JP2000164766A - High-frequency wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency wiring board, which is capable of restraining a coplanar ground conductor which forms a coplanar line and a conductive bump connected to it from radiating electromagnetic waves and resonances from occurring in a gap and is provided with a connector, which is superior in transmission characteristics over a wide range of high frequency. SOLUTION: Microstrip line conductors 12 and a planar line conversion section composed of coplanar ground conductors 13 formed near both sides of the tip of the line conductor 12 and a through conductor 14 which connects the grounding conductors 13 to a lower grounding conductor are provided on the top surface of a dielectric board 11 has a lower ground conductor for the formation of a high-frequency wiring board, where a high-frequency electronic component equipped with a signal terminal electrode and a grounding terminal electrode on its underside is mounted on the coplanar line conversion section and are connected electrically. The shortest distance between the periphery of a sectional part of the through conductor 14 connected to the coplanar ground conductor 13, and the periphery of the coplanar ground conductor 13 is set 1/4 or less the wavelength of high-frequency signals. Resonances are restrained from occurring, so that a high-frequency wiring board satisfactory in transmission characteristics can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency wiring board for flip-chip mounting high-frequency electronic components such as semiconductor devices such as high-frequency ICs via a microstrip line / coplanar line converter. The present invention relates to a high-frequency wiring board with improved transmission characteristics of a high-frequency signal at a connection part by a coplanar line converter.

[0002]

2. Description of the Related Art Conventionally, a wire bonding technology has been used to connect an electronic component such as a high-frequency semiconductor element operated in a high-frequency band such as a microwave band or a millimeter-wave band and a high-frequency wiring board as a carrier substrate or an external circuit. In recent years, the application of the flip-chip mounting technology has been advanced also in connection in a high frequency band, and various connection structures and connection methods have been proposed accordingly.

In both of these high-frequency electronic components and high-frequency wiring boards, the main transmission line for high-frequency signals is a microstrip line. On the other hand, high-frequency electronic components are usually required to be evaluated and inspected by a wafer probe having a coplanar structure.
It has an input / output unit having a coplanar structure composed of one signal terminal electrode sandwiched between two ground terminal electrodes.

In such a coplanar structure, the width of the signal terminal electrode and the gap between the ground terminal electrode and the signal terminal electrode match the impedance according to the substrate structure and substrate material of the high-frequency electronic component. Is set to The ground terminal electrode is electrically connected to a ground plane (ground conductor) formed on the back surface of the high-frequency electronic component through a through-hole conductor or a via conductor that penetrates the substrate of the high-frequency electronic component. It is connected.

On the other hand, the high-frequency wiring board is physically and electrically connected to the input / output section of the coplanar line structure of the high-frequency electronic component by using conductive bumps as connection terminals for the high-frequency electronic component. Because we need to
The connection portion with the high-frequency electronic component has a similar coplanar structure, and has a conversion structure with a microstrip line as a transmission line.

FIG. 6 is a plan view showing an example of such a conventional high-frequency wiring board. In FIG. 6, reference numeral 1 denotes a dielectric substrate, which has a lower ground conductor (not shown) on the lower surface.
A rectangular area 1a surrounded by a dotted line in the drawing indicates an area where a high-frequency electronic component (not shown) is mounted. Reference numeral 2 denotes a microstrip line conductor, 3 denotes a coplanar ground conductor formed on both sides near the tip of the microstrip line conductor 2, and 4 denotes a through conductor that electrically connects the coplanar ground conductor 3 to a lower ground conductor. Thus, a microstrip line / coplanar line converter is formed at the tip of the microstrip line conductor 2, and the high-frequency electronic component is formed by the coplanar line formed by the tip of the microstrip line conductor 2 and the ground conductor 3 on the same plane. Connection is made.

[0007] Circles shown by dotted lines at the tips of the microstrip line conductor 2 and the same-plane ground conductor 3 indicate the connection positions of the conductive bumps.

FIG. 7 is a perspective view showing a state in which high-frequency electronic components are mounted on such a high-frequency wiring board. In FIG. 7 also, 1 is a dielectric substrate, 2 is a microstrip line conductor, Is a ground conductor on the same plane, 4 is a through conductor, and 5 is a high-frequency electronic component mounted on the mounting area 1a of the high-frequency wiring board and connected via conductive bumps.

