JPS6413155U - - Google Patents

Info

Publication number
JPS6413155U
JPS6413155U JP1987107185U JP10718587U JPS6413155U JP S6413155 U JPS6413155 U JP S6413155U JP 1987107185 U JP1987107185 U JP 1987107185U JP 10718587 U JP10718587 U JP 10718587U JP S6413155 U JPS6413155 U JP S6413155U
Authority
JP
Japan
Prior art keywords
bypass capacitor
built
package
lead frame
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987107185U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987107185U priority Critical patent/JPS6413155U/ja
Publication of JPS6413155U publication Critical patent/JPS6413155U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP1987107185U 1987-07-13 1987-07-13 Pending JPS6413155U (tr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987107185U JPS6413155U (tr) 1987-07-13 1987-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987107185U JPS6413155U (tr) 1987-07-13 1987-07-13

Publications (1)

Publication Number Publication Date
JPS6413155U true JPS6413155U (tr) 1989-01-24

Family

ID=31341369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987107185U Pending JPS6413155U (tr) 1987-07-13 1987-07-13

Country Status (1)

Country Link
JP (1) JPS6413155U (tr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11772879B2 (en) 2013-08-27 2023-10-03 Coledy Inc. Content receiving device, opening/closing mechanism, and container mechanism comprising the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11772879B2 (en) 2013-08-27 2023-10-03 Coledy Inc. Content receiving device, opening/closing mechanism, and container mechanism comprising the same

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