JPH0379465U - - Google Patents
Info
- Publication number
- JPH0379465U JPH0379465U JP14041089U JP14041089U JPH0379465U JP H0379465 U JPH0379465 U JP H0379465U JP 14041089 U JP14041089 U JP 14041089U JP 14041089 U JP14041089 U JP 14041089U JP H0379465 U JPH0379465 U JP H0379465U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- reinforcing plate
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 230000002950 deficient Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14041089U JPH0379465U (tr) | 1989-12-04 | 1989-12-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14041089U JPH0379465U (tr) | 1989-12-04 | 1989-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0379465U true JPH0379465U (tr) | 1991-08-13 |
Family
ID=31687386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14041089U Pending JPH0379465U (tr) | 1989-12-04 | 1989-12-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0379465U (tr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015050111A1 (ja) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | 配線板組立体及びその製造方法 |
-
1989
- 1989-12-04 JP JP14041089U patent/JPH0379465U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015050111A1 (ja) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | 配線板組立体及びその製造方法 |
US10237971B2 (en) | 2013-10-01 | 2019-03-19 | Fujikura Ltd. | Wiring board assembly and method for producing same |