In the coplanar line portion of such a high-frequency wiring board, the same-plane ground conductor 3 as the ground terminal electrode is also passed through the through-conductor 4 penetrating through the dielectric substrate 1 as in the case of the high-frequency electronic component. The width of the microstrip line conductor 2 which is electrically connected to a ground plane (lower ground conductor) formed on the back surface of the substrate 1 and is a signal terminal electrode, and the same plane ground conductor 3 as the microstrip line conductor 2 As for the size of the gap, it is necessary to guarantee the physical connection with the input / output section of the high-frequency electronic component by the conductive bump, so the design is made according to the coplanar structure in the input / output section of the high-frequency electronic component. I have.

[0010]

However, in such a conventional high-frequency wiring board, the dielectric substrate 1
Although a low-loss material such as alumina ceramics is usually used as a material for the substrate, gallium arsenide (GaAs) is used as a substrate material.
s) Compared with the high-frequency electronic component using the method described above, the grounding of the same-plane ground conductor 3 serving as the ground terminal electrode of the high-frequency wiring board is assured because the process for forming the electrode pattern and the manufacturing accuracy are significantly different. However, there is a problem that the through conductor 4 cannot be formed immediately below the high definition pattern of the ground terminal electrode provided at the tip of the ground conductor 3 on the same plane. For this purpose, the through conductor 4 is formed directly under the same-surface ground conductor 3 at a position distant from the ground terminal electrode, and the through conductor 4 is electrically connected to the pattern portion having a certain area on the surface of the dielectric substrate 1. Connected to the ground terminal, the grounding of the grounding terminal electrode is guaranteed.

However, in the connection between the same-plane ground conductor 3 and the through conductor 4, the surface of the dielectric substrate 1 is in the same plane around the portion where the same-plane ground conductor 3 is connected to the through conductor 4. The conductor pattern of the ground conductor 3 becomes overhanging, and depending on the shape and size of the conductor pattern, a magnetic field distribution that circulates around the conductor pattern may occur. Then, as a result, radiation of electromagnetic waves occurs from the grounding terminal electrode at the end of the same-plane grounding conductor 3 and the grounding bump connected thereto, and resonance occurs in the gap between the high-frequency wiring board and the high-frequency electronic component. There is a problem that the transmission characteristic of the high frequency signal deteriorates when it occurs.

The present invention has been made in view of the above-mentioned problems in the prior art, and has as its object to convert a high-frequency wiring board having a microstrip line / coplanar line conversion section as a connection section with a high-frequency electronic component. In the part, it is possible to suppress the radiation of electromagnetic waves from the coplanar line conductor forming the coplanar line and the conductive bumps connected to it and the resonance in the gap, and to provide a high frequency connection with good transmission characteristics over a wide band. It is to provide a wiring board.

[0013]

A high-frequency wiring board according to the present invention has a microstrip line conductor for transmitting a high-frequency signal on an upper surface of a dielectric substrate having a lower ground conductor on a lower surface, and the microstrip line conductor. A coplanar line converter formed of a coplanar ground conductor formed on both sides in the vicinity of the tip of the coaxial cable and a through conductor that electrically connects the coplanar ground conductor to the lower ground conductor. A high-frequency wiring board, on the lower surface of which a high-frequency electronic component having a signal terminal electrode corresponding to the microstrip line conductor and a ground terminal electrode corresponding to the same-plane ground conductor is mounted and electrically connected. So,
In the through conductor, the length of the shortest path between the outer circumference of the cross section of the portion connected to the same-plane ground conductor and the outer circumference of the same-plane ground conductor is not more than の of the wavelength of the high-frequency signal. It is characterized by the following.

