonding process, and achieve higher performance and higher reliability microwave conversion. The purpose is to obtain the circuit.
このような目的を達成するために本発明は、階段状にし
たコプラナ線路により、高さの違う多層化されたマイク
ロ・ストリップ線路を接続するようにしたものである。In order to achieve such an object, the present invention connects multi-layered microstrip lines having different heights using a stepped coplanar line.
本発明によるマイクロ波変換回路においては、マイクロ
・ストリップ線路は反射特性の劣化なく接続される。In the microwave conversion circuit according to the present invention, the microstrip line can be connected without deteriorating the reflection characteristics.
以下、本発明の一実施例を図を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明によるマイクロ波変換回路の一実施例を
示す構成国である。同図において、１゜２はマイクロ・
ストリップ線路、３は地導体、４は誘電体基板、６はコ
プラナ線路、７−１．７２は接地パターンである。FIG. 1 shows the configuration of an embodiment of a microwave conversion circuit according to the present invention. In the same figure, 1°2 is micro
A strip line, 3 a ground conductor, 4 a dielectric substrate, 6 a coplanar line, and 7-1.72 a ground pattern.
次に動作について説明する。誘電体基板４上のマイクロ
・ストリップ線路１から、基板厚みの違う誘電体基板４
上のマイクロ・ストリップ線路２へ高周波信号を伝搬さ
せる際、まずインピーダンスＺ＝５０Ωのマイクロ・ス
トリップ線路１と地導体３との間に電界が立ち、次に接
続されたインピーダンスＺ＝５０Ω２、のコブラナ線路
６と接地パターン７−１．７−２との間に電界が立つ。Next, the operation will be explained. From the micro strip line 1 on the dielectric substrate 4 to the dielectric substrate 4 with different substrate thickness.
When propagating a high-frequency signal to the microstrip line 2 above, an electric field is first created between the microstrip line 1 with impedance Z = 50Ω and the ground conductor 3, and then an electric field is created between the microstrip line 1 with impedance Z = 50Ω and the ground conductor 3, and then the connected cobra antenna with impedance Z = 50Ω2 An electric field is created between the line 6 and the ground pattern 7-1, 7-2.
さらに、高周波信号はインピーダンスＺ＝ＳＯΩのマイ
クロ・ストリップ線路２と地導体３との間に電界が立ち
、出力される。Furthermore, an electric field is generated between the microstrip line 2 with impedance Z=SOΩ and the ground conductor 3, and the high frequency signal is output.
このように、階段状のコプラナ線路６により接続をパタ
ーン化でき、反射特性の劣化なしでマイクロ・ストリッ
プ線路１と２の接続が可能となる。In this way, the connection can be patterned using the stepped coplanar line 6, and the microstrip lines 1 and 2 can be connected without deteriorating the reflection characteristics.
なお、上記実施例では、コブラナ線路６の接地を地導体
３と接地パターン７−１ ７−２をつなげることにより
得たが、第２図（ａ）、 （ｂ）に示すように、ピアホ
ール（ＶＩＡホール）８．８−１〜８−４により得ても
よい。第２図において第１図と同一部分又は相当部分に
は同一符号が付しである。In the above embodiment, the grounding of the Cobrana line 6 was obtained by connecting the ground conductor 3 and the grounding patterns 7-1 to 7-2, but as shown in FIGS. VIA Hall) 8.8-1 to 8-4. In FIG. 2, the same or equivalent parts as in FIG. 1 are given the same reference numerals.
以上説明したように本発明は、階段状にしたコプラナ線
路により、高さの違う多層化されたマイクロ・ストリッ
プ線路を接続したことにより、接続ワイヤが不要となる
と共に反射特性の劣化を防止できるので、高周波特性が
良く、高信頼のマイクロ波変換回路が得られる効果があ
る。As explained above, the present invention connects multilayered microstrip lines of different heights using stepped coplanar lines, thereby eliminating the need for connection wires and preventing deterioration of reflection characteristics. This has the effect of providing a highly reliable microwave conversion circuit with good high frequency characteristics.