According to the high-frequency wiring board of the present invention, the size of the through conductor connected to the same-plane ground conductor in the coplanar-line converter formed near the tip of the microstrip-line conductor is set to the same level as the same-plane ground conductor. By making the length of the shortest distance between the outer circumference of the cross section of the connected part, that is, the part in contact with the same-plane ground conductor, and the outer circumference of the same-plane ground conductor less than or equal to one-fourth of the wavelength of the high-frequency signal The area of a portion where there is no conductor directly below the same-plane ground conductor is limited to a predetermined size or less, and thereby, the distribution is made so as to go around that portion in a good same-plane ground conductor that protrudes around the through conductor. The magnetic field can be suppressed. Further, since the cross-sectional area of the through conductor is relatively large with respect to the area of the ground conductor on the same plane, the grounding effect on the ground conductor on the same plane is also improved and a good ground state can be obtained. As a result, the radiation of electromagnetic waves from the same-surface ground conductor and the connected grounding bumps is suppressed, and no resonance occurs in the gap between the high-frequency wiring board and the high-frequency electronic components. It becomes a high-frequency wiring board having signal transmission characteristics.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing an example of an embodiment of a high-frequency wiring board according to the present invention. In FIG. 1, reference numeral 11 denotes a dielectric substrate having a lower ground conductor (not shown) on a lower surface, and a rectangular area 11a surrounded by a dotted line on the upper surface is provided with a high-frequency electronic component (not shown). The area is shown. Reference numeral 12 denotes a microstrip line conductor for transmitting a high-frequency signal, 13 denotes a coplanar ground conductor formed on both sides near the tip of the microstrip line conductor 12, and 14 denotes a coplanar ground conductor 13 electrically connected to a lower ground conductor. It is a through conductor to be connected. As a result, a microstrip line / coplanar line converter is formed at the tip of the microstrip line conductor 12, and the coplanar line formed by the tip of the microstrip line conductor 12 and the ground conductor 13 on the same plane forms the microstrip line / coplanar line converter. The connection to the high-frequency electronic component mounted on the mounting portion 11a is performed via conductive bumps (indicated by dotted circles in the figure) connected to the signal terminal electrode and the ground terminal electrode at the tip, respectively. .

In this example, in the microstrip line / coplanar line converter, the shape of the ground conductor 13 on the same plane is set so that the portion of the ground terminal electrode does not protrude.
The cross section of the through conductor 14 provided below the same plane ground conductor 13 is formed into an oval shape having a longitudinal direction, and the through conductor
The structure is such that the structure 14 is closer to the microstrip line conductor 12 as the transmission line as it approaches the connection part for flip-chip mounting the high-frequency electronic component, so that the through conductor 14 in the portion connected to the same plane ground conductor 13 is formed. Is made close to the conductor pattern shape of the ground conductor 13 on the same plane. Thereby, the length of the shortest distance between the outer circumference of the cross section of the through conductor 14 connected to the same-plane ground conductor 13 and the outer circumference of the same-plane ground conductor 13 is set to 以下 or less of the wavelength of the high-frequency signal. . As a result, it is possible to reduce the area of a portion where there is no conductor (through conductor 14) immediately below the same-plane ground conductor 13, and it is possible to suppress the generation of a magnetic field distributed so as to go around the same-plane ground conductor 13. You can do it.

Further, since the cross-sectional area of the through conductor 14 is relatively large with respect to the area of the coplanar ground conductor 14, the grounding effect itself with respect to the coplanar ground conductor 13 can be improved.

As a result, radiation of electromagnetic waves does not occur from the same-surface ground conductor 13 constituting the ground terminal electrode or the ground bumps connected thereto, and the gap between the high-frequency wiring board and the high-frequency electronic component is eliminated. Since the resonance does not occur in the portion, the high-frequency wiring having good high-frequency signal transmission characteristics over a wide band as compared with the conventional high-frequency wiring board in which the transmission characteristics are deteriorated due to the resonance. It becomes a substrate.

In the high-frequency wiring board of the present invention, the shortest distance between the outer periphery of the cross section of the through conductor 14 at the portion connected to the same-plane ground conductor 13 and the outer periphery of the same-plane ground conductor 13 is 4 times the wavelength of the high-frequency signal. It is important that it be less than one-tenth. As a result, generation of a magnetic field distributed so as to surround the same-plane ground conductor 13 can be effectively suppressed, and generation of resonance can be prevented. It is more preferable that the shortest distance is set as short as possible within a range equal to or less than a quarter of the wavelength of the high frequency signal from the viewpoint of effectively suppressing the generation of the magnetic field.

In this example, two microstrip line / coplanar line converters, which are connection portions, are formed so as to face opposite ends of a high-frequency electronic component. The present invention is not limited to this, and may be formed by shifting the respective positions, may be formed as having different shapes and dimensions, or may be formed at only one location corresponding to the high-frequency electronic component. Good.

The dielectric substrate 11, the microstrip line conductor 12, the ground conductor 13 on the same plane, and the through conductor 14 may be made of the same material as the conventional high-frequency wiring substrate.

The high-frequency wiring board of the present invention has the following features.
The high-frequency signal transmitted thereby is particularly suitable for a high-frequency signal whose frequency is 10 GHz or more.

Above all, for a high-frequency signal having a frequency of 60 GHz or more, good and flat transmission characteristics can be obtained while suppressing reflection loss at the connection portion, which is particularly preferable.

Next, FIG. 2 shows another embodiment of the high-frequency wiring board according to the present invention in a plan view similar to FIG. In FIG. 2, reference numeral 21 denotes a dielectric substrate having a lower ground conductor (not shown) on the lower surface, and a rectangular area 21a surrounded by a dotted line on the upper surface is provided with a high-frequency electronic component (not shown). The area is shown. 22 is a microstrip line conductor, 23 is a coplanar ground conductor formed on both sides near the tip of the microstrip line conductor 22, 24 is a coplanar ground conductor 23
Are electrically connected to the lower ground conductor. Thus, a microstrip line / coplanar line converter is formed at the tip of the microstrip line conductor 22, and the conductive bumps respectively connected to the signal terminal electrode and the ground terminal electrode at the tip of the coplanar line portion. The connection with the high-frequency electronic component mounted on the mounting portion 21a is made via a (shown by a dotted circle in the figure).

In this example, in the microstrip line / coplanar line converter, the shape of the ground conductor 23 is the same as that of the conventional ground conductor 3 shown in FIG. The cross section of the through conductor 24 provided below the same plane ground conductor 23 has a so-called water drop shape having a longitudinal direction along the pattern shape of the same plane ground conductor 13, and the through conductor 24 By adopting a structure that approaches the microstrip line conductor 22 as it approaches the connection part of the component, the cross-sectional shape of the through conductor 24 at the part connected to the same-plane ground conductor 23 is changed to the conductor pattern shape of the same-plane ground conductor 23. Get closer
The length of the shortest distance between the outer circumference of the cross section of the through conductor 24 connected to the same-plane ground conductor 23 and the outer circumference of the same-plane ground conductor 23 is set to 以下 or less of the wavelength of the high-frequency signal.

The same-plane ground conductor 23 and the through conductor 24 can also reduce the area of a portion where there is no conductor (through-conductor 24) immediately below the same-plane ground conductor 24. Can be suppressed, and the cross-sectional area of the through conductor 24 is relatively large with respect to the area of the ground conductor 24 on the same plane. The effect itself can be improved. As a result, radiation of electromagnetic waves does not occur from the same-surface ground conductor 23 or the ground bumps connected thereto, and resonance does not occur in the gap between the high-frequency wiring board and the high-frequency electronic component.
A high-frequency wiring board having good high-frequency signal transmission characteristics over a wide band.

As shown in these examples, the shape, dimensions, positional relationship, etc., between the same-plane ground conductor and the through conductor in the high-frequency wiring board of the present invention depend on the through conductor in the portion connected to the same-plane ground conductor. If the shortest distance between the outer circumference of the cross section and the outer circumference of the same plane ground conductor is less than or equal to one-fourth of the wavelength of the high-frequency signal, various shapes and dimensions are used in the specifications and shapes of the high-frequency electronic components to be connected. -It may be set in a positional relationship or the like.

[0029]

Next, a specific example of the high-frequency wiring board of the present invention will be described.

Example 1 A high-frequency wiring board of the present invention having the structure shown in FIG. 1 was manufactured as follows.

A 5 μm-thick lower grounding conductor made of Ti / Pd / Au is formed on almost the entire lower surface of a dielectric substrate 11 made of 0.2 mm-thick alumina ceramics (relative permittivity ε _r = 9.6). As an input / output transmission line, Ti
A signal microstrip line conductor 12 of / Pd / Au having a thickness of 5 μm and a width of 0.2 mm was formed.