第１図は本発明によるマイクロ波変換回路の一実施例を
示す構成国、第２図は地導体と接地パターンの接続例を
示す説明図、第３図は従来のマイクロ波変換回路を示す
構成国である。
１．２・・・マイクロ・ストリップ線路、３・・・地導
体、４・・・誘電体基板、６・・・コブラナ線路、７−
１７−２・・・接地パターン。Fig. 1 shows the configuration of an embodiment of the microwave conversion circuit according to the present invention, Fig. 2 is an explanatory diagram showing an example of connection between a ground conductor and a ground pattern, and Fig. 3 shows the configuration of a conventional microwave conversion circuit. It is a country. 1.2...Micro strip line, 3...Ground conductor, 4...Dielectric substrate, 6...Cobrana line, 7-
17-2...Grounding pattern.
Claims (1)
されたマイクロ・ストリップ線路を接続したことを特徴
とするマイクロ波変換回路。A microwave conversion circuit characterized by connecting multi-layered micro-strip lines of different heights using a stepped coplanar line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193269A JPH0380601A (en) | 1989-07-26 | 1989-07-26 | Microwave converting circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193269A JPH0380601A (en) | 1989-07-26 | 1989-07-26 | Microwave converting circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0380601A true JPH0380601A (en) | 1991-04-05 |
Family
ID=16305130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1193269A Pending JPH0380601A (en) | 1989-07-26 | 1989-07-26 | Microwave converting circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0380601A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5561405A (en) * | 1995-06-05 | 1996-10-01 | Hughes Aircraft Company | Vertical grounded coplanar waveguide H-bend interconnection apparatus |
| JP2001148601A (en) * | 1999-11-19 | 2001-05-29 | Fujitsu General Ltd | High frequency circuit device |
| JP2001189609A (en) * | 1999-12-28 | 2001-07-10 | Mitsubishi Electric Corp | Microstrip line connector |
| EP1300905A2 (en) * | 2001-10-02 | 2003-04-09 | Sumitomo Electric Industries, Ltd. | Electronic component-mounting substrate and electronic components |
| JP2009124475A (en) * | 2007-11-15 | 2009-06-04 | Oki Electric Ind Co Ltd | Impedance matching circuit |
| JP2014107398A (en) * | 2012-11-27 | 2014-06-09 | Mitsubishi Electric Corp | High-frequency device |
| WO2024166888A1 (en) * | 2023-02-08 | 2024-08-15 | 住友電工プリントサーキット株式会社 | Printed wiring board |
-
1989
- 1989-07-26 JP JP1193269A patent/JPH0380601A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5561405A (en) * | 1995-06-05 | 1996-10-01 | Hughes Aircraft Company | Vertical grounded coplanar waveguide H-bend interconnection apparatus |
| JP2001148601A (en) * | 1999-11-19 | 2001-05-29 | Fujitsu General Ltd | High frequency circuit device |
| JP2001189609A (en) * | 1999-12-28 | 2001-07-10 | Mitsubishi Electric Corp | Microstrip line connector |
| EP1300905A2 (en) * | 2001-10-02 | 2003-04-09 | Sumitomo Electric Industries, Ltd. | Electronic component-mounting substrate and electronic components |
| EP1300905A3 (en) * | 2001-10-02 | 2003-11-26 | Sumitomo Electric Industries, Ltd. | Electronic component-mounting substrate and electronic components |
| JP2009124475A (en) * | 2007-11-15 | 2009-06-04 | Oki Electric Ind Co Ltd | Impedance matching circuit |
| JP2014107398A (en) * | 2012-11-27 | 2014-06-09 | Mitsubishi Electric Corp | High-frequency device |
| WO2024166888A1 (en) * | 2023-02-08 | 2024-08-15 | 住友電工プリントサーキット株式会社 | Printed wiring board |
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