The microstrip line conductor 12
The line conductor width was linearly changed to 0.08 mm by a tapered line having a length of 0.4 mm at the tip of the, and a signal terminal electrode having a rectangular shape of 0.08 mm x 0.08 mm was formed ahead of the line conductor width. On both sides near the tip of such a microstrip line conductor 12, a thickness 5 of Ti / Pd / Au is formed.
A coplanar line converter using a μm taper line as a signal conductor was formed. 0.4 mm ×
0.4 mm in diameter on each of two opposing sides of a 0.4 mm rectangle
An elliptical conductor pattern was formed in which a semicircle of m was integrally formed. Also, the dielectric substrate 11 immediately below the same plane ground conductor 13
A via conductor as a through conductor 14 made of Ti / Pd / Au is formed therein, and its cross-sectional shape is 0.2 mm × 0.2 m.
An oval shape having a shape similar to that of the same-surface ground conductor 13 is formed by integrally forming a semicircle having a diameter of 0.2 mm on each of two opposing sides of a rectangular shape of m. And arranged so as to be substantially parallel.

Further, at the tip of the ground conductor 13 on the same plane,
As a mounting terminal electrode for mounting, a distance of 0.07 mm from the tip of each microstrip line conductor 12,
A conductor pattern consisting of a rectangle of 0.08 mm × 0.08 mm was integrally formed. Thus, a sample A of the high-frequency wiring board of the present invention was obtained.

On the other hand, in the same manner as described above, a similar coplanar line conversion part is provided, and as shown in FIG. A sample B of a conventional high-frequency wiring board as a comparative example having a circular shape having a diameter of 0.2 mm, connected so as to form a concentric circle, and having a similar grounding required terminal electrode connected to the tip thereof. Obtained.

For these samples A and B, a coplanar line structure having a signal line conductor having a width of 0.1 mm on the lower surface of a dielectric substrate having a substrate thickness of 0.1 mm and the same material composition as described above was used. A high-frequency electronic component with a connection part and an upper ground conductor formed on the upper surface is 60 μm in diameter.
-Connection was made by flip chip mounting via conductive bumps having a height of 15 μm.

Then, the input / output terminals (microstrip lines) of the dielectric substrate were connected to a network analyzer, and the reflection loss S ₁₁ and the transmission loss S ₂₁ for the high-frequency signal were determined for each sample. 3 and 4 show the results.
Shown in

FIG. 3 is a diagram showing the reflection characteristics of the flip-chip mounting portion of each high-frequency wiring board. The horizontal axis represents the frequency (unit: GHz), and the vertical axis represents the reflection loss S ₁₁ (unit: dB). ) represents a solid line of the characteristic curve the frequency characteristic of return loss S ₁₁ of the sample a, the broken line indicates that of sample B. As is clear from FIG. 3, in the sample B as the comparative example, the reflection loss (reflection coefficient) sharply increases in the vicinity of over 50 GHz. However, in the sample A as the embodiment of the present invention, it is illustrated. Good characteristics are obtained with a reflection loss of -15 dB or less in the frequency range.

On the other hand, FIG. 4 is a diagram showing the transmission characteristics of the flip-chip mounting portion of each high-frequency wiring board. The horizontal axis represents frequency (unit: GHz), and the vertical axis represents transmission loss S ₂₁ (unit: represents dB), the solid line of the characteristic curve the frequency characteristic of reflection loss S ₂₁ of the sample a, the dashed lines sample B
Shows it. As is clear from FIG. 4, the transmission loss (transmission loss) of sample B, which is a comparative example, sharply increases from around 50 GHz, but the sample A, which is an example of the present invention, has good flatness over a wide band. Transmission characteristics are obtained.

Example 2 In the same manner as in Example 1, a high-frequency wiring board of the present invention having the structure shown in FIG. 2 was produced. Here, the same-surface ground conductor 23 is shaped so as to smoothly connect between the position where the through conductor 24 is provided and the mounting ground terminal electrode set corresponding to the terminal electrode of the high-frequency electronic component. Thus, a conductor pattern having a so-called water droplet shape was obtained. Also, at the tip, as a grounding terminal electrode for mounting, at a distance of 0.07 mm from the tip of the microstrip line conductor 22, respectively, 0.08 mm × 0.08 mm
The conductor pattern consisting of the rectangle was integrally formed. The cross-sectional shape of the via conductor formed as the through conductor 24 is
As a waterdrop-like shape almost similar to the same plane ground conductor 23,
It was arranged so that its outer periphery was substantially parallel to the outer periphery of the same-surface ground conductor 13. Thus, a sample C of the high-frequency wiring board of the present invention was obtained.

The transmission loss S ₂₁ of this sample C was determined in the same manner as in [Example 1]. The result is shown in FIG.

FIG. 5 is a diagram showing the transmission characteristics of the flip-chip mounting portion of the sample C. The horizontal axis represents the frequency (unit: GHz), and the vertical axis represents the transmission loss S ₂₁ (unit: dB). the curve shows the frequency characteristic of transmission loss S _21. As can be seen from FIG. 5, sample C has good and flat transmission characteristics over a wide band.

The reflection characteristics of Sample C were good, with a small reflection loss, similar to Sample A in [Example 1].

As a result, it was confirmed that according to the high-frequency wiring board of the present invention, a high-frequency wiring board having a small reflection loss and good and flat transmission characteristics over a wide band can be obtained.

It should be noted that the present invention is not limited to the above-described embodiments, and various changes and improvements may be made without departing from the scope of the present invention.
For example, the same effect can be obtained as long as the shape of the ground conductor and the cross-sectional shape of the through conductor are polygons or closed curves having a longitudinal shape within a range that can be manufactured.

[0045]

As described above, according to the high-frequency wiring board of the present invention, the coplanar line conversion section as a connection section formed near the tip of the microstrip line conductor is connected to the same plane ground conductor. The size of the through conductor
The length of the shortest distance between the outer circumference of the section connected to the same-plane ground conductor and the outer circumference of the same-plane ground conductor is set to be equal to or less than ４ of the wavelength of the high-frequency signal. The area of the part where there is no conductor directly below the conductor is limited to a predetermined size or less, thereby suppressing the magnetic field distributed around the part in the same plane ground conductor that protrudes around the through conductor. Can be. Further, since the cross-sectional area of the through conductor is relatively large with respect to the area of the ground conductor on the same plane, the grounding effect on the ground conductor on the same plane is also improved and a good ground state can be obtained. As a result, the radiation of electromagnetic waves from the same-surface ground conductor and the connected grounding bumps is suppressed, and resonance does not occur in the gap between the high-frequency wiring board and the high-frequency electronic components. It becomes a high-frequency wiring board having signal transmission characteristics.

As described above, according to the present invention, in the conversion section of the high-frequency wiring board having the microstrip line / coplanar line conversion section as the connection section with the high-frequency electronic component, the same plane ground conductor forming the coplanar line, The radiation of the electromagnetic waves from the conductive bumps connected thereto and the resonance in the gaps can be suppressed, and a high-frequency wiring board having a connection part with good transmission characteristics over a wide band can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of an embodiment of a high-frequency wiring board according to the present invention.

FIG. 2 is a plan view showing another example of the high-frequency wiring board according to the embodiment of the present invention;

FIG. 3 is a diagram showing reflection characteristics of a high-frequency wiring board.

FIG. 4 is a diagram showing transmission characteristics of a high-frequency wiring board.

FIG. 5 is a diagram showing transmission characteristics of a high-frequency wiring board.

FIG. 6 is a plan view showing an example of a conventional high-frequency wiring board.

FIG. 7 is a perspective view showing a state in which high-frequency electronic components are mounted on a high-frequency wiring board.

[Explanation of symbols]

 11, 21 ... Dielectric substrate 12, 22 ... Microstrip line conductor 13, 23 ... Coaxial ground conductor 14, 24 ... Through conductor

Claims (1)

[Claims] 1. A microstrip line conductor for transmitting a high-frequency signal on an upper surface of a dielectric substrate having a lower ground conductor on a lower surface, and a coplanar ground conductor formed on both sides near a tip of the microstrip line conductor. And a through conductor for electrically connecting the same plane ground conductor to the lower ground conductor. The coplanar line conversion section has a lower surface for signal corresponding to the microstrip line conductor. A high-frequency wiring board mounted with and electrically connected to a high-frequency electronic component including a terminal electrode and a ground terminal electrode corresponding to the same-plane ground conductor,
In the through conductor, the length of the shortest path between the outer circumference of the cross section of the portion connected to the same-plane ground conductor and the outer circumference of the same-plane ground conductor is not more than の of the wavelength of the high-frequency signal. A high frequency wiring board characterized by the above-mentioned.